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1、a Date: 6 March 2007 Origin: European Latest date for receipt of comments: 8 May 2007 Project no.: 2007/00564 Responsible committee: EPL/47 Semiconductors Interested committees: GEL/101, DS/1, EPL/501 Title: Draft BS EN 62047-6 Semiconductor devices - Micro-electromechanical devices Part 6: Axial fa
2、tigue testing methods of thin film materials Supersession information: If this document is published as a standard, the UK implementation of it will supersede NONE and partially supersede NONE . If you are aware of a current national standard which may be affected, please notify the secretary (conta
3、ct details below). WARNING: THIS IS A DRAFT AND MUST NOT BE REGARDED OR USED AS A BRITISH STANDARD. THIS DRAFT IS NOT CURRENT BEYOND 8 May 2007. This draft is issued to allow comments from interested parties; all comments will be given consideration prior to publication. No acknowledgement will norm
4、ally be sent. See overleaf for information on commenting. No copying is allowed, in any form, without prior written permission from BSI except as permitted under the Copyright, Designs and Patent Act 1988 or for circulation within a nominating organization for briefing purposes. Electronic circulati
5、on is limited to dissemination by e-mail within such an organization by committee members. Further copies of this draft may be purchased from BSI Customer Services, Tel: +44(0) 20 8996 9001 or email ordersbsi-. British, International and foreign standards are also available from BSI Customer Service
6、s. British Standards on CD or Online are available from British Standards Publishing Sales Limited. Tel: 01344 404409 or email bsonlinetechindex.co.uk. Information on the co-operating organizations represented on the committees referenced above may be obtained from the responsible committee secretar
7、y. Cross-references The British Standards which implement International or European publications referred to in this draft may be found via the British Standards Online Service on the BSI web site http:/www.bsi-. Direct tel: 020 8996 7009 Responsible Committee Secretary: Committee Service Centre (BS
8、I) E-mail: cscbsi- Draft for Public Comment Head Office 389 Chiswick High Road London W4 4AL Telephone: +44(0)20 8996 9000 Fax: +44(0)20 8996 7001 Form 36 Version 6.1 DPC: 07/30163302 DC Licensed Copy: London South Bank University, London South Bank University, Sat Mar 17 03:56:22 GMT+00:00 2007, Un
9、controlled Copy, (c) BSI b Introduction This draft standard is based on European discussions in which the UK took an active part. Your comments on this draft are welcome and will assist in the preparation of the consequent British Standard. If no comments are received to the contrary, then the UK wi
10、ll approve this draft and implement it as a British Standard. Comment is particularly welcome on national legislative or similar deviations that may be necessary. Even if this draft standard is not approved by the UK, if it receives the necessary support in Europe, the UK will be obliged to publish
11、the official English Language text unchanged as a British Standard and to withdraw any conflicting standard. UK Vote Please indicate whether you consider the UK should submit a negative (with reasons) or positive vote on this draft. Submission The guidance given below is intended to ensure that all
12、comments receive efficient and appropriate attention by the responsible BSI committee. Annotated drafts are not acceptable and will be rejected. All comments must be submitted, preferably electronically, to the Responsible Committee Secretary at the address given on the front cover. Comments should
13、be compatible with Version 6.0 or Version 97 of Microsoft Word for Windows, if possible; otherwise comments in ASCII text format are acceptable. Any comments not submitted electronically should still adhere to these format requirements. All comments submitted should be presented as given in the exam
14、ple below. Further information on submitting comments and how to obtain a blank electronic version of a comment form are available from the BSI web site at:http:/www.bsi- Template for comments and secretariat observations Date: xx/xx/200x Document: ISO/DIS xxxxx 1 2 (3) 4 5 (6) (7) MB Clause No./ Su
15、bclause No./ Annex (e.g. 3.1) Paragraph/ Figure/Table/ Note (e.g. Table 1) Type of com- ment Comment (justification for change) by the MB Proposed change by the MB Secretariat observations on each comment submitted 3.1 Definition 1 ed Definition is ambiguous and needs clarifying. Amend to read . so
16、that the mains connector to which no connection . 6.4 Paragraph 2 te The use of the UV photometer as an alternative cannot be supported as serious problems have been encountered in its use in the UK. Delete reference to UV photometer. Microsoft and MS-DOS are registered trademarks, and Windows is a
17、trademark of Microsoft Corporation. Licensed Copy: London South Bank University, London South Bank University, Sat Mar 17 03:56:22 GMT+00:00 2007, Uncontrolled Copy, (c) BSI 47/1900/CD COMMITTEE DRAFT (CD) IEC/TC or SC: TC 47 Project number IEC 62047-6 Ed. 1.0 Title of TC/SC: Semiconductor devices D
18、ate of circulation 2007-03-02 Closing date for comments 2007-06-08 Also of interest to the following committees IEC TC 47E, 56, 91, 101 Supersedes document 47/1868/NP - 47/1891A/RVN Functions concerned: Safety EMC Environment Quality assurance Secretary: Ilsub Chung THIS DOCUMENT IS STILL UNDER STUD
19、Y AND SUBJECT TO CHANGE. IT SHOULD NOT BE USED FOR REFERENCE PURPOSES. RECIPIENTS OF THIS DOCUMENT ARE INVITED TO SUBMIT, WITH THEIR COMMENTS, NOTIFICATION OF ANY RELEVANT PATENT RIGHTS OF WHICH THEY ARE AWARE AND TO PROVIDE SUPPORTING DOCUMENTATION. Title: IEC 62047-6, Ed. 1: Semiconductor devices
20、- Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials (Titre) : Introductory note This CD was prepared based on the discussion result of TC47/WG4 London Meeting, 47/1891A/RVN. FORM CD (IEC) 2002-08-08 Copyright 2007 International Electrotechnical Commission
21、, IEC. All rights reserved. It is permitted to download this electronic file, to make a copy and to print out the content for the sole purpose of preparing National Committee positions. You may not copy or “mirror“ the file or printed version of the document, or any part of it, for any other purpose
22、 without permission in writing from IEC. Licensed Copy: London South Bank University, London South Bank University, Sat Mar 17 03:56:22 GMT+00:00 2007, Uncontrolled Copy, (c) BSI 62047-6/1CD IEC 2 47/1900/CD CONTENTS 1 Scope 5 2 Normative references .5 3 Terms and definitions .5 4 Test piece 6 4.1 D
23、esign of test piece.6 4.2 Preparation of test piece7 4.3 Test piece thickness 7 4.4 Storage prior testing 7 5 Testing method and test apparatus .7 5.1 General.7 5.2 Method of gripping (mounting of test piece)7 5.3 Static loading test8 5.4 Method of loading8 5.5 Speed of testing 8 5.6 Environment con
24、trol.8 6 Endurances (Test termination)8 7 Test report .8 Annex A (informative) Significance of axial loading fatigue testing for thin films.10 Annex B (informative) Outline of round-robin tests performed in Japan11 Annex C (informative) Test piece .12 Annex D (informative) Displacement measurement.1
25、3 Annex E (informative) Testing environment 14 Annex F (informative) Number of test pieces 15 Bibliography .16 Licensed Copy: London South Bank University, London South Bank University, Sat Mar 17 03:56:22 GMT+00:00 2007, Uncontrolled Copy, (c) BSI 62047-6/1CD IEC 3 47/1900/CD INTERNATIONAL ELECTROT
26、ECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES MICRO-ELECTROMECHANICAL DEVICES Part 6: Axial fatigue testing methods of thin film materials FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees
27、 (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Repo
28、rts, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and n
29、on- governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements
30、 of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and ar
31、e accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote inte
32、rnational uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
33、the latter. 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with an IEC Publication. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC o
34、r its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expen
35、ses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Atten
36、tion is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 62047-6 has been prepared by IEC technical committee 47: Semiconductor d
37、evices. The text of this standard is based on the following documents: FDIS Report on voting 47/XX/FDIS 47/XX/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with t
38、he ISO/IEC Directives, Part 2. Licensed Copy: London South Bank University, London South Bank University, Sat Mar 17 03:56:22 GMT+00:00 2007, Uncontrolled Copy, (c) BSI 62047-6/1CD IEC 4 47/1900/CD The committee has decided that the contents of this publication will remain unchanged until the mainte
39、nance result date1) indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. 1) The National Committees are requested to note that for this pub
40、lication the maintenance result date is Licensed Copy: London South Bank University, London South Bank University, Sat Mar 17 03:56:22 GMT+00:00 2007, Uncontrolled Copy, (c) BSI 62047-6/1CD IEC 5 47/1900/CD SEMICONDUCTOR DEVICES MICRO-ELECTROMECHANICAL DEVICES Part 6: Axial fatigue testing methods o
41、f thin film materials 1 Scope This International Standard specifies the method for axial tensiletensile force fatigue testing of thin film materials with a length and width under 1mm and a thickness in the range between 0,1 and 10 m under constant load amplitude or constant displacement amplitude. T
42、hin films are used as main structural materials for MEMS and micromachines. The main structural materials for MEMS, micromachines, etc., have special features, such as typical dimensions of a few microns, material fabrication by deposition, and test piece fabrication by means of non-mechanical machi
43、ning, including photolithography. This International Standard specifies the axial force fatigue testing methods for micro-sized smooth specimens, which enables a guarantee of accuracy corresponding to the special features. The tests are carried out at room temperatures, in air, with loading applied
44、to the test piece along the longitudinal axis. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any
45、amendments) applies. IEC 62047-2, Micro electromechanical devices Part 2: Tensile testing method of thin film materials 3 Terms and definitions For the purposes of this International Standard, the following terms and definitions apply. 3.1 maximum force (Pmax) highest algebraic value of applied forc
46、e in a cycle NOTE Adapted from ASTM E 1823-05a 1. 3.2 minimum force (Pmin) lowest algebraic value of applied force in a cycle NOTE Adapted from ASTM E 1823-05a 1. 3.3 mean force (Pmean) algebraic average of the maximum and minimum forces in constant amplitude loading, or of individual cycles NOTE Ad
47、apted from ASTM E 1823-05a 1. 3.4 force range (P) range of force for one cycle NOTE Adapted from ASTM E 1823-05a 1. Licensed Copy: London South Bank University, London South Bank University, Sat Mar 17 03:56:22 GMT+00:00 2007, Uncontrolled Copy, (c) BSI 62047-6/1CD IEC 6 47/1900/CD 3.5 maximum stres
48、s (max) highest algebraic value of applied stress in a cycle 3.6 minimum stress (min) lowest algebraic value of applied force in a cycle 3.7 mean stress (mean) algebraic average of the maximum and minimum stress in constant amplitude loading, or of individual cycles 3.8 stress range () range of stre
49、ss for one cycle 3.9 maximum displacement (max) highest algebraic value of applied displacement in a cycle 3.10 minimum displacement (min) lowest algebraic value of applied displacement in a cycle 3.11 mean displacement (mean) algebraic average of the maximum and minimum displacement in constant amplitude loading, or of individual cycles 3.12 displacement range (