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1、High Performance Polyimide / E-Glass Exceptional Thermal Performance Superior Reliability Tg Greater than 250oC Non-MDA polyimide No bromination that might reduce service temperatures, service life, or repairability Not blended - 85N is a pure polyimide Low Z direction expansion Toughened for improv
2、ed interlaminar bond, better drilling and routing characteristics Melt rheology close to FR-4 even at lower heatup rates Excellent yield on complicated multilayers MATERIALS FOR ELECTRONICS Polyimides have been increasingly selected for military and high end commercial PWB programs requiring high re
3、liability, serviceability under extremes of temperature, and the ability to be repaired in the field under adverse conditions. Polyimides high glass transition temperature (Tg) results in a product which has a low Z-direction coefficient of thermal expansion (CTE) and which permits higher aspect rat
4、io holes to be plated and processed through more thermally abusive conditions on thicker boards than any other commercially available material. Arlons 85N Series of Pure Polyimide laminates and prepregs produce multilayer PWBs with this outstanding thermal stability, low Z-direction expansion during
5、 solder reflow and the excellent field repairability expected of Arlon polyimides. Modified to be tougher than conventional polyimides, 85N Series products are less sensitive to drilling and routing variations. Manufactured under demanding SPC and Quality Control, Arlons 85N Polyimides are fully qua
6、lified to IPC-4101/41. Arlons 85N Polyimides contain no MDA or other potentially carcinogenic diamines. Arlon 85N Electronic Substrates PropertiesTest MethodValue Peel strength lb/in elev. temp. lbs./in. (Kg/m)IPC-TM-650 2.4.89.0 (160) Peel strength after process solutions lbs./in. (Kg/m)IPC-TM-650
7、2.4.86.8 (120) Tg (degrees C)IPC-TM-650 2.4.24 (TMA)260 CTE - Z axis (ppm/ oC) IPC-TM-650 2.4.24 (TMA)50 X,Y axis (ppm/ oC) IPC-TM-650 2.4.24 (TMA)16 Permitivity (1 MHz) -16 MIL LAMIPC-TM-650 2.5.5.34.39 Loss Tangent (1 MHz) -16 MIL LAMIPC-TM-650 2.5.5.30.008 FlammabilityUL94HB Volume Resistivity (m
8、egohm-cm)IPC-TM-650 2.5.17.1 Surface Resistivity (megohms)IPC-TM-650 2.5.17.1 Flexural Strength psi (Kg/m2)IPC-TM-650 2.4.470,000 (4.9 x 107) psi 250 oC (Kg/m2) IPC-TM-650 2.4.4.171,000 (5.0 x 107) Tensile Modulus psi x 106(Kg/m2)ASTM D-6383.2 Thermal Conductivity (W/mK)ASTM E-12250.3 Specific Gravi
9、ty (g/cm3)ASTM D-792 Method A1.7 Poissions Ratio0.2 Electrical Strength -10 MIL LAM v/mil (V/mm)IPC-TM-650 2.5.6.21230 (4.8 x 104) Water Absorption % -59 MIL LAMIPC-TM-650 2.6.2.10.20% Typical Properties: 85N Polyimide Laminate The information and data contained herein are believed reliable, but all
10、 recommendations or suggestions are made without guarantee. You should thoroughly and independently test materials for any planned applications and determine satisfactory performance before commercialization. Furthermore, no suggestion for use, or material supplied shall be construed as a recommenda
11、tion or inducement to violate any law or infringe any patent. MATERIALS FOR ELECTRONICS 0901-R2 Copyright 2000 Arlon Materials for Electronics Printed in U.S.A. Arlon is an ISO 9002 Registered Company Data provided herein is provided for reference purposes only and are not intended to be sales speci
12、fications. Determination of the suitability of any of these materials for a particular application is the sole responsibility of the user. Furthermore, no suggestion for use, or material supplied shall be construed as a recommendation or inducement to violate any law or infringe any patent. 85N Poly
13、imide Prepregs are offered on fiberglass fabric styles from 106 through 7628. The above table lists the standard styles. Others may be available by special order. GlassArlonIPC-4101Resin ContentSCALED FLOWSCALED FLOW Cloth StyleDesignationClassification(weight %)Hf(mils)H(mils) 106 85N0672P41 E0106
14、RC SC 0072 31.7 0.30.75 0.20 108085N8063P41 E1080 RC SC 0063 32.4 0.30.75 0.20 231385N2355P41 E2313 RC SC 0055 33.4 0.30.75 0.20 211685N2650P41 E2116 RC SC 0050 34.1 0.30.75 0.20 762885N2840P41 E7628 RC SC 0040 36.6 0.30.70 0.20 Elev. Temp.3.0 x 108 Temp. + Humidity1.3 x 109 Elev. Temp.1.4 x 109 Tem
15、p. + Humidity6.9 x 107 Processing: Process inner-layers through develop, etch, and strip using standard industry practices. Use brown oxide on inner layers. Adjust dwell time in the oxide bath to ensure uniform coating. Bake inner layers in a rack for 60 minutes at 225o-250oF(107o-121C) immediately
16、prior to lay-up. Vacuum desiccate the prepreg for 8 - 12 hours prior to lamination. Lamination:Pre-Vaccuum for 30 - 45 minutes Product heat rise = 8 - 12oF(4-7C)/min. measured between 150oF and 250oF(65oC and 121oC). Full pressure:12 x 18 = 275 PSI (30cm x 45cm, 20 kg/cm2) 16 x 18 = 350 PSI (40cm x
17、45cm, 25.5 kg/cm2) 18 x 24 = 400 PSI (45cm x 61cm, 28 kg/cm2) Note: reduce pressure by 35 - 40% with vaccum assist lamination Product temperature at start of cure = 425oF (218C) Cure time at temperature = 1.5 - 2.0 hours (depending on stack height and amount of copper.) Cool down under pressure at 1
18、2oF(6C)/min. Drill at 400-500 SFM. Undercut bits are recommended for vias 0.018”(0.045cm) and smaller. De-smear using plasma appropriate for polyimide; plasma is preferred for positive etchback. Conventional plating processes are compatible with 85N. Standard profiling parameters may be used; chip b
19、reaker style router bits are not recommended. Bake for 1 -2 hours prior to solder reflow or HASL. 1100 Governor Lea Road, Bear, DE 19701 Telephone: (302) 834-2100, (800) 635-9333 Fax: (302) 834-2574 9433 Hyssop Drive, Rancho Cucamonga, CA 91730 Telephone: (909) 987-9533 Fax: (909) 987-8541 37 Rue Collange, 92300 LeVallois, Perret, France Telephone: (33) 1-427-02642 Fax: (33) 1-427-02798 44 Wilby Avenue, Little Lever, Bolton, Lancashire, BL31QE, U.K. Telephone: (44) 120-457-6068 Fax: (44) 120-479-6463 Website: E-mail: substratesarlon-