JIS Z3198-1-2003 英文版 无铅焊剂的试验方法.第1部分熔化温度范围的测量方法1.pdf

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1、IS JAPANESE I NDUSTRIAL STANDARD Translated and Published by Japanese Sta nda rds Association JIS Z 3198-1:2003 Test methods for lead-free solders- Part 1 : Methods for measuring of melting temperature ranges ICs 25.160.50 Reference number : JIS Z 3198-1 : 2003 (E) PROTECTED BY COPYRIGHT Copyright J

2、apanese Standards Association Provided by IHS under license with JSALicensee=Hong Kong Polytechnic Univ/9976803100 Not for Resale, 08/01/2009 04:29:35 MDTNo reproduction or networking permitted without license from IHS -,-,- 免费标准下载网( w w w . f r e e b z . n e t ) 免费标准下载网( w w w . f r e e b z . n e t

3、 ) 无需注册, 即可下载 Z 3198-1 : 2003 Foreword This translation has been made based on the original Japanese Industrial Standard established by the Minister of Economy, Trade and Industry through deliberations at the Japanese Industrial Standards Committee according to the proposal of establishing a Japanes

4、e Industrial Standard from The Japan Welding Engineering Society (JWES), with a draft, of Industrial Standard based on the provision of Article 12 Clause 1 of the Industrial Standardization Law. Soldering is called HANDAZUKE (Japanese), a technique to be used for mounting electronic and electrical m

5、achinery and apparatus, communication equipment and the like and its use field is wide and expectation for high reliability of the connection is large. Though there are standards inside and outside Japan as well as International Standards like IEC or ISO, this Standard uses results of ?standardizati

6、on of test methods and the like necessary for solder connection corresponding to the reduction of an environmental load? based on the research and development by contract of New Energy and Industrial Technology Development Organization. This Standard concerns the methods for measuring a melting temp

7、erature range of lead- free solders which are environmentally friendly and is positioned as a standard for considering environment. Attention is drawn to the possibility that some parts of this Standard may conflict with a patent right, application for a patent after opening to the public, utility m

8、odel right or application for registration of utility model after opening to the public which have technical properties. The relevant Minister and the Japanese Industrial Standards Committee are not responsible for identifying the patent right, application for a patent after opening to the public, u

9、tility model right or application for registration of utility model after opening to the public which have the said technical properties. JIS Z 3198 includes the following 7 parts with the general title Test methods for lead- free solders Part 1 : Methods for measuring of melting temperature ranges

10、Part 2 : Methods for testing of mechanical characteristics-tensile test Part 3 : Methods for spread test Part 4 : Methods for solderability test by a wetting balance method and a contact angle Part 5 : Methods for tensile tests and shear tests on solder joints Part 6 : Methods for 45?pull test of so

11、lder joints on QFP lead Part 7 : Methods for shear strength of solder joints on chip components method Date of Establishment: 2003-06-20 Date of Public Notice in Official Gazette: 2003-06-20 Investigated by: Japanese Industrial Standards Committee Standards Board Technical Committee on Welding TIS Z

12、 3198-1 : 2003, First English edition published in 2003-12 Translated and published by: Japanese Standards Association 4-1-24, Akasaka, Minato-ku, Tokyo, 107-8440 JAPAN In the event of any doubts arising as to the contents, the original JIS is to be the final authority. O JSA 2003 All rights reserve

13、d. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from the publisher. Printed in Japan PROTECTED BY COPYRIGHT Copyright Japanese Standards

14、 Association Provided by IHS under license with JSALicensee=Hong Kong Polytechnic Univ/9976803100 Not for Resale, 08/01/2009 04:29:35 MDTNo reproduction or networking permitted without license from IHS -,-,- 免费标准下载网( w w w . f r e e b z . n e t ) 免费标准下载网( w w w . f r e e b z . n e t ) 无需注册, 即可下载 2 3

15、198-1 : 2003 Contents Page Introduction . 1 Scope 2 Normative references 3 Definitions 4 Summary of test 5 Fusion start temperature . 5.1 Test method 5.2 Apparatus and equipment 5.2.1 DSC apparatus and DTA apparatus 5.2.2 Appliance . 5.3 5.4 5.5 5.6 5.7 6 6.1 6.2 6.3 6.4 6.5 Calibration of temperatu

16、re Sample . Procedure Method of obtaining fusion start temperature . Rounding off of numerical value . Solidification start temperature . Test method Apparatus and equipment Calibration of temperature Pretreatment of sample . Procedure 6.5.1 Reference contact point 6.5.2 Measurement 6.6 Method for o

17、btaining solidification start temperature . 6.7 Rounding off of numerical value . 7 Recording Recording of fusion start temperature Recording of solidification start temperature 7.1 7.2 1 1 1 1 2 2 2 2 2 2 3 3 3 3 4 4 4 4 5 5 5 5 5 5 6 6 6 6 PROTECTED BY COPYRIGHT Copyright Japanese Standards Associ

18、ation Provided by IHS under license with JSALicensee=Hong Kong Polytechnic Univ/9976803100 Not for Resale, 08/01/2009 04:29:35 MDTNo reproduction or networking permitted without license from IHS -,-,- 免费标准下载网( w w w . f r e e b z . n e t ) 免费标准下载网( w w w . f r e e b z . n e t ) 无需注册, 即可下载 JAPANESE I

19、NDUSTRIAL STANDARD JIS Z 3198-1 : 2003 Test methods for lead-free solders- Part 1 : Methods for measuring of melting temperature ranges Introduction This Japanese Industrial Standard specifies the methods for mea- suring of melting temperature ranges of lead-free solders based on occupational re- su

20、lts by contract of New Energy and Industrial Technology Development organization concerning “the standardization of test methods and the like necessary for solder connection corresponding to the decrease of an environmental load” carried out in 2000 and 2001. 1 Scope This Standard specifies the meth

21、ods for measuring of melting tempera- ture ranges of lead-free solders used principally for connection of wiring, connection of parts and the like of electrical machinery and apparatus, electronic apparatus, communication equipment and the like. JIS C 1601 JIS C 1605 JIS K 7121 JIS K 8034 JIS R 1301

22、 JIS R 2701 JIS Z 3001 JIS Z 8401 JIS Z 8704 2 Normative references The following standards contain provisions which, through reference in this Standard, constitute provisions of this Standard. The most recent editions of the standards (including amendments) indicated below shall be applied. Indicat

23、ing thermoelectric thermometers Minera2 insulated thermocouples Testing methods for transition temperatures of plastics Acetone Porcelain crucibles for chemical analysis Graphite crucible and its accessories Welding terms Guide to the rounding of numbers Temperature measurement-Electrical methods 3

24、Definitions 3001 and the following definitions apply: a) For the purposes of this Standard, the definitions given in JIS Z lead-free solder It is the generic term of “a tin based solder” not containing lead as an alloy component. It is a solder not containing lead for a use corre- sponding to that o

25、f “a tin-lead based solder”, which is used for mounting an elec- trical, electronic, communication equipment and the like. fusion start temperature A temperature at which a lead-free solder starts to melt. It is generally marked as a solidus temperature. c) solidification start temperature A tempera

26、ture at which solidification of b) lead-free solder starts. It is generally marked as a liquidus temperature. PROTECTED BY COPYRIGHT Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=Hong Kong Polytechnic Univ/9976803100 Not for Resale, 08/01/2009 04:29:35 MDTNo

27、 reproduction or networking permitted without license from IHS -,-,- 免费标准下载网( w w w . f r e e b z . n e t ) 免费标准下载网( w w w . f r e e b z . n e t ) 无需注册, 即可下载 2 Z 3198-1 : 2003 4 Summary of test The fusion temperature range of lead-free solder (hereafter referred to as “solder”) is marked by a fusion

28、 start temperature and a solidification start temperature. The fusion start temperature is measured by using a differen- tial scanning calorimetry (DSC) or a differential thermal analysis (DTA) and fur- ther a solidification start temperature is measured by using the cooling curve of a fused solder.

29、 5 Fusion start temperature 5.1 ing a) b) 5.2 Test method A test method shall be in accordance with either of the follow- methods: Differential scanning calorimetry (hereafter referred to as “DSC”) For a differential scanning calorimetry, an input-compensating DSC and a heat flux DSC shall be adopte

30、d. Differential thermal analysis (hereafter referred to as “DTA”) Apparatus and equipment The apparatus and equipment to be used for a test shall be principally in accordance with JIS K 7121, and shall be as follows: 5.2.1 DSC apparatus and DTA apparatus The apparatus shall have two con- tainer hold

31、ers whose heat capacities are equal and have a structure capable of be- ing heated and cooled by the same heat exchange conditions. The input-compensating DSC shall have a structure capable of measuring a dif- ference of applied heat energy per unit time between a sample and a reference ma- terial s

32、o that a temperature of the sample and that of the reference materials become the same. The heat flux DSC shall have a structure so that a temperature difference be- tween the sample and the reference material is proportional to a difference between inputs in heat energy per time. a) Heating velocit

33、y A heating velocity shall be 1 “C to 10 “C per min and its precision shall be within k 10 %. Gas inflow device A gas inflow device shall have a structure capable of making a gas come around the sample. Container A container shall be made of a material of a high thermal conduc- tivity which is free

34、from being eroded with the sample. The container made of aluminium is generally used. Recorder A recorder shall be able to continuously record a DSC curve or a DTA curve. b) c) d) e) Noise level A noise level shall be S 1/10 of a peak height. 5.2.2 Appliance An appliance shall be as follows: a) Gas

35、flow meter A gas flow meter shall be able to measure a range of 10 ml to 50 ml per min. Scale A scale shall be 0.1 mg and upward in sensitivity. b) PROTECTED BY COPYRIGHT Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=Hong Kong Polytechnic Univ/9976803100 Not for Resale, 08/01/2009 04:29:35 MDTNo reproduction or networking permitted without license from IHS -,-,- 免费标准下载网( w w w . f r e e b z . n e t ) 免费标准下载网( w w w . f r e e b z . n e t ) 无需注册, 即可下载

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