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1、 PERFORMANCE SPECIFICATION SHEET PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATEDTHROUGH HOLES, FOR SOLDERED PART MOUNTING This specification is approved for use by all Departments and Agencies of the Department of Defense. The req
2、uirements for acquiring the product described herein shall consist of this specification sheet and MILPRF31032. 1. SCOPE 1.1 Scope. This specification covers the generic performance requirements for rigid, multilayered (three or more conductor layers) printed wiring boards (hereafter designated prin
3、ted board) with plated holes, that will use soldering for component/part mounting (see 6.1.1). 1.2 Classification. Printed boards are classified as type 3 (rigid multilayer board without blind or buried vias), or type 4 (rigid multilayer board with blind or buried vias), as specified (see 6.2). 2. A
4、PPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has bee
5、n made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this specification, whether or not they are listed. 2.2 Government documents. The following specification forms a part of this docu
6、ment to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MILPRF31032 Printed Circuit Board/Printed Wiring Board, General Specification for. (Copies of these documents are avail
7、able online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 191115094.) Comments, suggestions, or questions on this document should be addressed to Defense Supply Center, Columb
8、us, ATTN: DSCCVAC, P.O. Box 3990, Columbus, OH 432183990, or emailed to 5998.Documentsdla.mil. Since contact information can change, you may want to verify the currency of this address information using the ASSIST Online database at http:/assist.daps.dla.mil. AMSC N/A FSC 5998 The document and proce
9、ss conversion measures necessary to comply with this revision shall be completed by 1 October 2009. MILPRF31032/1B w/AMENDMENT 4 4 July 2009 SUPERSEDING MILPRF31032/1B w/AMENDMENT 3 15 April 2008 METRIC MIL-PRF-31032/1B w/AMENDMENT 4 2 2.3 Non-Government publications. The following documents form a
10、part of this document to the extent specified herein. Unless otherwise specified, the issues of the documents are those cited in the solicitation or contract. ASTM INTERNATIONAL (ASTM) ASTM B567 Standard Test Method for Measurement of Coating Thickness by the Beta Backscatter Method. ASTM B568 Stand
11、ard Test Method for Measurement of Coating Thickness by XRay Spectrometry. (Application for copies should be addressed to the ASTM International, 100 Barr Harbor Drive, P. O. Box C700, West Conshohocken, PA 194282959 or http:/www.astm.org.) IPC ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES (IPC) IPC
12、2221 Generic Standard on Printed Board Design. IPC2222 Sectional Design Standard for Rigid Organic Printed Boards. IPCA600 Acceptability of Printed Boards. IPCTM650 Test Methods Manual. JSTD003 Solderability Tests for Printed Boards. (Application for copies should be addressed to the IPC - Associati
13、on Connecting Electronics Industries, 3000 Lakeside Drive, Suite 309 S, Bannockburn, IL 600151249 or http:/www.ipc.org.) (Non-Government standards and other publications are normally available from the organizations that prepare or distribute the documents. These documents also may be available in o
14、r through libraries or other informational services.) 2.4 Order of precedence. Unless otherwise noted herein or in contract, in the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document, however, su
15、persedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Printed board detail requirements. Printed boards delivered under this specification shall be in accordance with the requirements as specified herein, and documented in the printed board procu
16、rement documentation. 3.1.1 Conflicting requirements. The order of precedence of conflicting requirements shall be in accordance with MILPRF31032. 3.1.2 Reference to printed board procurement documentation. For the purposes of this specification, when the term “specified“ is used without additional
17、reference to a specific location or document, the intended reference shall be to the applicable printed board procurement documentation. 3.2 Qualification. Printed boards furnished under this specification shall be technologies that are manufactured by a manufacturer authorized by the qualifying act
18、ivity for listing on the applicable qualified manufacturers list before contract award (see 4.2 and 6.3). 3.3 Design (see 3.1 and 6.2). Printed boards shall be of the design specified. Unless otherwise noted herein, if individual design parameters are not specified in the printed board procurement d
19、ocumentation, then the baseline design parameters shall be as specified in IPC2221 and IPC2222, type 3 or type 4, performance class 3. Test coupons shall be as specified in the applicable design standard and shall reflect worst-case design conditions of the printed boards that they represent. MIL-PR
20、F-31032/1B w/AMENDMENT 4 3 3.4 Printed board materials. All materials used in the construction of compliant printed boards shall comply with the applicable specifications referenced in the printed board procurement documentation. If materials used in the production of printed boards are not specifie
21、d, then it is the manufacturers responsibility to use materials which will meet the performance requirements of this specification sheet. Acceptance or approval of any printed board material shall not be construed as a guarantee of the acceptance of the completed printed board. 3.4.1 Tin finishes. U
22、se of pure tin, as an underplate or final finish, is prohibited both internally and externally. Tin content of printed wiring board finishes or solders shall not exceed 97 percent, by mass. Tin shall be alloyed with a minimum of 3 percent lead, by mass (see 6.6). 3.5 External visual and dimensional
23、requirements. Printed board test specimens (the finished printed boards or supporting test coupons, as applicable) shall conform to the requirements specified in 3.5.1 through 3.5.5.5 as applicable. Scratches, dents, and tool marks shall not bridge or expose signal conductors, expose base metal, exp
24、ose or disrupt reinforcement fibers, reduce dielectric properties, and reduce spacing below the minimum requirements herein. IPCA600 contains figures, illustrations, and photographs that can aid in the visualization of externally observable accept/reject conditions of test specimens. If a condition
25、is not addressed herein, or specified in the printed board procurement documentation, it shall comply with the class 3 criteria of IPCA600. 3.5.1 Base material. 3.5.1.1 Edges of base material. Burrs, chips, delaminations, haloing, nicks, and other penetrations along the base material edges of comple
26、ted printed boards shall be acceptable provided the defect does not reduce the edge spacing specified by more than 50 percent. 3.5.1.2 Surface imperfections. Surface imperfections (such as cuts, dents, pits, scratches, or exposed reinforcement material fibers) shall be acceptable providing the follo
27、wing conditions are met: a. The imperfections do not bridge between conductors. b. The dielectric spacing between the imperfection and a conductor is not reduced below the specified minimum conductor spacing requirements. 3.5.1.3 Subsurface imperfections. Subsurface imperfections (such as blistering
28、, delamination, foreign inclusions, haloing) shall be acceptable providing the following conditions are met: a. The imperfections do not bridge more than 25 percent of the distance between conductors or plated-through holes and vias. No more than two percent of the printed board area on each side sh
29、all be affected. b. The imperfections do not reduce conductor or dielectric spacing below the specified minimum requirements. c. The imperfections do not propagate as a result of testing (such as rework simulation, resistance to soldering heat, or thermal shock). d. The longest dimension of any sing
30、le imperfection is no greater than 0.80 mm (.032 inch). In non-circuitry areas, the maximum size shall not be greater than 2.00 mm (.079 inch) in the longest dimension or 0.01 percent of the printed board area, maximum. NOTE: Color variations or mottled appearance in bond enhancement treatments shal
31、l be acceptable. MIL-PRF-31032/1B w/AMENDMENT 4 4 3.5.2 Conductor pattern. 3.5.2.1 Annular ring, external. The external annular ring shall be as specified. Unless otherwise specified, the external annular ring may have, in isolated areas, a 20 percent reduction of the specified external annular ring
32、 due to defects such as pits, dents, nicks, or pinholes. 3.5.2.2 Bonding of conductor to base material and lifted lands. There shall be no peeling or lifting of any land or conductor patterns from the base material. The completed printed board shall not exhibit any lifted land. (NOTE: See 3.6.11 for
33、 allowances for the acceptable lifting of terminal pads, i.e. lifted lands, following the resistance to soldering heat, rework simulation, and thermal shock testing.) 3.5.2.3 Conductor imperfections. The conductor pattern shall contain no cracks, splits, or tears. Unless otherwise specified, any com
34、bination of edge roughness, nicks, pinholes, cuts, or scratches exposing the base material shall not reduce each conductor width by more than 20 percent of its minimum specified width. There shall be no occurrence of the 20 percent reductions greater than 13.0 mm (.51 inch) or 10 percent of a conduc
35、tor length, whichever is less. 3.5.2.4 Conductor finish. The conductor finish shall be as specified. 3.5.2.4.1 Coverage. The conductor finish shall completely cover the exposed conductor pattern. Complete coverage does not apply to the vertical conductor edges. 3.5.2.4.2 Whiskers. There shall be no
36、whiskers of solder or other platings on the surface of the conductor pattern. 3.5.2.5 Conductor spacing. Conductor spacing shall be as specified. 3.5.2.6 Conductor width. Conductor width shall be as specified. 3.5.3 Dimensions. The completed printed board shall meet the dimensional requirements spec
37、ified. The dimensional requirements include items such as cutouts, overall thickness, periphery, and other design features as specified. 3.5.4 Hole pattern accuracy. The size and location of the hole pattern in the printed board shall be as specified. 3.5.5 Solder mask. The cured solder mask shall n
38、ot exhibit any chalking, crazing, peeling, skipping or skip coverage, softening, swelling, or wrinkles in excess of the limits specified herein. Unless otherwise specified, the solder mask conditions below shall apply. 3.5.5.1 Coverage. Solder mask coverage imperfections (such as blisters, skips, an
39、d voids) shall be acceptable providing the following conditions are met: a. The solder mask imperfection shall not expose two adjacent conductors whose spacing is less than the electrical spacing required for the voltage range and environmental condition specified in the applicable design standard.
40、b. In areas containing parallel conductors, the solder mask imperfection shall not expose two isolated conductors whose spacing is less than 0.5 mm (.02 inch) unless one of the conductors is a test point or other feature area which is purposely left uncoated for subsequent operations. c. The exposed
41、 conductor shall not be bare copper. d. The solder mask imperfection does not expose tented via holes. MIL-PRF-31032/1B w/AMENDMENT 4 5 3.5.5.2 Discoloration. Discoloration of metallic surfaces under the cured solder mask is acceptable. 3.5.5.3 Registration. The solder mask shall be registered to th
42、e land or terminal patterns in such a manner as to meet the requirements specified. If no requirements are specified, the following apply: a. Unless otherwise specified, solder mask shall not encroach onto surface mount lands. b. Solder mask misregistration onto plated-through component hole lands (
43、plated-through holes to which solder connections are to be made) shall not reduce the external annular ring below the specified minimum requirements. c. Solder mask shall not encroach into plated-through hole barrels or onto other surface features (such as connector fingers or lands of unsupported h
44、oles) to which solder connections will be made. d. Solder mask is permitted in plated-through holes or vias in which no lead is to be soldered. e. Test points which are intended for assembly testing shall be free of solder mask unless a partial coverage allowance is specified. 3.5.5.4 Thickness. Sol
45、der mask thickness shall be as specified. 3.5.5.5 Solder mask cure. The cured solder mask coating shall not exhibit tackiness, blistering, or delamination. 3.6 Microsection requirements. Printed board test specimens (production printed boards or test coupons) shall conform to the requirements in 3.6
46、.1 through 3.6.12, as applicable (see figure 1). Blind, buried, and through vias shall meet the requirements of plated-through holes (see 6.5). Barrel cracks, butt plating joints, circumferential separations, corner cracks, and cracked copper plating shall not be acceptable. IPCA600 contains figures
47、, illustrations, and photographs that can aid in the visualization of internally observable accept/reject conditions of microsectioned test specimens. If a condition is not addressed herein, or specified on the printed board procurement documentation, it shall comply with the class 3 criteria of IPC
48、A600. 3.6.1 Annular ring, internal. The minimum internal annular ring shall be as specified. 3.6.2 Conductor finish thickness (plating or coating). The plating or coating thickness of the conductor finish shall be as specified. 3.6.3 Conductor thickness. The conductor thickness shall be as specified
49、 (see 3.1). 3.6.3.1 Minimum thickness of metal foil with copper plating conductors (typical of external multilayer and internal for sequential laminated multilayer designs). When a conductor thickness is specified, the conductor thickness (metal foil and copper plating) shall be equal to or greater than the specified thickness. When a conductor thickness with tolerance is specified, the conductor thickness (metal foil and copper plating) shall be within the specified tolerance for the specified thickness. If only a starting me