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1、DRAFT FOR DEVELOPMENT DD IEC/PAS 62050:2004 Board level drop test method of components for handheld electronic products ICS 31.080.01 ? Licensed Copy: London South Bank University, London South Bank University, Tue Dec 12 04:00:17 GMT+00:00 2006, Uncontrolled Copy, (c) BSI DD IEC/PAS 62050:2004 This
2、 Draft for Development, was published under the authority of the Standards Policy and Strategy Committee on 11 January 2006 BSI 11 January 2006 ISBN 0 580 45953 5 National foreword This Draft for Development reproduces verbatim IEC/PAS 62050:2004. This publication is not to be regarded as a British
3、Standard. It is being issued in the Draft for Development series of publications and is of a provisional nature. It is still under development and, with insufficient data as yet to relate it to experience in the field, it may be subject to significant change. It should be applied on this provisional
4、 basis, so that information and experience of its practical application may be obtained. A PAS is a Technical Specification not fulfilling the requirements for a standard, but made available to the public and established in an organization operating under a given procedure. Comments arising from the
5、 use of this Draft for Development are requested so that UK experience can be reported to the international organization responsible for the Technical Specification. A review of this publication will be initiated not later than 3 years after its publication by the international organization so that
6、a decision can be taken on its status at the end of its 3-year life. Notification of the start of the review period will be made in an announcement in the appropriate issue of Update Standards. According to the replies received by the end of the review period, the responsible BSI Committee will deci
7、de whether to support the conversion into an international standard, to extend the life of the Technical Specification for another 3 years or to withdraw it. Comments should be sent in writing to the Secretary of BSI Technical Committee EPL/47, Semiconductor devices, at British Standards House, 389
8、Chiswick High Road, London W4 4AL, giving the document reference and clause number and proposing, where possible, an appropriate revision of the text. A list of organizations represented on this committee can be obtained on request to its secretary. Cross-references The British Standards which imple
9、ment international publications referred to in this document may be found in the BSI Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Search” facility of the BSI Electronic Catalogue or of British Standards Online. This publication does not purpor
10、t to include all the necessary provisions of a contract. Users are responsible for its correct application. Summary of pages This document comprises a front cover, an inside front cover, the IEC PAS title page, a blank page, pages i and ii, pages 1 to 14, an inside back cover and a back cover. The B
11、SI copyright date displayed in this document indicates when the document was last issued. Amendments issued since publication Amd. No. DateComments Licensed Copy: London South Bank University, London South Bank University, Tue Dec 12 04:00:17 GMT+00:00 2006, Uncontrolled Copy, (c) BSI PUBLICLY AVAIL
12、ABLE SPECIFICATION IEC PAS 62050 First edition 2004-11 Board level drop test method of components for handheld electronic products Reference number IEC/PAS 62050:2004(E) Licensed Copy: London South Bank University, London South Bank University, Tue Dec 12 04:00:17 GMT+00:00 2006, Uncontrolled Copy,
13、(c) BSI blank Licensed Copy: London South Bank University, London South Bank University, Tue Dec 12 04:00:17 GMT+00:00 2006, Uncontrolled Copy, (c) BSI INTERNATIONAL ELECTROTECHNICAL COMMISSION _ BOARD LEVEL DROP TEST METHOD OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS FOREWORD 1) The Internationa
14、l Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co- operation on all questions concerning standardization in the electrical and electronic
15、fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any
16、 IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardi
17、zation (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has repres
18、entation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC
19、cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publica
20、tions. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with an I
21、EC Publication. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal inju
22、ry, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references c
23、ited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identif
24、ying any or all such patent rights. A PAS is a technical specification not fulfilling the requirements for a standard but made available to the public. IEC-PAS 62050 was submitted by JEDEC and has been processed by IEC technical committee 47: Semiconductor devices. The text of this PAS is based on t
25、he following document: This PAS was approved for publication by the P-members of the committee concerned as indicated in the following document Draft PAS Report on voting 47/1753/NP 47/1791/RVN Following publication of this PAS, the technical committee or subcommittee concerned will investigate the
26、possibility of transforming the PAS into an International Standard An IEC-PAS licence of copyright and assignment of copyright has been signed by the IEC and JEDEC and is recorded at the Central Office. This PAS shall remain valid for an initial maximum period of three years starting from 2004-11. T
27、he validity may be extended for a single three-year period, following which it shall be revised to become another type of normative document or shall be withdrawn. i DD IEC/PAS 62050:2005 Licensed Copy: London South Bank University, London South Bank University, Tue Dec 12 04:00:17 GMT+00:00 2006, U
28、ncontrolled Copy, (c) BSI BOARD LEVEL DROP TEST METHOD OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS Introduction The handheld electronic products fit into the consumer and portable market segments. Included in the handheld electronic products are cameras, calculators, cell phones, pagers, palm siz
29、e PCs, Personal Computer Memory Card International Association (PCMCIA) cards, smart cards, mobile phones, personal digital assistants (PDAs) and other electronic products that can be conveniently stored in a pocket and used while held in users hand. These handheld electronic products are more prone
30、 to being dropped during their useful service life because of their size and weight. This dropping event can not only cause mechanical failures in the housing of the device but also create electrical failures in the printed circuit board (PCB) assemblies mounted inside the housing due to transfer of
31、 energy through PCB supports. The electrical failures may result from various failure modes such as cracking of circuit board, trace cracking on the board, cracking of solder interconnections between the components and the board, and the component cracks. The primary driver of these failures is exce
32、ssive flexing of circuit board due to input acceleration to the board created from dropping the handheld electronic product. This flexing of the board causes relative motion between the board and the components mounted on it, resulting in component, interconnects, or board failures. The failure is a
33、 strong function of the combination of the board design, construction, material, thickness, and surface finish; interconnect material and standoff height; and component size. DD IEC/PAS 62050:2005 ii Licensed Copy: London South Bank University, London South Bank University, Tue Dec 12 04:00:17 GMT+0
34、0:00 2006, Uncontrolled Copy, (c) BSI BOARD LEVEL DROP TEST METHOD OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS (From JEDEC Board Ballot JCB-03-38, formulated under the cognizance of the JC-14.1 Subcommittee on Reliability Test Methods for Packaged Devices) 1 Scope The Board Level Drop Test Method
35、 is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test metho
36、dology to provide a reproducible assessment of the drop test performance of surface mounted components while duplicating the failure modes normally observed during product level test. The purpose of this document is to prescribe a standardized test method and reporting procedure. This is not a compo
37、nent qualification test and is not meant to replace any system level drop test that maybe needed to qualify a specific handheld electronic product. The standard is not meant to cover the drop test required to simulate shipping and handling related shock of electronic components or PCB assemblies. Th
38、ese requirements are already addressed in JESD22-B104-B and JESD22-B110. The method is applicable to both area-array and perimeter-leaded surface mounted packages. Correlation between test and field conditions is not yet fully established. Consequently, the test procedure is presently more appropria
39、te for relative component performance than for use as a pass/fail criterion. Rather, results should be used to augment existing data or establish baseline for potential investigative efforts in package/board technologies. The comparability between different test sites, data acquisition methods, and
40、board manufacturers has not been fully demonstrated by existing data. As a result, if the data are to be used for direct comparison of component performance, matching study must first be performed to prove that the data are in fact comparable across different test sites and test conditions. This met
41、hod is not intended to substitute for full characterization testing, which might incorporate substantially larger sample sizes and increased number of drops. Due to limited sample size and number of drops specified here, it is possible that enough failure data may not be generated in every case to p
42、erform full statistical analysis. 2 Apparatus As per JESD22-B104-B and JESDD22-B110 DD IEC/PAS 62050:2005 1 Licensed Copy: London South Bank University, London South Bank University, Tue Dec 12 04:00:17 GMT+00:00 2006, Uncontrolled Copy, (c) BSI 3 Terms and definitions For purposes of this standard,
43、 the following definitions shall apply component: A packaged semiconductor device. single-sided PCB assembly: A printed circuit board assembly with components mounted on only one side of the board double-sided PCB assembly: A printed circuit board assembly with components mounted on top and bottom s
44、ides of the board. handheld electronic product: A product that can conveniently be stored in a pocket (of sufficient size) and used when held in users hand. NOTE Included in handheld electronic products are cameras, calculators, cell phones, pagers, palm-size PCs (formerly called pocket organizers),
45、 Personal Computer Memory Card International Association (PCMCIA) cards, smart cards, mobile phones, personal digital assistants (PDAs), and other communication devices. peak acceleration: The maximum acceleration during the dynamic motion of the test apparatus. pulse duration; acceleration interval
46、: The time interval between the instant when the acceleration first reaches 10% of its specified peak level and the instant when the acceleration first returns to 10% of the specified peak level after having reach that peak level. table drop height: The free-fall drop height of the drop table needed
47、 to attain the prescribed peak acceleration and pulse duration. event: An electrical discontinuity of resistance greater than 1000 ohms lasting for 1 microsecond or longer. event detector: A continuity test instrument capable of detecting electrical discontinuity of resistance greater than 1000 ohms
48、 lasting for 1 microsecond or longer. 4 Applicable documents JESD22-B104-B, Mechanical Shock JESD22-B110, Subassembly Mechanical Shock IPC-SMT-782, Surface Mount Design and Land Pattern Standard IPC-A-600, Acceptability of Printed Boards J-STD-020, Moisture/Reflow Sensitivity Classification for Non-
49、hermetic Solid State Surface Mount Devices J-STD-033, Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices IPC-9701, Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments DD IEC/PAS 62050:2005 2 Licensed Copy: London South Bank University, London South Bank University, Tue Dec 12 04:00:17 GMT+00:00 2006, Uncontrolled Copy, (c) BSI 5 Test Components and Board 5.1 Components This standard covers