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1、IEEE Std 11 01.3-1 993 1 IEEE Mechanical Standard for Conduction-Cooled and Air-cooled 10 SU Modules Sponsor Bus Architecture Standards Committee of the IEEE Computer Society Approved June 17,1993 IEEE Standards Board Abstract: The mechanical design requirements for conduction-cooled and air-cooled
2、modules of the 10 SU by 6.375 in (1 61.9 mm) format are established. The specification of dimensions and tol- erances is intended to ensure the mechanical intermateability of modules within associated sub- racks. The basic dimensions, frames, PWBs, materials, assembly, and chassis interface of singl
3、e- sided and double-sided modules are covered. Keywords: conduction, convection, direct air impingement, heatsink, printed wiring board (PWB) The Institute of Electrical and Electronics Engineers, Inc. 345 East 47th Street, New York, NY 10017-2394, USA Copyright 0 1993 by the Institute of Electrical
4、 and Electronics Engineers, Inc. All rights reserved. Published 1993. Printed in the United States of America ISBN 1-55937-348-2 No part of this publication may be reproduced in any form, in an electronic retrieval system or otherwise, without the prior written permission of the publisher. IEEE Stan
5、dards documents are developed within the Technical Committees of the IEEE Societies and the Standards Coordinating Committees of the IEEE Standards Board. Members of the committees serve voluntarily and without compensation. They are not necessarily members of the Institute. The standards developed
6、within IEEE represent a consensus of the broad expertise on the subject within the Institute as well as those activities outside of IEEE that have expressed an interest in partici- pating in the development of the standard. Use of an IEEE Standard is wholly voluntary. The existence of an IEEE Standa
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8、evelopments in the state of the art and comments received from users of the standard. Every IEEE Standard is subjected to review at least every five years for revision or reaffirmation. When a document is more than five years old and has not been reaffirmed, it is reasonable to conclude that its con
9、tents, although still of some value, do not wholly reflect the present state of the art. Users are cautioned to check to determine that they have the latest edition of any IEEE Standard. Comments for revision of IEEE Standards are welcome from any interested party, regardless of membership affiliati
10、on with IEEE. Suggestions for changes in docu- ments should be in the form of a proposed change of text, together with appropriate supporting comments. Interpretations: Occasionally questions may arise regarding the meaning of portions of standards as they relate to specific applications. When the n
11、eed for interpretations is brought to the attention of IEEE, the Institute will initiate action to prepare appro- priate responses. Since IEEE Standards represent a consensus of all concerned inter- ests, it is important to ensure that any interpretation has also received the concurrence of a balanc
12、e of interests. For this reason IEEE and the members of its technical com- mittees are not able to provide an instant response to interpretation requests except in those cases where the matter has previously received formal consideration. Comments on standards and requests for interpretations should
13、 be addressed to: Secretary, IEEE Standards Board 445 Hoes Lane P.O. Box 1331 Piscataway, NJ 08855-1 33 1 USA I I IEEE Standards documents are adopted by the Institute of Electrical and Electronics Engineers without regard to whether their adoption may involve patents on articles, materials, or proc
14、esses. Such adoption does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the standards documents. Introduction (This introduction is not a part of IEEE Std 1101.3-1993, IEEE Mechanical Standard for Conduction-Cooled and Air- Cooled 10 SU
15、Modules.) The purpose of this standard is to provide instructions to organizations with respect to the requirements to be considered during the design of modules. This standard pertains to conduction-cooled and air-cooled mod- ules. The conduction-cooled module assembly consists of components and a
16、printed wiring board (PWB) or PWBs bonded to a heatsink or frame that has features that provide for insertion, extraction, chassis align- ment, and thermal and structural management. The heatsink is a three-dimensional part requiring fine toler- ances to provide for surface mount or through-hole com
17、ponent leads. This standard does not require this particular implementation. Other implementations that meet the mechanical intermateablility specifications are permitted. The air-cooled module assembly consists of components and a PWB with a front panel that has features that provide for insertion,
18、 extraction, chassis alignment, and structural management. At the time this standard was completed, the 1101.3 Working Group had the following membership: Kim Clohessy, Chair Keith Cavis, Editor James Simon, Archirecl Harry Andreas Andrew Brough Andrew Capobianco Mike Dorsett Robert Fluhrer Ed Jacqu
19、es Rangesh Kasturi Dave Kirk Ralph Lachenmaier Michael Larnbrou Jim Madison Ernie Mardaga The following persons were on the balloting committee: Ray Alderman Hany Andreas Keith Anthony Donald Bennett Chris Bezirtzoglou Paul Bonill David Brearley John Brightwell Andrew Brough Clyde Camp Andrew Capobi
20、anco Kim Clohessy David Cohen Jean-Jacques Dumont Bruce Dunlop R. D. Edwards Wilhelm Evertz Wayne Fischer Robert Fluhrer Julio Gonzalez-Sanz Frank Horn Edgar Jacques Rangesh Kasturi Thomas Kurihara Ralph Lachenmaier Michael Lambrou Joe Macura Klaus Mueller Elwood Parsons Eric Nickerson Fred Sauer De
21、nnis Smith Joesph Toy Dean Van De Walker LCDR Robert Voigt L. M. Patnaik Brian Rarnelson Gary Robinson Flavia Rosemberg Frederick Sauer Rudolf Schubert Vinnie Squitieri Hao Tang Michael Thompson Joesph Toy Joseph Trainor Robert Tripi David Wright Janusz Zalewski When the IEEE Standards Board approve
22、d this standard on June 17, 1993, it had the following membership: Andrew G. Salem, Secretary Wallace S. Read, Chair Donald C. Loughry, Vice Chair Gilles A. Bail Clyde R. Camp Donald C. Fleckenstein Jay Forster* David F. Franklin Rarniro Garcia Donald N. Heirman Jim Isaak Ben C. Johnson Walter J. Ka
23、rplus Lorraine C. Kevra E. G. “AI” Kiener Ivor N. Knight Joseph L. Koepfinger* D. N. “Jim” Logothetis Member Emeritus Also included are the following nonvoting IEEE Standards Board liaisons: Satish K. Agganval James Beall Richard B. Engelman David E. Soffrin Stanley Warshaw Rachel Auslander IEEE Sta
24、ndards Project Editor Don T . Michael* Marco W. Migliaro L. John Rankine Arthur K. Reilly Ronald H. Reirner Gary S. Robinson Leonard L. Tripp Donald W. Zipse . 111 Contents CLAUSE PAGE 1 . Overview 1 1.1 Scope 1 1.2 Purpose . 1 1.3 1.4 Terminology . 1 Environmental performance level 1 2 . References
25、 2 3 . Definitions 3 4 . Requirements . 4 4.1 General requirements . 4 4.2 Detailed requirements 6 4.3 Module connector requirements 18 4.4 Module keying requirements . 18 4.5 Printed-wiring and printed-wiring assemblies requirements . 20 4.6 Quality requirements 20 4.7 Environmental requirements 21
26、 4.8 Thermal requirements 21 22 22 4.9 Personnel safety requirements . 22 4.10 Reliability requirements . 4.1 1 Module identification requirements 5 . Engineering suggestions 22 5.1 Chassis interface (CC) . 22 5.2 Chassis interface (AC) . 23 5.3 Surface treatment . 23 5.4 Aluminum frame plating 23 5
27、.5 Thermal bonding 23 5.6 Typical power dissipation 23 5.7 Plated through-hole assembly guidelines . 23 5.8 Construction . 24 5.10 Chassis web surface finish . 24 5.9 Components layout 24 5.11 Circuitry . 24 5.12 Backplane connector 24 . 26 5.13 Shock and vibration fixture iv IEEE Mechanical Standar
28、d for Conduction-Cooled and Air-Cooled 10 SU Modules 1. Overview This standard is divided into five clauses. Clause 1 describes the scope and purpose of this standard as well as describes the environmental performance level and terminology used. Clause 2 lists references to other standards that form
29、 a part of this standard. Clause 3 provides definitions of terms. Clause 4, which is the heart of this standard, lists the various requirements for conduction-cooled and air-cooled 10 SU modules. Clause 5 gives suggestions, which are not requirements, but rather are provided as guidance in the desig
30、n process. Throughout this standard please note that subclause titles that end with “(CC)” indicate a requirement for conduction-cooled modules. Subclause titles that end with “(AC)” indicate a requirement for direct-air- impingement-cooled modules. Conduction-cooled requirements are always listed b
31、efore air-cooled requirements. 1.1 Scope This standard establishes the mechanical design requirements for conduction-cooled and air-cooled modules of the 10 SU by 6.375 in 161.9 mm format. This standard is intended for use in conjunction with other IEEE standards. 1.2 Purpose The purpose of this sta
32、ndard is the specification of dimensions and tolerances that will ensure the mechani- cal intermateability of modules within associated subracks. This standard covers the basic dimensions, frames, PwBs, materials, assembly, and chassis interface of single-sided and double-sided modules. 1.3 Environm
33、ental performance level The module shall meet one or more of the environmental performance levels specified in IEEE Std 1156.1- 1993. The required environmental performance level shall be specified by the procurement activity. This standard is primarily intended for military applications using perfo
34、rmance levels 1 and 2 of IEEE Std 1156.1-1993, but does not exclude other applications using other performance levels. 1.4 Terminology The word shall indicates a mandatory requirement. For example, “Designers shall implement all such man- datory requirements to ensure interoperability with other IEE
35、E Std 1101.3-1993 conformant products.” The word should indicates flexibility of choice with a strongly preferred implementation. The phrase it is recommended is used interchangeably with the key word should. The word may indicates flexibility of choice with no implied preference. Information on ref
36、erences can be found in clause 2. 1 IEEE Std 11 01.3-1 993 IEEE MECHANICAL STANDARD FOR CONDUCTION-COOLED 2. References The following documents form a part of this standard to the extent referenced herein. In the event of conflict between the documents referenced herein and the contents of this stan
37、dard, the contents of this standard will be considered a superseding requirement. Nothing in this standard, however, supersedes applicable laws and regulations, unless a specific exemption has been obtained. ANSVIPC D-275-1991, Design Standard for Rigid Printed Boards and Rigid Printed Board Assembl
38、ies2 ANSVIPC RB-276-1992, Qualification and Performance Specification for Rigid Printed Boards. ANSI Y 14.5M-1982 (R1988) Dimensioning and Tolerancing. EIA PN-2933- 1992, Miniaturized Two-Part Blade-and-Tuning Fork Connector for Printed Wiring Boards and back plane. IEC 50, Second edition, Internati
39、onal Electrotechnical Vocabulary, Terms and definitions for electronic pakaging. IEEE Std 1156.1- 1993, IEEE Standard for Microcomputer Environmental Specifications for Computer Modules. IEEE Std 1301-1991, IEEE Standard for a Metric Equipment Practice for Microcomputers-Coordinating Document (ANSI)
40、. MIL-A-8625E, Anodic Coatings for Aluminum and Aluminum alloy. MIL-HDBK-217E, Reliability Prediction of Electronic Equipment. MIL-I-46058C, Insulating Compound, Electrical (For Coating Printed Circuit Assemblies). MIL-P-50884C, Printed Wiring, Flexible and Rigid-Flex. MIL-STD- 130G, Identification
41、Marking of U.S. Military Property. MIL-STD-202E Test Methods for Electronic and Electrical Component Parts. MI12-STD-454M, Standard General Requirements for Electronic Equipment. MIL-STD-889B, Dissimilar Metals. MIIL-STD-2000A, Standard Requirements for Soldered Electrical and Electronic Assemblies.
42、 MIL-STD-2036, General Requirements for Electronic Equipment Specifications. MIL-STD-5400, General Requirements for Electronic Equipment, Airborne. NAVSEA TE000-AB-GTP-010-1991, Parts Application and Reliability Information Manual for Navy Elec- tronic Equipment. ANSI publications are available from
43、 the Sales Department, American National Standards Institute, 11 West 42nd Street, 13th Floor, New York, NY 10036, USA. 3EIA publications are available from Global Engineering, 1990 M Street NW, Suite 400, Washington, DC, 20036, USA. 41EC publications are available from IEC Sales Department, Case Po
44、stale 131, 3 rue de VarembC, CH-1211, Genkve 20, Switzerland/ Suisse. IEC publications are also available in the United States from the Sales Department, American National Standards Institute, 11 West 42nd Street, 13th Floor, New York, NY 10036, USA. IEEE publications are available from the Institut
45、e of Electrical and Electronics Engineers, Service Center, 445 Hoes Lane, P.O. Box 1331, Piscataway, NJ 08855-1331, USA. 6MIL and NAVSEA publications are available from the Director, U.S. Navy Publications and Printing Service, Eastern Division, 700 Robbins Avenue, Philadelphia, PA 191 11, USA. 2 标准
46、分享网 w w w .b z f x w .c o m 免费下载 AND AIR-COOLED 10 SU MODULES IEEE Std 11 01.3-1 993 3. Definitions 3.1 alpha end. The end of the module nearest the lowest-numbered connector contact. 3.2 alpha key. The connector keying pin located at the alpha end of the module connector. 3.3 beta end. The end of t
47、he module farthest from the lowest-numbered connector contact. 3.4 beta key. The connector keying pin located at the beta end of the module connector. 3.5 chassis. A subrack that is in accordance with E C 50-. 3.6 frame. See: heatsink. 3.7 gravitational acceleration unit (g). A unit of acceleration
48、that is approximately 32.2 fth2 9.8 m/s2. 3.8 gamma key. The connector keying pin located at the center of the module connector, next to the guide pin. 3.9 guide pin. A pin used for guidance of the connector during module insertion and extraction. 3.10 guide rib. A rib provided for initial module al
49、ignment at the time of installation into the chassis module slot. For conduction-cooled modules only, guide ribs form the heat transfer paths to the chassis and the mounting for the module retainers at the alpha and beta ends of the module heatsink. 3.11 header. A structure attached to or integral to the top of the heatsink used for structural performance and marking. 3.12 heatsink. A part, also referred to as a frame, that serves both as a structural support and the principal thermal conduction medium. The PWB is attached to the heatsink. The heatsink spreads and conducts the