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1、WIRE BOND PROCESS INTRODUCTION,CONTENTS,ASSEMBLY FLOW OF PLASTIC IC Wire Bond 原理 M/C Introduction Wire Bond Process Material SPEC Calculator DEFECT,封裝簡介,晶片Die,金線 Gold Wire,導線架 Lead fram,Wafer Grinding,Die Bonding,Wafer Saw,toaster,Wire Bonding,Die Surface Coating,Molding,Laser Mark,Solder Ball Place
2、ment,Singulation,Packing,封裝流程,Dejunk TRIM,Solder Plating,Solder Plating,Dejunk TRIM,TRIM/ FORMING,BGA,SURFACE MOUNTPKG,THROUGH HOLE PKG,Wire Bond 原理,pad,lead,Gold wire,Ball Bond ( 1st Bond ),Wedge Bond ( 2nd Bond ),Al,B.PRINCIPLE,銲接條件,HARD WELDING Pressure (Force) Amplify 或著一個Die上出現不同Pad大小那就是以兩個Pad中
3、心距離為BPP,但是一般我們要取一個Die上最小的BPP,Bond Pad Pitch,Bond Pad Open,Bond Pad Open,Ball Size,Ball Thickness,Ball Size Ball Size = y; Area = (y/2) x/(y/2) = z g/mil,C,Ball bond,Test specimen,Specimen clamp,Shearing ram,Wire,Bond shoulder,Interfacial contactball bond weld area,Bonding pad,h,(A) Unsheared,C,L,C,B
4、all bond,C,L,Test specimen,Specimen clamp,Bonding pad,Full ball attached towire-except for regionsof intermetallic voiding,Ball separated at bonding pad-Ball interface-residual intermetallic(and sometimes portion of unalloyedball and metal) on pad in bondinteraction area,(D) Ball bond-bonding pad in
5、terface separation (typical Au to Al),C,Test specimen,Specimen clamp,Shearing ram,Wire,Minor fragment of ballattached to wire,Bonding pad,C,L,Ball sheared too high(off line, etc.)only aportion of shoulder andball top removed,Interfacial contactball bond weld area,(B) Wire (ball top and/or side) shea
6、r,C,Ball bond,C,L,Test specimen,Specimen clamp,Bonding pad,Major portionof ball attached to wire,Interfacial contact-ball bond weld areaintact,(C) Below center line shear, ball sheared through (typically Au to Au),C,Ball bond,C,L,Test specimen,Specimen clamp,Bonding pad,Pad metallizationseparates fr
7、omunderlying surface,Residual pad on ballball-pad interfaceremains intact,(E) Bond pad lifts,Test specimen,Specimen clamp,C,Ball bond,C,L,Bonding pad,Bonding pad lifts,taking portion of underlyingsubstrate material with it,(F) Cratering,Residual pad and substrate attachedto ball,ball-pad interface r
8、emainsintact,Shear Failure Modes,Crater Test,Calculate (I),UP Time =,(Total Actual Production Times Total Repair Time ),Total Actual Production Time,DOWN TIME RATE=,Total Repair Time,Total Actual Production Times,Total Operator Actual Repair Time,Total Operator Repair Frequency Stoppages,Total Actua
9、l Production Times Total Operator Repair Time,Total Operator Repair Frequency Stoppages,Total Technical Actual Repair Times,Total Technical Repair Frequency Stoppages,MTTS (MEAN TIME TO STOP ) =,MTBS (MEAN TIME BETWEEN STOP)=,MTTA (MEAN TIME TO ASSISTANCE ) =,Calculate (II),MTBA (Mean Time Between A
10、ssistance) =,Total Actual Production Times Total Technican Repair Times,Total Technical Repair Frequency Stoppages,MTBF(Mean Time Between Failure)=,Total Actual Production Times Total Technician Repair Time,Total Change Parts Repair Frequency Stoppage,規格寬度,製程寬度,規格上限 - 規格下限,6 ( 公差),(上限 or 下限 ) - 平均值,
11、三個公差,CP ( 製程能力指標) =,CPK =,=,Quality,正常品 Material Problem 1st Bond issue (Peeling , Ball Lift , Off Center) 2nd Bond issue (滑針，縫點脫，short tail ) Looping Fail (wire snake wire，sweep wire loop base bent ),正常品,Material Problem,With Ball,Wire,Pad Size,Missing Ball,Wire Broken,Bonding Ball Inspection,Ball
12、Detection,Ball Size,Pad Center,Ball Center,Ball Placement (X,Y),Ball Off Pad,Bonding Ball Inspection (cont.),Ball Measurement,Peeling,1st Bond Fail ( I ),Ball Lift,1st Bond Fail (II),Ball Lift,Neck Crack,1st Bond Fail ( III ),Off Center,1st Bond Fail (IV),Off Center Ball,1st Bond Fail (V),Smash Ball
13、,Smash Ball,With Weld,Wire,Capillary Mark,Missing Weld,Wire Broken,Lead,Bonding Weld Inspection,Weld Detection,2nd Bond Fail ( I ),滑針,2nd Bond Fail ( II ),縫點脫落,Looping Fail(Wire Short I),Wire Sweep,Looping Fail(Wire Short II),Loop Base Bend,Looping Fail(Wire Short III),Excessive Loop,Wire Short,THE END,