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1、Introduction to Flexible Circuit Materials軟板材料介紹,內 容,FPC沿革/特性功能/發展歷程,FPC基材分類電鍍銅皮為柱狀結晶(columnar),輥輾 銅皮為片狀結晶(Laminar),一般PCB之鍍銅則為非明顯結晶之組 成,台灣業者對RA Foil多按日文名詞“壓延銅箔”稱之。,圧延銅箔製程,銅鑄塊,壓延製程,表面處理,壓延銅箔表面處理工程,壓延原箔,處理過箔,Oven,檢查機,脱脂工程 表面清浄化,粗化處理工程 Cu-Co-Ni合金電鍍 熱的安定性 化學的安定性 與樹脂基板的密着性 （拉力強度）,防鏽處理 硌亜鉛電鍍 氧化防止 耐候性 耐藥品性
2、,覆蓋膜(Coverlay)材料介紹,Coverlay 種類,Coverlay 種類 PI (mil) AD (mil) 0.5 0.6 0.5 1 1 1 1 1.4 2 1 3 1.2 5 1.2 7 1.2,一般當作補強材,* PIC: Photoimaged coverlay * LPI : Liquid Photoimagable,Coverlayer Material,FCCL與CL的組合,:良 :可 不能使用,接著劑(Adhesive)材料介紹,Adhesive之種類 Polyester Acrylic Epoxy Polyimide Butyral Phenolic,接著劑,接
3、著劑,必備之特性 Adhesion Strength 結合強度 Flexibility柔軟度 Chemical Resistance 抗化性 Thermal Resistance 耐熱性 Moisture Absorption 吸水性小 Electrical Properties 電性特性 Cost 成本低,Polyester: Used where the dielectric is also polyester Used where no soldering is needed Typical application: Instant camera film interconnects I
4、nstrument cluster connection in automobiles,接著劑,Acrylic: Used in demanding temperature requirement application Most popular acrylic system is Pyralux by DuPont Excellent adhesion,接著劑,Epoxy: Widely used adhesive system Generally lower cost than acrylic Able to stand wave soldering Good in high temper
5、ature for long period of time (400 to 450 F),接著劑,Polyimide: Used in adhesiveless ccl and coverlay Used where dimension stability is critical Used in high temperature application High moisture absorption,接著劑,接著劑,軟板基材接著劑特性,BondPly & 純膠 材料介紹,Bonding Materials,Comparison of Selected Properties of Flex Circuit Adhesives,* Because polyester is considered unsuitable for soldering the requirement does not apply. Nominal value for minimum peel strength of polyester adhesives is 4.0 lb/in # Results vary with the surface finish of the metal foil.,