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1、isplaying your vision!isplaying your vision! TFT Array製程技術製程技術 The Technology of TFT Array Processing 中小事業部 產品設計總處 面板設計處AR設計部 isplaying your vision! E/B and E/S TFT StructureE/B and E/S TFT Structure Data Line & Source Passivation SiNx Gate LineCs Line & CstGate Insulator Glass Substrate Gate Line &
2、 Cst Glass Sub. Passivation SiNx Gate Insulator Data Line & Source E/B Type TFT & Cs on Common TFT Array Structure E/S Type TFT & Cs on Gate TFT Array Structure isplaying your vision! Pixel ElementsPixel Elements isplaying your vision! 5-Photo Exposure Process5-Photo Exposure Process Insulator Passi
3、vation (1)Gate Patterning (Mask 1) (2)SiN/a-Si/n+ a-Si Deposition (3)a-Si Pattering (Mask 2) (4)S/D Metal Patterning (Mask 3) (5)Back Channel Etching for B/E structure (6)Passivation Layer Coverage (7)Contact Hole/ Window Etching (Mask 4) (8)ITO Pixel Electrode Patterning (Mask 5) isplaying your vis
4、ion! a-Si TFT BCE Profilea-Si TFT BCE Profile From Innolux 7” 2005 isplaying your vision! GE Patterning (Mask 1)GE Patterning (Mask 1) isplaying your vision! GI and SE Layer DepositionGI and SE Layer Deposition isplaying your vision! SE Patterning (Mask 2)SE Patterning (Mask 2) Active Layer Crossove
5、r Coverage isplaying your vision! SD Patterning (Mask 3)SD Patterning (Mask 3) Data Line & Source Electrode isplaying your vision! Back Channel EtchingBack Channel Etching Data Line & Source Electrode isplaying your vision! CH Layer DepositionCH Layer Deposition Passivation Layer (SiNx) isplaying yo
6、ur vision! CH Patterning (Mask 4)CH Patterning (Mask 4) Passivation Layer (SiNx) isplaying your vision! PE Patterning (Mask 5)PE Patterning (Mask 5) Passivation Layer (SiNx) isplaying your vision! PVD/ SputteringPVD/ Sputtering isplaying your vision! Metal and AlloyMetal and Alloy GateSource/Drain A
7、UOMo/AlNd Ti/Al/Ti MoW Mo/Al/Mo CMOMoN/AlNdMoN/Al/MoN HANNSTARMoW Mo/AlNd/Mo Mo/AlNd/Mo InnoluxAl/MoMo/Al/Mo AUO(QDI)Al/TiTi/Al/TiN CPTCr AlNdN MoNb Cr MoNb Mo/Al/Mo isplaying your vision! PECVDPECVD Heat Stage Substrate isplaying your vision! 理想的閘極絕緣層 (Gate insulator) 性質: 良好的階梯覆蓋能力(Good Step Covera
8、ge) 適中的介電常數(Dielectric Constant) 高崩潰電壓(High Breakdown Voltage) 低薄膜應力(Low Stress) 與a-Si 有良好的界面 （Good interface with a-Si film) 理想的保護層 (Passivation Layer) 性質: 抗水氣能力佳(Diffusion Barrier Against Moisture) 抗鹼金屬離子滲透力佳(Diffusion Barrier Against Alkali Ions) 硬度佳，可承受機械性刮傷 低製程溫度 Thin Film QualityThin Film Qual
9、ity isplaying your vision! SiNx Particle SiNx Pinhole PECVD SiNx:4000A a-Si:1500A n+a-Si:300A 洗淨、 a-Si/n+ 洗淨 SPUTTERING SD Metal Gate Gate a-Si / n+ The Pin HolesThe Pin Holes isplaying your vision! PECVD SiNx:3000A PECVD SiNx 洗淨 SiNx Gate SiNx SiNx Pinhole GateGate PECVD SiNx:1000A SiNx GateGateGat
10、e Gate The Solution of Pin HolesThe Solution of Pin Holes isplaying your vision! SiNx:4000A a-Si:1500A n+a-Si:300A PECVD現製程現製程 SiNx:3000A 一次成膜 洗淨 二次成膜 洗淨 SiNx:1000A a-Si:300A a-Si:1200A n+a-Si:300A PECVD原製程原製程 洗淨 (GI) (SE-i) (SE-n+) (SE-n+) (SE-HDR-i) (SE-LDR-i) (GI-2) (GI-1) The Solution of Pin Hol
11、esThe Solution of Pin Holes isplaying your vision! PhotolithographyPhotolithography isplaying your vision! P.R. CoatingP.R. Coating Substrate Substrate isplaying your vision! Photo ExposurePhoto Exposure Substrate isplaying your vision! Photo StitchingPhoto Stitching Substrate isplaying your vision!
12、 Random Shot for StitchingRandom Shot for Stitching isplaying your vision! Scan PhotoScan Photo Mask Move Stage Move Substrate isplaying your vision! EtchingEtching Etching ModeDryWet EquipmentPlasma Enhanced CVDLiquid Trough Etching RateSlowFast UniformityGoodNormal Thin FilmA-Si, SiNx, MoAl, Mo, C
13、r, ITO EtchantHCl, SF6, CF6HCl, HNO3, CH3OOH Etch ProfileNon-isotropicIsotropic Taper EtchVertical(ex.8090)Slope(ex.2045) CostExpensiveCheap isplaying your vision! 1.斷面形狀斷面形狀(Taper ) Taper係指蝕刻後的斷面傾斜度，是蝕 刻製程中相當重要的要求，與後續沉 積之薄膜覆蓋性有相當密切的關係。 覆蓋性很差 (e.g.濕蝕刻) 覆蓋性差 (e.g.濺擊蝕刻) 覆蓋性佳 (e.g. RIE/PE蝕刻) 等向性蝕刻 非向性蝕
14、刻 控制性蝕刻 Estimating for Dry EtchingEstimating for Dry Etching isplaying your vision! 2.CD Loss (Critical Dimension Loss) Glass Cr SiN Glass Cr SiN PRPR PVD Cr depo. CVD SiN depo. PR Patterning Glass Cr PRPR A(after dev. Size) B CD Loss = B-A Dry Etching (after Etching Size) Estimating for Dry Etching
15、Estimating for Dry Etching isplaying your vision! The ESD GuardThe ESD Guard Shorting Ring ESD Guard Shorting Ring isplaying your vision! 4-PEP TFT Array4-PEP TFT Array isplaying your vision! 4-Photo Exposure Process4-Photo Exposure Process Advanced Tech. 4-Masks isplaying your vision! Gray Tone or Slit MaskGray Tone or Slit Mask isplaying your vision! 4-PEP Processing4-PEP Processing isplaying your vision! 4-PEP Processing4-PEP Processing isplaying your vision! ReferenceReference 五南文化出版經濟部出版