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1、IEEE Std 11 01.4-1 993 IEEE Standard for Military Module, Format E Form Factor Sponsor Bus Architecture Standards Committee o f the IEEE Computer Society Approved June 17, 1993 IEEE Standards Board Abstract: The mechanical GuIsign requirements ,a a military module, format E form factor are establish
2、ed. The specifications of dimensions and tolerances are intended to ensure the mechani- cal intermateability of military modules within associated subracks. Mechanical characteristics for military applications are also included. Keywords: backplane, module, module interface plane, printed wiring boa
3、rd (PWB), 396-pin connector, 250-pin connector The Institute of Electrical and Electronics Engineers, Inc. 345 East 47th Street, New York, NY 10017-2394, USA Copyright 0 1993 by the Institute of Electrical and Electronics Engineers, Inc. All rights reserved. Published 1993. Printed in the United Sta
4、tes of America ISBN 1-55937-349-0 No part of this publication may be reproduced in any form, in an electronic retrieval system or otherwise, without the prior wriften permission of the publisher. JEEE Standards documents are developed within the Technical Committees of the IEEE Societies and the Sta
5、ndards Coordinating Committees of the IEEE Standards Board. Members of the committees serve voluntarily and without compensation. They are not necessarily members of the Institute. The standards developed within IEEE represent a consensus of the broad expertise on the subject within the Institute as
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14、tion whatever to parties adopting the standards documents. (This introduction is not a part of IEEE Std 1101.4-1993, IEEE Standard for Military Module, Format E Form Factor.) The IEEE Computer Society Technical Committee on Microprocessors and Microcomputers found it appro- priate to form a separate
15、 IEEE standard for military and ruggedized applications based on a module with the same envelope as the Standard Hardware Acquisition and Reliability Program (SHARP) Standard Electronic Module (SEM) Format E. This standard is the result of a desire to develop a specification providing dimen- sions a
16、nd tolerances necessary to ensure mechanical function and interchangeability. This standard is a specification implementation and provides detailed dimensions and tolerances specific to the use of a 250-pin connector and a 396-pin connector. The specification covers dimensions of racks, mod- ules, p
17、rinted circuit boards, backplanes, and connector-related dimensions. It is not possible to acknowledge everyone who contributed to the development of this standard; however, the following individuals deserve special mention for their contributions: Harrison Beasley for his support during the initial
18、 phase of development and his support as BASC chair at the completion of the standard. Jim Lockwood who acted as the first draft editor during the earlier stages of the working group. Technical sup- port has been submitted by Andrew Brough, Eric Nickerson, Andrew Capobianco, Robert Fluhrer, Jim Mad-
19、 ison, Harry Andreas, Dennis Smith, and Dean Van De Walker. Extensive technical input has been submitted by Jim Simon. At the time this standard was completed, the 1101.4 Working Group had the following membership: Harry Andreas Andrew Capobianco Robert Fluhrer Ed Jacques Dave Kirk Ralph Lachenmaier
20、 Joseph Toy, Chair Andrew Brough, Editor Jim Lockwood David Maass Jim Madison Ernest Mardaga Karl McClure The following persons were on the balloting committee: Ray Alderman Harry Andreas Keith Anthony Donald Bennett Chris Bezirtzoglou Paul Bomll David Brearley John Brightwell Andrew Brough Clyde Ca
21、mp Andrew Capobianco Kim Clohessy David Cohen Jean-Jacques Dumont Bruce Dunlop Wilhelm Evertz Wayne Fischer Robert Fluhrer Julio Gonzalez-Sanz Frank Hom Edgar Jacques Thomas Kurihara Ralph Lachenmaier Klaus Mueller Steven Murphy Elwood Parsons Eric Nickerson Fred Sauer Jim Simon Dennis Smith Dean Va
22、n De Walker LCDR Robert Voigt L. M. Patnaik Brian Ramelson Gary Robinson Flavia Rosemberg Frederick Sauer Rudolf Schubert Vinnie Squitieri Hao Tang Michael Thompson Joesph Toy Joesph Trainor Robert Tripi Janusz Zalewski . 111 When the IEEE Standards Board approved this standard on June 17, 1993, it
23、had the following membership: Wallace S. Read, Chair Donald C. Loughry, Vice Chair Andrew G. Salem, Secretary Gilles A. Baril Clyde R. Camp Donald C. Fleckenstein Jay Forster* David F. Franklin Ramiro Garcia Donald N. Heirman Jim Isaak Ben C. Johnson Walter J. Karplus Lorraine C. Kevra E. G. “Al” Ki
24、ener Ivor N. Knight Joseph L. Koepfinger* D. N. “Jim” Logothetis *Member Emeritus Also included are the following nonvoting IEEE Standards Board liaisons: Satish K. Aggarwal James Beall Richard B. Engelman David E. Soffrin Stanley Warshaw Don T. Michael* Marco W. Migliaro L. John Rankine Arthur K. R
25、eilly Ronald H. Reimer Gary S. Robinson Leonard L. Tripp Donald W. Zipse Rachel Auslander IEEE Standards Project Editor iv Contents CLAUSE PAGE 1 . 2 . 3 . 4 . 5 . Overview 1 1.1 Scope . 1 1.3 Environmental requirements . 1 1.4 Terminology . 1 1.2 Purpose 1 References 2 Definitions 3 Module requirem
26、ents . 4 4.1 Module description . 4 4.2 Module construction . . 4 4.3 Clearances . 4.4 Module identification . 4 4.5 Thermal requirements . 4 4.6 Reliability 5 4.7 Module warp 5 4.8 Mechanical bonding 4.9 Personnel safety 4.10 Test points . 5 4.1 1 Module covers 5 4.12 EM1 considerations 4.13 PWB ch
27、aracteristics 5 4.14 Materials 6 4.15 Finishes and protective treatments . . . Module interface requirements . 7 5.1 Mechanical configuration 7 5.3 Module span 7 5.2 Module height . . 7 5.4 Module pitch . . 11 5.5 Module profile . 11 5.6 Module frame 11 5.7 Guide rib requirements . 5.8 Module header
28、 structure . 12 5.9 Connector . 5.10 Module keying . 14 15 5.12 Durability . 15 5.13 Module retainers . . 15 5.14 Insertion levers . 16 . 5.1 1 Lateral displacement V 6. Engineering notes 17 6.1 6.2 6.3 6.4 6.5 6.6 6.7 Backplane connectors . 17 Component layout . Weight Thermal considerations . Fram
29、e recommendations . Chassis dimensions. 17 vi 标准分享网 w w w .b z f x w .c o m 免费下载 IEEE Standard for Military Module, Format E Form Factor 1. Overview This standard is divided into six clauses. Clause 1 provides the scope and purpose of this standard as well as the mechanical characteristics ths stand
30、ard covers, the environmental requirements, and the terminology used. Clause 2 lists references to other standards that form a part of this standard. Clause 3 provides defini- tions of terms. Clause 4 describes the general requirements to which the module shall conform. Clause 5 describes the module
31、 interface requirements. Clause 6 contains information and recommendations that may be useful in the use of this standard. 1.1 Scope This standard establishes the design requirements for a military module, format E form factor. The require- ments herein serve to specify the mechanical design of the
32、module. This standard is designed for use in con- junction with other IEEE standards. 1.2 Purpose The purpose of this standard is the specification of dimensions and tolerances that will ensure the mechani- cal intermateability of military modules within associated subracks. In addition, mechanical
33、characteristics for military applications are also included. This standard covers the basic dimensions, frames, PWBs, mate- rials, assembly, and chassis interface of single-sided and double-sided military modules. 1.3 Environmental requirements The module shall meet the environmental requirements sp
34、ecified in IEEE Std 1156.1-1993. The perfor- mance level shall be specified by the procurement activity. This standard is primarily intended for military applications using performance levels 1 and 2 of IEEE Std 1156.1-1993, but does not exclude other applica- tions using other performance levels. 1
35、.4 Terminology The word shall indicates a mandatory requirement. For example, “Designers shall implement all such man- datory requirements to ensure interoperability with other IEEE Std 1101.3- 1993 conformant products.” The word should indicates flexibility of choice with a strongly preferred imple
36、mentation. The phrase it is recommended is used interchangeably with the key word should. The word may indicates flexibility of choice with no implied preference. Information on references can be found in clause 2. 1 IEEE S t d 1101.4-1993 IEEE STANDARD FOR MILITARY MODULE, 2. References The followi
37、ng publications form a part of this standard to the extent referenced herein. In the event of con- flict between the documents referenced herein and the contents of this standard, the contents of this standard will be considered a superseding requirement. Nothing in this document, however, supersede
38、s applicable laws and regulations unless a specific exemption has been obtained. ANSI/IPC D-275-1991, Design Standard for Rigid Printed Boards and Rigid Printed Board Assemblies.2 ANSI/IPC RB-276-1992, Qualification and Performance Specification for Rigid Printed Boards. ANSI Y 14.5M- 1982 (R1988),
39、American National Standard for Dimensioning and Tolerancing. EIA PN-2933 Rev B (23 April 1993), Two-Part High-Density Blade and Backplane Tuning Fork onnector. IEC 50, Second edition, International Electrotechnical Vocabulary, Terms and definitions for electronic pakaging. IEEE Std 1156.1-1993, IEEE
40、 Standard for Microcomputer Environmental Specifications for Computer module. MIL-A-8625E, Anodic Coatings for Aluminum and Aluminum Alloys.6 MIL-C-26074E, Coatings, Electroless Nickel Requirements For. MIL-C-28754D, Connectors, Electrical, Modular, and Component Parts, General Specification For. MI
41、L-HDBK-217E, Reliability Prediction of Electronic Equipment. MIL-I-46058C, Insulating Compound, Electrical (For Coating Printed Circuit Assemblies). MIL-P-50884C, Printed Wiring, Flexible and Rigid-Flex. MIL-STD-130G, Identification Marking of U.S. Military Property. MIL-STD-202F, Test Methods for E
42、lectronic and Electrical Component Parts. MIL-STD-454M, Standard General Requirements for Electronic Equipment. MIL-STD-889B, Dissimilar Metals. MIL-STD- 1389D, Design Requirements for Standard Electronic Modules. ANSI publications are available from the Sales Department, American National Standards
43、 Institute, 11 West 42nd Street, 13th Floor, New York, NY 10036, USA. 3EIA publications are available from Global Engineering, 1990 M Street NW, Suite 400, Washington, DC, 20036, USA. 41EC publications are available from IEC Sales Department, Case Postale 131, 3 rue de VarembC, CH-121 I, Genkve 20,
44、Switzerland/ Suisse. IEC publications are also available in the United States from the Sales Department, American National Standards Institute, 11 West 42nd Street, 13th Floor, New York, NY 10036, USA. IEEE publications are available from the Institute of Electrical and Electronics Engineers, Servic
45、e Center, 445 Hoes Lane, P.O. Box 1331, Piscataway, NJ 08855-1331, USA. 6MIL and NAVSEA publications are available from the Director, U.S. Navy Publications and Printing Service, Eastern Division, 700 Robbins Avenue, Philadelphia, PA 19111, USA. 2 标准分享网 w w w .b z f x w .c o m 免费下载 FORMAT E FORM FAC
46、TOR IEEE Std 11 01.4-1 993 MIL-STD-2000A, Standard Requirements for Soldering Electrical and Electronic Assemblies. NAVSEA TE000-AB-GTP-010-199 1, Parts Application and Reliability Information Manual for Navy Elec- tronic Equipment. NAVSEA TE000-AB-GTP-020- 1992, Environmental Stress Screening Requi
47、rements and Application for Navy Electronic Equipment. 3. Definitions 3.1 alpha end: The end of the module nearest the lowest-numbered contact. 3.2 beta end: The end of the module nearest the highest-numbered contact. 3.3 chassis: A subrack as specified in IEC 50. 3.4 direct air-impingement cooling:
48、 A way to implement cooling, using forced air across the components. 3.5 gravitational acceleration unit (g): A unit of acceleration that is approximately 32.2 ft/s2 9.8 m/s2. 3.6 guide rib: The alpha and beta ends of the module. These form the heat transfer paths and the mounting for the module ret
49、ainers and provide for initial module alignment. 3.7 insertiodextraction levers: A generic term meaning levers that insert and extract the module. 3.8 key code: An alpha or alphanumeric designator used to identify the style and angular position of the key- ing pins. 3.9 key pin: A hardware implementation that prevents mating of incompatible modules. 3.10 module: A plug-in unit per IEC 50. 3.11 module header: A structure attached to or integral to the top of the frame used for structural perfor- mance, marking, and component mounting. 3.12 module interface plane: An assig