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1、J IS JAPANESE INDUSTRIAL STANDARD Translated and Published by Japanese Standards Association JIS Z 3198-42003 Test methods for lead-free solders- Part 4 : Methods for solderability test by a wetting balance method and a contact angle method ICs 25.160.50 Reference number : JIS Z 3198-4 : 2003 (E) PR
2、OTECTED BY COPYRIGHT Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=Hong Kong Polytechnic Univ/9976803100 Not for Resale, 08/01/2009 04:28:45 MDTNo reproduction or networking permitted without license from IHS -,-,- 免费标准下载网( w w w . f r e e b z . n e t ) 免费标准
3、下载网( w w w . f r e e b z . n e t ) 无需注册, 即可下载 Z 3198-4 : 2003 Foreword This translation has been made based on the original Japanese Industrial Standard established by the Minister of Economy, Trade and Industry through deliberations at the Japanese Industrial Standards Committee according to the pr
4、oposal of establishing a Japanese Industrial Standard from The Japan Welding Engineering Society (JWES), with a draft of Industrial Standard based on the provision of Article 12 Clause 1 of the Industrial Standardization Law. Soldering is called HANDAZUm (Japanese), a technique to be used for mounti
5、ng electronic and elec- trical machinery and apparatus, communication equipment and the like and its use field is wide and expectation for high reliability of the connection is large. Though there are standards inside and outside Japan as well as International Standards like IEC or ISO, this Standar
6、d uses results of ?standardization of test methods and the like necessary for solder connection corresponding to the reduction of an environmental load? based on the research and devel- opment by contract of New Energy and Industrial Technology Development Organization. This Standard concerns the me
7、thods for solderability test (wetting balance method and a contact angle method) of lead-free solders which are environmentally friendly and is positioned as a standard for considering environment. Being in conformance with this Standard may come under the use of the following patent rights: Q Denom
8、ination of invention Patent: Plane direction detecting appliance a Denomination of invention Patent: Plane direction detecting appliance 0 Denomination of invention Patent: Contact angle measuring appliance Date of registration of the invention: August 16, 2002 Date of decision of grant a patenk Oct
9、ober 22, 2002 Date of decision of grant a patent: September 3, 2002 Besides, this description does not affect to any extent the validity, the scope and the like of the above patent rights. The holders of these patent rights give guarantee to the Japanese Industrial Standards Committee with respect t
10、o his willingness to permit anyone to exercise the relevant patent right under the nondis- criminatory and reasonable conditions. In this regard, however holders of other industrial properties related to this Standard are subject to permit their inventions? exercises in exactly same condition above
11、mentioned. Attention is drawn to the possibility that some parts of this Standard may conflict with a patent right, application for a patent after opening to the public, utility model right or application for registration of utility model after opening to the public which have technical properties.
12、The relevant Minister and the Japanese Industrial Standards Committee are not responsible for identifying the patent right, application for a patent after opening to the public, utility model right or application for registration of utility model after opening to the public which have the said techn
13、ical properties. JIS Z 3198 includes the following 7 parts with the general title Test methods for lead-free solders Part 1 :Methods for measuring of melting temperature ranges Part 2 : Methods for testing of mechanical characteristics-tensile test Part 3 : Methods for spread test Part 4 :Methods fo
14、r solderability test by a wetting balance method and a contact angle method Part 5 : Methods for tensile tests and shear tests OR solder joints Part 6 I Methods for 45Opull test of solder joints on QFP lead Part 7 : Methods for shear strength of solder joints on chip components Date of Establishment
15、: 2003-06-20 Date of Public Notice in Official Gazette: 2003-06-20 Investigated by: Japanese Industrial Standards Committee Standards Board Technical Committee on Welding JIS Z 3198-4 : 2003, First English edition published in 2003-12 Translated and published by: Japanese Standards Association 4-1-2
16、4, Akasaka, Minato-ku, Tokyo, 107-8440 JAPAN In the event of any doubts arising as to the contents, the original JIS is to be the final authority. O JCA 2003 All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electr
17、onic or mechanical, including photocopying and microfilm, without permission in writing from the publisher. Printed in Japan PROTECTED BY COPYRIGHT Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=Hong Kong Polytechnic Univ/9976803100 Not for Resale, 08/01/2009
18、 04:28:45 MDTNo reproduction or networking permitted without license from IHS -,-,- 免费标准下载网( w w w . f r e e b z . n e t ) 免费标准下载网( w w w . f r e e b z . n e t ) 无需注册, 即可下载 Z 3198-4 : 2003 Contents Page Introduction . 1 2 3 4 4.1 4.2 4.3 4.4 4.5 5 6 Scope Normative references Definitions Test method
19、 Outline of test Reagent and material . Apparatus and instruments . Procedure of test Test conditions . Recording results . Evaluation . Annex 1 (normative) Characteristics of apparatus in a wetting balance method . Annex 2 (normative) Characteristics of apparatus in a contact angle method . 1 1 1 1
20、 2 2 2 3 3 5 6 7 9 10 PROTECTED BY COPYRIGHT Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=Hong Kong Polytechnic Univ/9976803100 Not for Resale, 08/01/2009 04:28:45 MDTNo reproduction or networking permitted without license from IHS -,-,- 免费标准下载网( w w w . f r e e b z . n e t ) 免费标准下载网( w w w . f r e e b z . n e t ) 无需注册, 即可下载