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1、SAE Technical Standards Board Rules provide that: “This report is published by SAE to advance the state of technical and engineering sciences. The use of this report is entirely voluntary, and its applicability and suitability for any particular use, including any patent infringement arising therefr
2、om, is the sole responsibility of the user.” SAE reviews each technical report at least every five years at which time it may be reaffirmed, revised, or cancelled. SAE invites your written comments and suggestions. QUESTIONS REGARDING THIS DOCUMENT: (724) 772-8512 FAX: (724) 776-0243 TO PLACE A DOCU
3、MENT ORDER; (724) 776-4970 FAX: (724) 776-0790 SAE WEB ADDRESS http:/www.sae.org Copyright 1988 Society of Automotive Engineers, Inc. All rights reserved.Printed in U.S.A. SURFACE VEHICLE 400 Commonwealth Drive, Warrendale, PA 15096-0001 STANDARD Submitted for recognition as an American National Sta
4、ndard J1213/2 ISSUED OCT88 Issued1988-10 GLOSSARY OF RELIABILITY TERMINOLOGY ASSOCIATED WITH AUTOMOTIVE ELECTRONICS ForewordThis Document has not changed other than to put it into the new SAE Technical Standards Board Format. This glossary has been compiled to assist, by serving as a reference, in t
5、he communication between the automotive electronics engineer and the reliability engineer. 1.ScopeThis compilation of terms, acronyms and symbols was drawn from usage which should be familiar to those working in automotive electronics reliability. Terms are included which are used to describe how it
6、ems, materials and systems are evaluated for reliability, how they fail, how failures are modeled and how failures are prevented. Terms are also included from the disciplines of designing for reliability, testing and failure analysis as well as the general disciplines of Quality and Reliability Engi
7、neering. This glossary is intended to augment SAE J1213, Glossary of Automotive Electronic Terms. 2.References 2.1Applicable PublicationsThe following publications form a part of this specification to the extent specified herein. Unless otherwise indicated, the latest version of SAE publications sha
8、ll apply. 2.1.1SAE PUBLICATIONAvailable from SAE, 400 Commonwealth Drive, Warrendale, PA 15096-0001. SAE J1213Glossary of Automotive Electronic Terms SAE AE-9 1987Automotive Electronics Reliability Handbook 2.2Related PublicationsA listing of applicable military and other organizational reference do
9、cuments, from which many of these terms and definitions were drawn, is provided as a source of alternate or related definitions. Military MIL-STD-105DSampling Procedures and Tables for Inspection by Attributes MIL-STD-202ETest Methods for Electronic and Electrical Component Parts MIL-HDBK-217DReliab
10、ility Prediction of Electronic Equipment MIL-STD-280ADefinitions of Item Levels, Item Exchangeability, Models, and Related Terms MIL-STD-414Sampling Procedures and Tables for Inspection by Variables for Percent Defective MIL-STD-756BReliability Models and Prediction MIL-STD-781CReliability Design Qu
11、alification and Production Acceptance Tests Experimental SAE J1213/2 Issued OCT88 -2- MIL-STD-790BReliability Assurance Program for Electronic Parts Specification MIL-STD-810CEnvironmental Test Methods MIL-STD-883BTest Methods and Procedures for Microelectronics MIL-STD-1313Microelectronics Terms an
12、d Definitions MIL-Q-9858AQuality Program Requirements AR-92Quality Program Requirements MIL-S-195001Semiconductor Devices, General Specification for MIC M38510DMicrocircuits, General Specifications for MIL-STD-470Maintainability Program Requirements for Systems and Equipments MIL-STD-471AMaintainabi
13、lity Verification/Demonstration/Evaluation MIL-HDBK-472Maintainability Prediction MIL-STD-891Contractor Parts Control and Standardization Program MIL-STD-701Preferred and Guidance List of Semiconductor Devices MIL-STD-198ASelection and Use of Capacitors MIL-STD-199BSelection and Use of Resistors MIL
14、-STD-1562List of Standard Microcircuits MIL-STD-976Certification Requirements for JAN Microcircuits EIA Reliability Bulletin No. IA General Guide for Technical Reporting of Electronic Reliability Measurement Reliability Bulletin No. 4AReliability Qualifications Reliability Bulletin No. 5Equipment Re
15、liability Specification Guideline Reliability Bulletin No. 10Selection and Validation of Low Population and/or State of the Art Parts Reliability Bulletin No. 9Failure Mode and Effects Analyses Reliability Bulletin No. 8Equipment Burn-In Engineering Bulletin No. 17User Guidelines for Quality and Rel
16、iability Assurance of LSI Components Engineering Bulletin No. 11User Guidelines for Microelectronic Reliability Estimation JEDEC Standard No. 22Test Methods and Procedures for Solid State Devices Used in Transportation/ Automotive Applications Other ASQC 1973Glossary and Tables for Statistical Quali
17、ty Control ASQC Procurement Quality Control - 2nd Edition ANSI/ASQC A3-1978Quality Systems Terminology ANSI/ASQC A2-1978Terms, Symbols and Definitions for Acceptance Sampling ANSI/ASQC A1-1978Definitions, Symbols, Formulas and Tables for Control Charts How to Speak Fluent Quality- National Semicondu
18、ctor Co. RDH 376Reliability Design Handbook - Reliability Analysis Center WPS-1Analysis Techniques for Mechanical Reliability - Reliability Analysis Center 1987 Desk Manual- Microelectronic Manufacturing and Testing The American Heritage Dictionary- 2nd College Edn. 1982 Houghton Mifflin Co. 3.Defin
19、itions 3.1Accelerated Life TestA life test under test conditions that are more severe than usual operating conditions. It is necessary that a relationship between test severity and the probability distribution of life be ascertainable. 3.2Acceleration Factor a.The factor by which the failure rate ca
20、n be increased by an increased environmental stress. b.The ratio between the times necessary to obtain the same portion of failure in two equal samples under two different sets of stress conditions, involving the same failure modes and mechanisms. SAE J1213/2 Issued OCT88 -3- 3.3Accept/reject TestA
21、test, the result of which will be the action to accept or reject something, for example, an hypothesis or a batch of incoming material. 3.4Acceptable Quality Level (AQL)The maximum percent defective which can be considered satisfactory as a process average, or the percent defect whose probability of
22、 rejection is designated by . 3.5Acceptance NumberThe largest number of defects that can occur in an acceptance sampling plan and still have the lot accepted. 3.6Acceptance Sampling PlanAn accept/reject test whose purpose is to accept or reject a lot of items or material. 3.7AccessibilityA measure o
23、f the relative ease of admission to the various areas of an item. 3.8Achieved ReliabilityThe reliability demonstrated at a given point in time under specified conditions of use and environment. 3.9Activation Energy a. The energy level at which a specific microelectronic failure mechanism becomes act
24、ive (in electron volts). b. The slope of the time temperature regression line in the Arrhenius equation (in electron volts). 3.10 Active ElementA part that converts or controls energy, for example, transistor, diode, electron tube, relay. 3.11 Active Element GroupAn active element and its associated
25、 supporting (passive) parts, for example, an amplifier circuit, a relay circuit, a pump and its plumbing and fittings. 3.12 AgingThe effect whereby the probability density function of strength is changed (strength is reduced) with time. 3.13 AllocationThe process of assigning reliability requirement
26、s to individual units to attain the desired system reliability. 3.14 Alpha Particle Induced Soft ErrorsIntegrated circuit memory transient errors due to emission of alpha particles during radioactive decay of uranium or thorium contamination in the IC packaging material. 3.15 AmbientUsed to denote s
27、urrounding, encompassing, or local conditions. Usually applied to environments, for example, ambient temperature, ambient pressure. 3.16 ApportionmentSynonym of Allocation. 3.17 Arithmetic MeanThe arithmetic mean of n numbers is the sum of the n numbers, divided n. 3.18 Arrhenius ModelA mathematical
28、 representation of the dependence of failure rate on absolute temperature and activation energy. The model assumes that degradation of a performance parameter is linear with time with the failure rate a function of temperature stress. The temperature dependence is taken to be the exponential functio
29、n: SAE J1213/2 Issued OCT88 -4- (Eq. 1) where: 1 = mean time to failure at T1 2 = mean time to failure at T2 T = junction temperature in K E = activation energy in eV k = Boltzmans constant (8.617 105 eV/K) 3.19 Arrhenius Acceleration FactorThe acceleration factor F is the factor by which the time t
30、o fail can be reduced by increased temperature. (Eq. 2) 3.20 Assessment a.A critical appraisal, including qualitative judgments about an item, such as importance of analysis results, design criticality and failure effect. b.The use of test data and/or operational service data to form estimates of po
31、pulation parameters and to evaluate the precision of these estimates. 3.21 AttributeA term used to designate a method of measurement whereby units are examined by noting the presence (or absence) of some characteristic or attribute in each of the units in the group under consideration and by countin
32、g how many units do (or do not) possess it. Inspection by attributes can be of two kinds either the unit of product is classified simply as defective or nondefective, or the number of defects in the unit of product is counted, with respect to a given requirement or set of requirements. 3.22 Attribut
33、e TestingTesting to evaluate whether or not an item possesses a specified attribute. 3.23 Automatic Test Equipment (ATE)Test equipment that contains provisions for automatically performing a series of pre programmed tests. 3.24 Availability (Operational Readiness)The probability that at any point in
34、 time the system is either operating satisfactorily or ready to be placed in operation on demand when used under stated conditions. 3.25 AverageA general term. It often means arithmetic mean, but can refer to s-expected value, median, mode, or some other measure of the general location of the data v
35、alues. 3.26 Average Outgoing Quality (AOQ)The average quality of outgoing product after 100% inspection of rejected lots, with replacement by good units of all defective units found in inspection. 3.27 Average Outgoing Quality Limit (AOQL)The maximum average outgoing quality (AOQ) for a sampling pla
36、n. 3.28 Bake-outTo subject an unsealed item to an elevated temperature to drive out moisture and unwanted gases prior to other process or sealing. 3.29 Bathtub CurveA plot of failure rate of an item (whether repairable or not) vs. time. The failure rate initially decreases, then stays reasonably con
37、stant, then begins to rise rather rapidly. It has the shape of a bathtub. Not all items have this behavior. 12 exp E k()1 T21 T1()= F12 E k()1 T21 T2()exp= SAE J1213/2 Issued OCT88 -5- 3.30 Bias a.The difference between the s-expected value of an estimator and the value of the true parameter. b.Appl
38、ied voltage. 3.31 Binomial DistributionThe probability of r, or fewer successes in n independent trials, given a probability of success p in a single trial, is given by the cumulative binomial distribution: (Eq. 3) 3.32 Binomial FunctionThe probability of exactly x successes in n independent trials,
39、 given a probability of success p in a single trial, is given by the binomial probability function: (Eq. 4) 3.33 Bond a.An interconnection which performs a permanent electrical and/or mechanical function. b.To join with adhesives. 3.34 Bond Lift OffThe failure mode whereby the bonded lead separates
40、the surface to which it was attached. 3.35 Bond StrengthIn wire bonding, the pull force at rupture of the bond interface. 3.36 Breadboard ModelA preliminary assembly of parts to test the feasibility of an item or principle without regard to eventual design or form. Usually refers to a small collecti
41、on of electronic parts. 3.37 Burn-inThe initial operation of an item to stabilize its characteristics, and to minimize infant mortality in the field. 3.38 Capability a.A measure of the ability of an item to achieve mission objectives given the conditions during the mission. b.The spread of performan
42、ce of a process in a state of statistical control; the amount of variation from common causes identified after all special causes of variation have been eliminated. 3.39 C ChartControl chart for number of nonconformities observed in some specified inspection. The units should be alike in size and in
43、 the apparent likelihood of the existence of the nonconformity, in order that the area of opportunity for nonconformity be constant from unit to unit. 3.40 Central LineThe line on a control chart that represents the average or median value of the items being plotted. It is shown as a solid line. 3.4
44、1 CheckoutTests or observations on an item to determine its condition or status. 3.42 Coefficient Of VariationThe standard deviation divided by the mean, multiplied by 100 and expressed as a percentage. 3.43 Complexity LevelA measure of the number of active elements required to perform a specific sy
45、stem function. Pr xr()F (r; p, n) n x px 1p()n x x0= r = x p n,;() n x px 1p()n x x,= 0, 1, 2, n 0p1 = SAE J1213/2 Issued OCT88 -6- 3.44 ComponentA self-contained combination of parts, subassemblies, or assemblies which perform a distinctive function in the overall operation of an equipment. Often u
46、sed interchangeably with (electronic) part. 3.45 ConfidenceA specialized statistical term referring to the reliance to be placed in an assertion about the value of a parameter of a probability distribution. 3.46 Confidence Coefficient a.A measure of assurance that a statement based upon statistical
47、data is correct. b.The probability that an unknown parameter lies within a stated interval or is greater or less than some stated value. 3.47 Confidence IntervalThe interval within which it is asserted that the parameter of a probability distribution lies. 3.48 Confidence Level (Eq. 5) where: a = th
48、e risk (%) 3.49 Confidence LimitA bound of a confidence interval. 3.50 ConsistencyA statistical term relating to the behavior of an estimator as the sample size becomes very large. An estimator is consistent if it converges to the population value as the sample size becomes large. 3.51 Constant Fail
49、ure Rate a.A term characterizing the instantaneous failure rate in the middle, or “useful life“ period of the Bathtub Curve model of item life. b.A term characterizing the hazard rate, h(t), of an item having an exponential reliability function. 3.52 ContaminationA general term used to describe an unwanted material that adversely affects the physical or electrical characteristics of an item. 3.53 Continuous Sampling PlanIn acceptance sampling, a plan intended for applic