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1、 112 COMPUTATIONAL METHODS IN ENGINEERING AND SCIENCE EPMESC X, Aug. 21-23, 2006, Sanya, Hainan, China 2006 Tsinghua University Press total stress intensity factors caused by vapor pressure in penny shaped crack, Kic; delamination toughness measured by delamination test at 240C) In case of the syste
2、m B and system C connected by the ACF(B) and ACF(C) respectively, the values of delamination toughness for all jointed interfaces are higher than the total stress intensity factors caused by the vapor pressure during reflow process. So, the system B and system C are expected not to be delaminated. I
3、f we assume that the system B has a penny shaped crack with the radius of 120m at the interface between the ACF and the Al pattern, the total stress intensity factor due to the vapor pressure are almost the same as the delamination toughness of an interface crack between the ACF and the Al pattern.
4、Therefore, we could presume that disconnected flip chips of the system B shown in Table 4 have a delamination or void equivalent to a penny shaped crack with the radius of 120m at the interface 124 between the ACF and the Al pattern. Similarly, we could presume that the system C has a penny shaped c
5、rack with the radius of 100m at the interface between the ACF and a substrate. Conclusively, the occurrence of the delamination of ACF in a flip chip during solder reflow process after moisture absorption can be estimated by comparing the delamination toughness with the stress intensity factor cause
6、d by the vapor pressure. CONCLUDING REMARKS We dealt with the reliability studies of electronic packaging, that is, the strength evaluation of plastic packages during solder reflow process, and the delamination evaluation of anisotropic conductive adhesive films during solder reflow process. In both
7、 studies, computational mechanic approaches can be applied as a powerful tool for obtaining moisture concentration in the resin and the stress intensity factors of a V-notch and an interface crack. It can be concluded that computational mechanics approaches are key technologies for the reliability s
8、tudies of electronic packaging REFERENCE 1. Chen D, Nishitani H. Stress field near the corner of jointed dissimilar materials. Trans. Jpn. Soc. Mech. Eng., Ser. A, 1991; 57: 366-372. 2. Erdogan F. Stress distribution in a nonhomogeneous elastic plate with crack. J. Appl. Mech., 1963; 30: 232-236. 3.
9、 Rice JR. Elastic fracture mechanics concepts for interfacial crack. J. Appl. Mech., 1988; 55: 98-103. 4. Ikeda T, Miyazaki N, Soda T. Mixed mode fracture criterion of interface crack between dissimilar materials. Eng. Fract. Mech., 1998; 59: 725-735. 5. Miyazaki N, Ikeda T, Soda T, Munakata T. Stre
10、ss intensity factor analysis of interface crack using boundary element method (Application of virtual crack extension method). JSME Int. J., 1993; 36: 36-42. 6. Kassir MK, Bregman AM. The stress intensity factors for penny shaped crack between two dissimilar materials. J. Appl. Mech., 1972; 39: 308-310.