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1、Nan Ya CCL CCL Technical Dept., Electronic Materials Div. Nan Ya Plastics Corporation TAIWAN Nan Ya MultilayerNan Ya Multilayer PCB LaminatesPCB Laminates Nan Ya CCL Environmental Protection Signal Speed&Integrity ReliabilitySmaller Form Factor PCB Tech Trends Build up/HDI Phosphorous Free Impedance
2、 Control Narrower Line Spacing Flexible Embedded Passives High Layer Count Low Dk/Low Loss Hi Tg Insulation Low CTE Halogen Free Low Water Absorption CAF-Resistant 產品開發與應用產品開發與應用 Lead Free Compatible NP-200 (BT Grade) NP-180F (Hi Tg & Low CTE) NP-175(F) NP-155(F) NP-170 NP-150 NP-140M (Low Tg/Hi Td)
3、 Anti-CAF Materials High CTI FR4 NPG NPGN-150 NPG-170 NPGN-170 NPX-200 (For Substrates) Bendable CCL Laser Prepreg RCC 2 mil & 3 mil Cores Ultra thin glass yarn 1037 Embedded Capacitance NPLDII & Low Dk glass Nan Ya CCL 南亞產品列表南亞產品列表南亞產品列表南亞產品列表 TG Tg by DSC Suitable for Lead Free Optional for Lead F
4、ree NPG(Halogen Free) NPG-200 NPG-170 NP-LDII NP-175/F NP-170 NP-155/F NP-150 FR-4 D/S 200 NPG-180 High Tg(H.F) high layer count MLB IC Substrate NP-200 BT Laminate IC Substrates BT Laminate (H.F) IC Substrate NP-180/F FR-5 Grade high layer count MLB IC Substrate RCC FR-4 Grade high layer Count MLB
5、High Tg (H.F) high layer count MLB High performance FR-4 Special application FR-4-86 UV FR-4-98 CTI 600 NPG NPGN-150 Halogen Free FR-4 NP-140M NP-140 FR-4 Tetra-functional for MLB 180 CEM-3 CEM-1 CEM-3-86/ CEM-3-01 Halogen free CEM-1-87/ CEM-1-97 CTI600 Laser PP Laser drillable prepreg for HDI 175 1
6、50 140 135 130 Low Dk/Df High frequency/low loss Resin coated copper for HDI 180 180 O O O O O O Nan Ya CCL 印刷電路板印刷電路板(PCB) (PCB) 應用應用 NP-180 RCC Laser P.P 移动电话 HDI产品 CEM-1 CEM-3 电源供应器，监视 器，电视游戏 NP-140M NP-140 個人電腦, 筆記本 電腦,個人電腦外 設 FR-4 個人電腦, 筆記本 電腦 ,個人電腦外 設 NP-155(F) NP-150 個人電腦,笔记本 电脑 PCMCIA卡 NPGN
7、NPG 個人電腦& 筆記本 電腦磁盤驅動器 NPG-180 BGA, CSP, 網絡服務器 NP-200 BGA, CSPBGA, CSP NPG-200 NP-LD 基站 NP-175(F) NP-170 通信服務器 BGA, CSP, 汽車網絡服務器 Nan Ya CCL “ “無鉛無鉛” ”對元件組裝影響對元件組裝影響 無鉛組裝之焊錫材料熔點更高 回流焊過程有更高的溫度曲線 焊錫類型熔點() I.R 最高溫度（ ) 高溫. Sn-Ag-Cu (96.5 3 0.3) 217220245260 較高溫度.Sn-Ag-Cu-Bi(in)210220235245 一般 Pb-Sn (33 67
8、) 183225230 Nan Ya CCL Soak time Ramp - up rate Lead free reflow (SnAgCu) Tin/Lead(63/37) reflow 迴流焊溫度曲線比較迴流焊溫度曲線比較 T:30-44 T:20-30 Peak Temp Time above liquidus (TAL) 50 0 100 150 200 250 Melting point LF Melting point Nan Ya CCL 高耐熱性高耐熱性(Br-(Br-樹脂樹脂) )覆銅板產品系列覆銅板產品系列 NP-150 NP-200 NP-180 TG() NP-14
9、0 200 180 175 150 140 BT Laminate FR-5 Grade Medium Tg FR-4 FR-4 NP-180(F) NP-175 NP-175F NP-155 NP-155F NP-140 Modify(New)NP-140 Modify(New) High Thermal Stability Material NP-170High Tg FR-4 Nan Ya CCL NP-140NP170 NP140MNP-155FNP-175F Thickness (mm)1.61.61,61.61.6 DSC Tg135171 135 155170 Peel Stre
10、ngth (1oz)12.510.511.59.59.5 1/2hr PCT moisture0.226%0.190.2100.15%0.147% 1/2hr PCT+288 solder dipping 330”430”10”1010 Z-axis 1/ ppm/67.1606548.349.5 Z-axis 2/ ppm/288.0285289256.5259.7 CTE 50-260 %4.33.74.33.33.1 T-288 delamination 2.07 min255min 30 min 30 min T-260 delamination25.03 min253030min60
11、 min60 min TGA Td (on set)309.2311 323.5 357359 TGA 5% Wt Loss311.3312.2 325.9 360361 FR-4, NP-155F,NP-175F 特性比對 Nan Ya CCL IPC 規范 vs Nan Ya 材料 Nan Ya CCL ItemFR4NPGNPGN-150NPG-170NPGN-170NPG-180NPG-200 Resin system Br. Epoxy Halogen Free Halogen Free Halogen Free Halogen Free Halogen Free Halogen F
12、ree Curing agentDicyDicy Non DicyDicyNon DicyNon DicyNon Dicy Tg (,DSC)140150145(TMA)170170190(DMA)205(DMA) CTE (%, 50250)4.12.42.42.32.42.22.0 T-260 (min)25606060606060 T-288 (min)25205204040 Td (,TGA)310350360359360367370 Dk (1GHz)4.504.604.504.604.534.824.40 Df (1GHz)0.0160.0120.0130.0120.0130.01
13、50.013 Rigid construction: 4 ply 7628 NPG: “G” for Green (HF) Materials 南亚各系列无卤材料特性南亚各系列无卤材料特性比比 較較 Nan Ya CCL HATS冷热冲击测试结果冷热冲击测试结果 MaterialA conditionPre-condition 245 reflowx6 Pre-condition 260 reflowx6 一般材料一般材料 162-247150-266142-227 Mid-Tg PN +填充材填充材 10001000800-900 Hi-Tg PN +填充材填充材 100010001000
14、无卤材料无卤材料100010001000 Test Condition:-40-145 /1000 cycles Sample:12-layer test vehicle Nan Ya CCL 热膨胀特性 Expansion, PPM/一般材料一般材料 PN FR4+填充填充 材材 Hi Tg无卤材料无卤材料 X-CTE Y-CTE 1518 1518 1315 1315 1113 1113 Z-CTE, Before Tg Z-CTE, After Tg 58 287 45 260 35.3 210 Nan Ya CCL 线路板加工 之影响 一般材料一般材料无卤材料无卤材料 钻孔钻孔2,00
15、0钻钻1,500钻钻 除渣除渣OK需调整制程条件需调整制程条件 黑棕化药水黑棕化药水OK接着力较低接着力较低 压合压合操作空间操作空间 較較广广需调整制程条件需调整制程条件 印刷线路板加工条件之建议印刷线路板加工条件之建议 Nan Ya CCL 钻孔条件 Machine Hole sizSpeedInfeedRTRThkPNL/Stsck Schmoll LZ0.30mm160 Kr/min134 IPM437 IPM1.62 ply 钻头磨损比较 1000 hit2000 hit3000 hit Total (48000 hit) NPG 24.46%30.72%36.52%30.56% N
16、PGN-15025.28%27.32%32.93%28.51% NPG&NPGN-150鑽孔比對測試 Nan Ya CCL 钻孔精度比較比較 NPGNPGN-150 Cp/Cpk1.334/0.7851.859/1.204 Target ( 2.0 mil ) 1325/48098660/48104 2.75%1.37% Nan Ya CCL 钻头磨耗比钻头磨耗比 较较 新新钻头 FR4PN+填充材填充材无卤材料条件 Rpm:200K IPM:114.2 Hits:3500 Hole size:10 mil Nan Ya CCL Material types Black OxideBrown
17、Oxide Chemical ABCD Standard FR44.933.854.563.57 NPG3.233.123.012.74 NPGN-1503.693.463.593.12 Unit: lb/in 无卤材料内层黑棕化接着强度比较无卤材料内层黑棕化接着强度比较无卤材料内层黑棕化接着强度比较无卤材料内层黑棕化接着强度比较 Nan Ya CCL 無鹵材性能比較表-CCL Nan Ya CCL NPG(Dicy)NPGN-150(PN) PCBLayer10L14L Thicknessmm1.8-2.02.4-2.5 DSC-Tg 155150.6 288 Solder floating 10”-6 cycles10 cycles 260 IR Reflow cycles-6-7 cycles10 cycles T-260min8.5824.06 T-288min2.258.68 PCBLayer2+4+23+2+3 Thicknessmm1.00.8 DSC-Tg 156.8150.5 260 IR reflow cycles-10-1215 T-260min25.42- T-288min2-530 無鹵材性能比較表-PCB Nan Ya CCL 南亞無鹵材市場應用狀況 Nan Ya CCL 謝謝指教謝謝指教 http:/.tw