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1、 IEC 61188-5-4 Edition 1.0 2007-10 INTERNATIONAL STANDARD Printed boards and printed board assemblies Design and use Part 5-4: Attachment (land/joint) considerations Components with J leads on two sides IEC 61188-5-4:2007(E) -,-,- THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2007 IEC, Geneva, S
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4、Switzerland Email: inmailiec.ch Web: www.iec.ch About the IEC The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes International Standards for all electrical, electronic and related technologies. About IEC publications The technical conte
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9、Edition 1.0 2007-10 INTERNATIONAL STANDARD Printed boards and printed board assemblies Design and use Part 5-4: Attachment (land/joint) considerations Components with J leads on two sides INTERNATIONAL ELECTROTECHNICAL COMMISSION P ICS 31.180 PRICE CODE ISBN 2-8318-9341-0 2 61188-5-4 IEC:2007(E) CON
10、TENTS FOREWORD.3 INTRODUCTION.5 1 Scope.6 2 Normative references .6 3 General information6 3.1 General component description .6 3.2 Marking .7 3.3 Packaging .7 3.4 Process considerations .7 4 Small outlined J packages (SOJ)7 4.1 Component description7 4.2 Component dimensions .8 4.3 Solder joint fil
11、let design .9 4.4 Land pattern dimensions .11 Bibliography15 Figure 1 SOJ construction8 Figure 2 SOJ component dimensions.9 Figure 3 Solder joint fillet design11 Figure 4 SOJ land pattern dimensions .14 61188-5-4 IEC:2007(E) 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ PRINTED BOARDS AND PRINTED BO
12、ARD ASSEMBLIES DESIGN AND USE Part 5-4: Attachment (land/joint) considerations Components with J leads on two sides FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Commit
13、tees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Availab
14、le Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non- governmental orga
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17、ional Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity,
18、 IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC pr
19、ovides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with an IEC Publication. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, empl
20、oyees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of th
21、e publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the
22、possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 61188-5-4 has been prepared by IEC technical committee 91: Electronics assembly technology Th
23、e text of this standard is based on the following documents: FDIS Report on voting 91/703/FDIS 91/735/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/I
24、EC Directives, Part 2. A list of all parts of the IEC 61188 series, under the general title Printed boards and printed board assemblies Design and use, can be found on the IEC website. 4 61188-5-4 IEC:2007(E) The committee has decided that the contents of this publication will remain unchanged until
25、 the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed; withdrawn; replaced by a revised edition, or amended. A bilingual version of this standard may be issued at a l
26、ater date. 61188-5-4 IEC:2007(E) 5 INTRODUCTION This part of IEC 61188 covers land pattern for components with J leads on two sides. The proposed land pattern dimensions in this standard are based upon the fundamental tolerance calculation combined with the given land protrusions and courtyard exces
27、ses (see IEC 61188-5-1, Generic requirements). The courtyard includes all issues of the normal manufacturing necessities. The unaltered land pattern dimensions of this part are generally applicable for the solder paste application plus reflow soldering process. For application of the wave soldering
28、process (though uncommon for SOJ components) the land pattern and courtyard dimensions may have to be modified. An orientation parallel to the wave direction is strongly recommended and suitably dimensioned solder thieves should be added. This standard offers a threefold land pattern dimensioning (l
29、evels 1, 2, 3) on the basis of a threefold set of land protrusions and courtyard excesses: maximum (max.); medium (mdn); and minimum (min.). Nevertheless the user may develop deviating land pattern dimensions based upon the methodology of IEC 61188-5-1, introducing his own special material and assem
30、bling process conditions C, F, P and perhaps his own special land protrusions and courtyard excesses dimensions, as required. If a user has good reasons to use a concept different from that of IEC 61188-5-1 or if the user prefers unusual land protrusions, this standard should be used for checking th
31、e resulting solder fillets. It is the responsibility of the user to verify his used SMD land patterns for achieving an undisturbed mounting process including testing and an ensured reliability for the product stress conditions in use. -,-,- 6 61188-5-4 IEC:2007(E) PRINTED BOARDS AND PRINTED BOARD AS
32、SEMBLIES DESIGN AND USE Part 5-4: Attachment (land/joint) considerations Components with J leads on two sides 1 Scope This part of IEC 61188 provides the component and land pattern dimensions for small outline integrated circuits with “J“ leads on two sides (SOJ components) used in the reflow solder
33、ing process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions. 2 Normative references The following referenced documents are indispensable for the application of this document. For dat
34、ed references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60068-2-58, Environmental testing Part 2-58: Tests: Test Td. Test methods for solderability, resistance to dissolution of metallization and to
35、soldering heat of surface mounting devices (SMD) IEC 60286-3, Packaging of components for automatic handling Part 3: Packaging of surface mount components on continuous tapes IEC 60286-4, Packaging of components for automatic handling Part 4: Stick magazines for electronic components encapsulated in
36、 packages of form E and G IEC 60286-5, Packaging of components for automatic handling Part 5: Matrix trays IEC 61760-1, Surface mounting technology Part 1: Standard method for the specification of surface mounting components (SMDs) 3 General information 3.1 General component description The two-side
37、d J lead family is a small outline family identified by the dimensions of the body size in inches. For example, the SOJ/300 has a body size of 0,300 in or 7,63 mm, the SOJ/350 has a body size of 0,350 in or 8,88 mm, the SOJ/400 has a body size of 0,400 in or 10,12 mm, and the SOJ/450 has a body size
38、 of 0,450 in or 11,38 mm. Package lead counts range from 14 to 28 pins. Pitch is uniformly for all sizes, i.e. 1,27 mm. The small-outline J (SOJ) package has leads on two sides, similar to a DIP. The lead configuration, like the letter J, extends out the side of the package and bends under the packa
39、ge forming a J bend. The point of contact of the lead to the land pattern is at the apex of the J bend and is the basis for the span of the land pattern. The (inner) end of the J is called the heel, and the outer side of the J is called the toe. 61188-5-4 IEC:2007(E) 7 The leads shall be coplanar wi
40、thin 0,1 mm. That is, when the component is placed on a flat surface, no lead may be more than 0,1 mm off the flat surface. The SOJ package takes advantage of chips having parallel address or data line layouts. For example, memory ICs are often used in multiples, and bus lines connect to the same pi
41、n on each chip. Memory chips in SOJ packages can be placed close to one another because of the parallel pin layout and the use of J leads. With high capacity memory systems, the space savings can be significant compared with a dual in-line. 3.2 Marking The marking of the SOIC family of parts shall c
42、omply with the definitions in the relevant IEC product specifications. 3.3 Packaging Components may be provided in tape packaging: reference IEC 60286-3, stick magazine: reference IEC 60286-4, tray packaging: reference IEC 60286-5. Bulk packaging is not recommended because of lead coplanarity condit
43、ions required for placement and soldering. 3.4 Process considerations Together with other components assembled on PC boards, J lead packages are normally processed using standard solder reflow processes. Parts should therefore have an adequate solderability and resistance to soldering heat. These ca
44、pabilities shall be demonstrated by submitting the parts to the test conditions of IEC 60068-2-58 and by complying with the conditions defined in IEC 61760-1. The land pattern dimensions are based on a mathematical model that establishes a platform for a solder joint attachment to the printed board.
45、 The existing models create a platform that is capable of establishing a reliable solder joint no matter what the solder alloy used to make that joint (lead-free, tin lead, etc.). Process requirements for solder reflow are different based on the solder alloy and should be analyzed in order that the
46、process is above the liquidus temperature of the alloy, and remains above that temperature a sufficient time to form a reliable metallurgical bond. 4 Small outlined J packages (SOJ) 4.1 Component description Figure 1 shows a typical construction example. 8 61188-5-4 IEC:2007(E) IEC 2018/07 Figure 1
47、SOJ construction 4.2 Component dimensions Figure 2 shows the component dimensions for SOJ components. H P 1,02 1,17 L S A WT A (in) A (mm) ref.min. max. 0,300 0,350 7,49 7,75 8,76 9,02 B IEC 2019/07 Dimensions in millimetres -,-,- 61188-5-4 IEC:2007(E) 9 L S W T B H P Component identification Min. M
48、ax. Min. Max. Min. Max. Min. Max. Min. Max. Max. Basic SOJ 14/300 8,38 8,76 4,38 5,06 0,38 0,51 1,6 2,0 9,65 9,96 3,75 1,27 SOJ 16/300 8,38 8,76 4,38 5,06 0,38 0,51 1,6 2,0 10,92 11,23 3,75 1,27 SOJ 18/300 8,38 8,76 4,38 5,06 0,38 0,51 1,6 2,0 12,19 12,50 3,75 1,27 SOJ 20/300 8,38 8,76 4,38 5,06 0,3
49、8 0,51 1,6 2,0 13,46 13,77 3,75 1,27 SOJ 22/300 8,38 8,76 4,38 5,06 0,38 0,51 1,6 2,0 14,73 15,04 3,75 1,27 SOJ 24/300 8,38 8,76 4,38 5,06 0,38 0,51 1,6 2,0 16,00 16,31 3,75 1,27 SOJ 26/300 8,38 8,76 4,38 5,06 0,38 0,51 1,6 2,0 17,27 17,58 3,75 1,27 SOJ 28/300 8,38 8,76 4,38 5,06 0,38 0,51 1,6 2,0 18,54 18,85 3,75 1,27