认识Mask以及其制作流程.ppt

1、TMThis document is strictly confidential and proprietary of SMIC.It must not be copied or used for anypurpose other than for reference only,and SMIC shall not be liable or responsible for any reliance.认识认识Mask以及简要以及简要的制作流程的制作流程TMTMThis document is strictly confidential and proprietary of SMIC.It mus

2、t not be copied or used for anypurpose other than for reference only,and SMIC shall not be liable or responsible for any reliance.The Role of Mask in IC Industry DESIGNMASKWAFERTESTINGASSEMBLYTMThis document is strictly confidential and proprietary of SMIC.It must not be copied or used for anypurpos

3、e other than for reference only,and SMIC shall not be liable or responsible for any reliance.How Does Mask Work in Wafer FAB -StepperTMThis document is strictly confidential and proprietary of SMIC.It must not be copied or used for anypurpose other than for reference only,and SMIC shall not be liabl

4、e or responsible for any reliance.How Does Mask Work in Wafer FAB -ScannerTMThis document is strictly confidential and proprietary of SMIC.It must not be copied or used for anypurpose other than for reference only,and SMIC shall not be liable or responsible for any reliance.Raw Material of Mask Blan

5、kBIM(binary mask)PSM(phase shift mask)A.KRF-PSM B.ARF-PSMTMThis document is strictly confidential and proprietary of SMIC.It must not be copied or used for anypurpose other than for reference only,and SMIC shall not be liable or responsible for any reliance.Size of Blank 5inch 90mil(5009)5inch 180mi

6、l(5018)6inch 120mil(6012)6inch 250mil(6025)7inch 250mil(7015)What kind of mask SMIC FABs use?TMThis document is strictly confidential and proprietary of SMIC.It must not be copied or used for anypurpose other than for reference only,and SMIC shall not be liable or responsible for any reliance.Blank

7、Component Binary BlankPSM BlankPhoto Resist(3K,4K,4650A)CrO&Chrome(1050A,700A)QuartzPhoto Resist(2K,3K,4KA)CrO&Chrome(1000,550A)QuartzMoSi FilmPhoto Resist Opaque Metal FilmSubstratePhoto ResistOpaque Metal Film Phase Shift Layer SubstrateTMThis document is strictly confidential and proprietary of S

8、MIC.It must not be copied or used for anypurpose other than for reference only,and SMIC shall not be liable or responsible for any reliance.Blank Qz Characteristic RigidityHeat Expansion(ppm/oC)MaterialSodaliteSilicon-BorideQuartzRigidity540657615MaterialSoda limeSilicon-BorideQuartzCoefficient9.43.

9、70.5TMThis document is strictly confidential and proprietary of SMIC.It must not be copied or used for anypurpose other than for reference only,and SMIC shall not be liable or responsible for any reliance.Blank Qz Characteristic Optics CharacterTransmission(%)200300400020406080100QuartzSilicon-Borid

10、eSoda LimeWave Length(nm)Thats why we choose Quartz as the substrate of blankTMThis document is strictly confidential and proprietary of SMIC.It must not be copied or used for anypurpose other than for reference only,and SMIC shall not be liable or responsible for any reliance.How to Transfer Design

11、 to Mask?WriterProcessMetrologyVis-InspectClean/MountAIMSRepair1st InspectThr-InspectSTARlightShippingDevelopStripEtchTMThis document is strictly confidential and proprietary of SMIC.It must not be copied or used for anypurpose other than for reference only,and SMIC shall not be liable or responsibl

12、e for any reliance.Front-end Process Blank configurationPhoto-resistCr filmQuartzExposurePhoto-resist developWet etchPhoto-resist stripAEIASIRe-Etch?AEI:After Etch CD measureASI:After Strip CD measureStep1Step2Step3Step4Step6Step5Step7TMThis document is strictly confidential and proprietary of SMIC.

13、It must not be copied or used for anypurpose other than for reference only,and SMIC shall not be liable or responsible for any reliance.Front-end Process Dry process ResistCrQzH+H+H+H+H+H+H+EBEBEBH+H+H+H+H+H+H+Exposure(EB1,EB2,EB3DUV,LB5,LB6)PEB(Post Exposure Bake)SFB2500,APB5500PAGAcid generationAc

14、id diffusionDeprotection reactionDevelopment(SFD2500,ASP5500)H+Dry Etch(Gen3,Gen4)AEI,Re-etchStrip,ASITMThis document is strictly confidential and proprietary of SMIC.It must not be copied or used for anypurpose other than for reference only,and SMIC shall not be liable or responsible for any relian

15、ce.Pellicle Component Pellicle MembraneMaterialWave LengthN.C.365nm(I-line)C.E.365,248nm(I-line,DUV)F.C.193nm(ArF)Frame(Aluminum Alloy)Adhesive TapePellicle Membrane(25 um)Pellicle FrameDouble SideAdhesive TapeCrGlassTMThis document is strictly confidential and proprietary of SMIC.It must not be cop

16、ied or used for anypurpose other than for reference only,and SMIC shall not be liable or responsible for any reliance.What Pellicle Do?Top ContaminantObject PlanePellicle FilmBottom ContaminantContaminant on Pattern PlaneLen SystemUnfocused Top Contaminant ImageUnfocused Bottom Contaminant ImageImag

17、e PlaneFocused Contaminant Image on WaferMask PatternWafer SurfaceLightTMThis document is strictly confidential and proprietary of SMIC.It must not be copied or used for anypurpose other than for reference only,and SMIC shall not be liable or responsible for any reliance.Particle Immunity Control Pa

18、rticle size(D)V.S.Minimum Stand-off(T)T=(4M/N.A.)DT=(4M/N.A.)DM-MagnificationN.A.-Numerical Aperture of the LensFor glass side particle,T=2.3mmD1T1T2D2TMThis document is strictly confidential and proprietary of SMIC.It must not be copied or used for anypurpose other than for reference only,and SMIC

19、shall not be liable or responsible for any reliance.Mask Quality Control C.D.DefectRegistrationTMThis document is strictly confidential and proprietary of SMIC.It must not be copied or used for anypurpose other than for reference only,and SMIC shall not be liable or responsible for any reliance.CD(c

20、ritical dimension)measurementTMThis document is strictly confidential and proprietary of SMIC.It must not be copied or used for anypurpose other than for reference only,and SMIC shall not be liable or responsible for any reliance.Defect TypeOpaque spotParticleProtrusionIntrusionContaminationPinholeM

21、issing ARGlass fractureBreakGlass seedBridgeSolvent spotHard DefectSoft DefectMiss SizeTMThis document is strictly confidential and proprietary of SMIC.It must not be copied or used for anypurpose other than for reference only,and SMIC shall not be liable or responsible for any reliance.How to Do Ma

22、sk Defect Inspect TMThis document is strictly confidential and proprietary of SMIC.It must not be copied or used for anypurpose other than for reference only,and SMIC shall not be liable or responsible for any reliance.Mask Layout Exemplification Normal S S+FiducialTest KeyTest LineMain PatternScrib

23、e LineGlobal MarkQA CellBarcodeMulti-Chip +FiducialTest KeyTest LineScribe LineGlobal MarkQA Cell+A ChipB ChipC ChipD Chip+TMThis document is strictly confidential and proprietary of SMIC.It must not be copied or used for anypurpose other than for reference only,and SMIC shall not be liable or respo

24、nsible for any reliance.The Principle of STARlight InspectThe Model in SMIC Mask Shop(SL3UV)can only detect pattern sideSTAR:Synchronous Trans.And ReflectedTMThis document is strictly confidential and proprietary of SMIC.It must not be copied or used for anypurpose other than for reference only,and

25、SMIC shall not be liable or responsible for any reliance.What is Registration TMThis document is strictly confidential and proprietary of SMIC.It must not be copied or used for anypurpose other than for reference only,and SMIC shall not be liable or responsible for any reliance.Registration Result E

26、xemplification Mask:6”,t=0.25”QuartzMeasurement Area:67.2*92.2mmArray:8*10Variation Quantity:nmMaxminX7.20.0Y22.00.2TMThis document is strictly confidential and proprietary of SMIC.It must not be copied or used for anypurpose other than for reference only,and SMIC shall not be liable or responsible

27、for any reliance.How Does OPC Work?comparisondesign/maskWith OPCwaferTMThis document is strictly confidential and proprietary of SMIC.It must not be copied or used for anypurpose other than for reference only,and SMIC shall not be liable or responsible for any reliance.OPC Pattern on Mask 0.64 um Li

28、ne Pattern0.25 um Serif for 0.6 um Contact0.57 Line Pattern0.27 um assistant bar for 0.72 um LineTMThis document is strictly confidential and proprietary of SMIC.It must not be copied or used for anypurpose other than for reference only,and SMIC shall not be liable or responsible for any reliance.Over-all flowCustomerFTPNote:Yellow box is activities customer involvedTape outMask Shop data CEJob ViewCEMask Shop data Mfg(next page)ShippingTooling informationCustomer approves JDVPIE approves JDV