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1、CTP Process Introduction,A Display Company of the Foxconn Group,2009/8/15,Touch Panel Structure,Glass,TOP ITO Pad,TOP Metal,Touch panel,TOP SiO2,TOP Organic,Bottom ITO Pad,Bottom SiO2,DITO TP structure:,Glass,TOP ITO Pad,TOP Metal,Touch panel,TOP Organic,Bottom ITO Pad,Bottom SiO2,350C,350A / 350B,G
2、LASS,電容式TP for layer 特性,Touch Panel Process Flow,烘烤,Cleaner,Pre-Bake,Post-Bake,Developer,Exposure,b.ITO A,e.MET,c.ITO B,Metal Sputter,INC,ITO Sputter,a.ITS,d.MES,f.SIS,PDC,PDC,g.ORG,Cleaner,Slit-Coater,Pre-Bake,Develop,Exposure,Oven,PR coater,Cleaner,Pre-Bake,Post-Bake,Developer,Exposure,ITO Etching
3、,Stripper,PR coater,Cleaner,Pre-Bake,Post-Bake,Developer,Exposure,PR coater,Metal Etching,Stripper,Cleaner,Pre-Bake,Back Side PR,SiO2 Sputter (with metal mask),AOI / 4 point probe / cary300 / Ellipsometer / Adhesion test / Marco,AOI / contact angle,AOI / MCD / a-step(光阻厚度) / Marco,AOI / a-step(光阻 厚度
4、) / Marco,AOI / MCD / Resistance meter / Marco,AOI / MCD / a-step(光阻厚度) / Marco,AOI / contact angle,AOI / 4 point probe / cary300 / a-step(膜厚) / Adhesion test / Marco,AOI / MCD / Resistance meter / a-step(膜厚) / Marco,AOI / contact angle,AOI / cary300 / a-step(膜厚) / 2D(對位精度) / Adhesion test / Marco,A
5、OI / MCD / a-step(光阻厚度) / Marco,AOI / cary300 / a-step(膜厚) / MCD(對位精度) / Adhesion test / Marco / 測試筆(硬度),來料清洗,AOI檢測/接觸角,ITO 鍍膜,AOI檢測/接觸角量測/量測光學（穿透率和反射率）/膜厚/附著力/顯微鏡,清洗,光阻塗布,預烤,曝光,顯影,後烘,清洗,背面光阻塗布,烘烤,ITO蝕刻,去光阻,清洗,Metal 鍍膜,清洗,光阻塗布,光阻塗布,預烤,曝光,顯影,後烘,Metal蝕刻,去光阻,清洗,SiO2 鍍膜,清洗,光阻塗布,預烤,曝光,顯影,烘烤,Printer1,Conv
6、ery,Cleaner,Flipper,Printer2,Convery,Cleaner,網印蝕刻A面,傳送,清洗,翻轉,網印蝕刻B面,傳送,清洗,Flipper,翻轉,Flipper,ITO Etching,Stripper,Cleaner,Pre-Bake,Back Side PR,AOI / a-step(光阻 厚度) / Marco,Flipper,Flipper,AOI / MCD / Resistance meter / Marco,SIO,量測機台及用途 & 量測定義,A面朝上,B面朝上,量測機台及用途:,九點位置定義:,四點位置定義:,A面朝上,B面朝上,Glass,ITO S
7、putter,1.INC(Cleaning) 2.ITO Sputter,ITO Driver,ITO Sensor,面電阻,膜厚&穿透率,Glass,ITO Driver/Sensor Photo/Etch,1.Cleaning 2.Coater 3.Pre-bake 4.Expousre 5.Develop 6.PR protection 7.Post-bake 8.Etch 9.Stripper,ITO Driver,ITO Sensor,Glass,ITO Sensor,ITO Driver,ITO Driver/Sensor Photo/Etch,量測類型：,ITOB線阻抗量測,IT
8、OA線阻抗量測,ITOA to Glass對位精度,完整test key 4個,ITOA 線距,ITO Driver/Sensor Photo/Etch,ITOB to ITOA對位精度,ITOA,ITOB,Spec : 035um,ITOB 線距,Glass,Metal Sputter,1.PDC(Cleaning) 2.Metal Sputter,Metal,350A 2400A 180A,Mo-Nb,Al-Nd,Mo-Nb,Metal Sputter,量測類型：,面電阻,Glass,Metal Photo/Etch,1.Cleaning 2.Coater 3.Pre-bake 4.Exp
9、ousre 5.Develop 6.Post-bake 7.Etch 8.Stripper,Glass,Metal,Metal Photo,量測類型：,光阻膜厚 & Metal 膜厚,B-ITO/A-Metal overlay & A-ITO/A-Metal overlay ：,Metal 線距：,Metal Etch,量測類型：,Metal 線阻抗量測位置：,FAI&SPC線阻抗量測同前,SIO2 Sputter,1.PDC(Cleaning) 2.SiO2 Sputter,Glass,Glass,SIO2 Sputter,量測類型：,膜厚&穿透率,附著力由Sputter 工程提供,SIO2
10、 Etch,1.Printer 2.Convey 3.Cleaner 4.Printer 5.Convey 6.Cleaner,Glass,Glass,SIO2 Etch,量測類型：,Organic,1.Cleaning 2.Coater 3.Pre-bake 4.Expousre 5.Develop 6.Post-bake,Glass,Glass,Organic,量測類型：,膜厚量測位置：,對位精度量測位置：,350A Production layout,Driver side ITO,Driver side Metal,Driver side SiO2,Driver side Organi
11、c,350A-Driver side (A-side),350A-Sensor side (A-side),Sensor side ITO,Sensor side SiO2,FAB layout,MET,MES,PDC,ORG,G-Line SIO,PF,INC,SIS,E-Line ITOA,E-Line ITOB,AOI,(Process Flow) PR used for Back side protection,ITS,：ITO A 面,：ITO B 面,：MET,：SIO2,：ITO Sputter,：Panel Insert,Oven,FQC,Thanks,光罩(reticle),
12、蝕刻(etch),去光阻液 stripper,鍍 下 一 層 膜,TP Photo/Etch 流程圖示,光阻Coating的方法,滾筒式塗佈,印刷輪,玻璃基板,光阻劑,移動方向,背輪,勻膠輪,Pre-Bake(預烤),去除玻璃基板表面的水氣或光阻內的溶劑 三種烘烤方法: 一.熱空氣加熱(熱對流) 二.紅外線加熱(熱輻射) 三.平板加熱式(熱傳導),Glass,Resist,Glass,Glass,Hot Plate,熱空氣加熱,紅外線加熱,平板加熱式,Exposure Optical System,DVP (Developer),顯影噴灑設計 噴嘴交錯排列,藥液成扇形噴灑,2支噴管1組壓力控制
13、閥,有效作壓力補償及製程條件控制.,Shower,示意圖,DVP (Developer),顯影效果確認: 顯影過程中其化學反應速度隨藥液濃度的改變,顯影溫度的改變而改變,同時其顯影效果隨噴淋方式而變化.,正常顯影,不完全顯影,顯影不足,顯影過度,Post Baker (硬烤),目的：將光阻內最後的溶劑趕走,使光阻定型,並將顯影清 洗後基板表面殘留的水氣烤乾.,蝕刻目的: 經過顯影后的基板,利用相對應的化學試劑將裸露在表面的材料移除掉,以達到設計需求的pattern.,Etching (蝕刻),Chemical: Al 酸移除金屬鋁膜 王 水移除氧化銦錫膜,藥液均勻的噴灑 在基板表面上,Stripper 原理:,Stripper (去光阻膜),Stripper 1-1,1-2: 藥液全面的噴灑在基板表面,使基板表面的光阻膜得以潤濕.Stripper 2-1,2-2: 高壓噴淋的藥水攻擊光阻膜並迅速得使其與基板表面分離.Stripper 3-1,3-2: 均勻噴灑的乾淨藥水將基板表面的光阻洗淨.,