《08-30190026-DC.pdf》由会员分享，可在线阅读，更多相关《08-30190026-DC.pdf（13页珍藏版）》请在三一文库上搜索。
1、a Date: 1 December 2008 Origin: International Latest date for receipt of comments: 6 February 2009 Project no.: 2008/03003 Responsible committee: EPL/47 Semiconductors Interested committees: Title: Draft BS EN 60191-6-20 PNW 47D-721 Ed.1 (Future IEC 60191-6-20): General rules for the preparation of
2、outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) Supersession information: If this document is published as a standard, the UK implementation of it will supersede NONE and partially supersede. NONE If
3、you are aware of a current national standard which may be affected, please notify the secretary (contact details below). WARNING: THIS IS A DRAFT AND MUST NOT BE REGARDED OR USED AS A BRITISH STANDARD. THIS DRAFT IS NOT CURRENT BEYOND 6 February 2009. This draft is issued to allow comments from inte
4、rested parties; all comments will be given consideration prior to publication. No acknowledgement will normally be sent. See overleaf for information on commenting. No copying is allowed, in any form, without prior written permission from BSI except as permitted under the Copyright, Designs and Pate
5、nt Act 1988 or for circulation within a nominating organization for briefing purposes. Electronic circulation is limited to dissemination by e-mail within such an organization by committee members. Further copies of this draft may be purchased from BSI Customer Services, Tel: +44(0) 20 8996 9001 or
6、email . British, International and foreign standards are also available from BSI Customer Services. Information on the co-operating organizations represented on the committees referenced above may be obtained from the responsible committee secretary. Cross-references The British Standards which impl
7、ement International or European publications referred to in this draft may be found via the British Standards Online Service on the BSI web site http:/. Direct tel: 020 8996 7009 Responsible Committee Secretary: Committee Service Centre (BSI) E-mail: Draft for Public Comment Head Office 389 Chiswic
8、k High Road London W4 4AL Telephone: +44(0)20 8996 9000 Fax: +44(0)20 8996 7001 Form 36 Version 8.0 DPC: 08/30190026 DC Licensed Copy: London South Bank University, South Bank University, 31/01/2009 04:08, Uncontrolled Copy, (c) BSI b Introduction This draft standard is based on international discus
9、sions in which the UK has taken an active part. Your comments on this draft are welcome and will assist in the preparation of the consequent standard. There is a high probability that this text could be adopted by CENELEC as a reference document for harmonization or as a European Standard. Recipient
10、s of this draft are requested to comment on the text bearing in mind this possibility. UK Vote Please indicate whether you consider the UK should submit a negative (with reasons) or positive vote on this draft. Submission The guidance given below is intended to ensure that all comments receive effic
11、ient and appropriate attention by the responsible BSI committee. Annotated drafts are not acceptable and will be rejected. All comments must be submitted, preferably electronically, to the Responsible Committee Secretary at the address given on the front cover. Comments should be compatible with Ver
12、sion 6.0 or Version 97 of Microsoft Word for Windows, if possible; otherwise comments in ASCII text format are acceptable. Any comments not submitted electronically should still adhere to these format requirements. All comments submitted should be presented as given in the example below. Further inf
13、ormation on submitting comments and how to obtain a blank electronic version of a comment form are available from the BSI web site at: http:/ Template for comments and secretariat observations Date: xx/xx/200x Document: ISO/DIS xxxxx 1 2 (3) 4 5 (6) (7) MB Clause No./ Subclause No./ Annex (e.g. 3.1)
14、 Paragraph/ Figure/Table/ Note (e.g. Table 1) Type of com- ment Comment (justification for change) by the MB Proposed change by the MB Secretariat observations on each comment submitted 3.1 Definition 1 ed Definition is ambiguous and needs clarifying. Amend to read . so that the mains connector to w
15、hich no connection . 6.4 Paragraph 2 te The use of the UV photometer as an alternative cannot be supported as serious problems have been encountered in its use in the UK. Delete reference to UV photometer. Microsoft and MS-DOS are registered trademarks, and Windows is a trademark of Microsoft Corpor
16、ation. Licensed Copy: London South Bank University, South Bank University, 31/01/2009 04:08, Uncontrolled Copy, (c) BSI FORM CD (IEC) 2008-08-01 47D/732/CD COMMITTEE DRAFT (CD) IEC/TC or SC: SC 47D Project number IEC 60191-6-20 Ed.1.0 2/07037 Title of TC/SC: Mechanical Standardization of Semiconduct
17、or Devices Date of circulation 2008-11-28 Closing date for comments 2009-03-06 Also of interest to the following committees Supersedes document 47D/721/NP - 47D/727A/RVN Proposed horizontal standard Other TC/SCs are requested to indicate their interest, if any, in this CD to the TC/SC secretary Func
18、tions concerned: Safety EMC Environment Quality assurance Secretary: Hiroyoshi Yoshida THIS DOCUMENT IS STILL UNDER STUDY AND SUBJECT TO CHANGE. IT SHOULD NOT BE USED FOR REFERENCE PURPOSES. RECIPIENTS OF THIS DOCUMENT ARE INVITED TO SUBMIT, WITH THEIR COMMENTS, NOTIFICATION OF ANY RELEVANT PATENT R
19、IGHTS OF WHICH THEY ARE AWARE AND TO PROVIDE SUPPORTING DOCUMENTATION. Title: IEC 60191-6-20 Ed.1.0: Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package
20、 dimensions of small outline J-lead packages (SOJ) (Titre) : Introductory note Copyright 2008 International Electrotechnical Commission, IEC. All rights reserved. It is permitted to download this electronic file, to make a copy and to print out the content for the sole purpose of preparing National
21、Committee positions. You may not copy or “mirror“ the file or printed version of the document, or any part of it, for any other purpose without permission in writing from IEC. Licensed Copy: London South Bank University, South Bank University, 31/01/2009 04:08, Uncontrolled Copy, (c) BSI 60191-6-20,
22、 Ed. 1 IEC:200X 2 47D/732/CD INTERNATIONAL ELECTROTECHNICAL COMMISSION _ MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of small outline J-l
23、ead packages (SOJ) FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning sta
24、ndardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their prepara
25、tion is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non- governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely wi
26、th the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant sub
27、jects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technica
28、l content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent
29、possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any e
30、quipment declared to be in conformity with an IEC Publication. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees an
31、d IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) A
32、ttention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights
33、. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60191-6-20 has been prepared by subcommittee 47D: Mechanical standardization of semiconductor devices, of IEC technical committee 47: Semiconductor devices. The text of this standard is base
34、d on the following documents: FDIS Report on voting 47D/XX/FDIS 47D/XX/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directive, Part 2. Licensed
35、Copy: London South Bank University, South Bank University, 31/01/2009 04:08, Uncontrolled Copy, (c) BSI 60191-6-20, Ed. 1 IEC:200X 3 47D/732/CD A bilingual version of this publication may be issued at a later date. The committee has decided that the contents of this publication will remain unchanged
36、 until 20XX. At this date, the publication will be reconfirmed; withdrawn; replaced by a revised edition, or amended. Licensed Copy: London South Bank University, South Bank University, 31/01/2009 04:08, Uncontrolled Copy, (c) BSI 60191-6-20, Ed. 1 IEC:200X 4 47D/732/CD MECHANICAL STANDARDIZATION OF
37、 SEMICONDUCTOR DEVICES Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of small outline J-lead packages (SOJ) 1 Scope This part of IEC 60191 specifies (or: covers) methods to measure package di
38、mensions of small outline J-lead-packages (SOJ), package outline form E in accordance to IEC 60191-4. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the la
39、test edition of the referenced document (including any amendments) applies. IEC 60191-4: Mechanical standardization of semiconductor devices Part 4: Coding system and classification into forms of package outlines for semiconductor devices IEC 60191-6, Ed.2: Mechanical standardization of semiconducto
40、r devices.- Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages 3 Definitions For the purpose of this part of IEC 60191, the definitions of IEC60191-6 Ed.2 apply. 4 Measuring Methods 4.1 Description of measuring method The measuring methods
41、described in this standard are for dimension values guaranteed to users on the basis of the following items. a) In general, measuring the dimensions shall be made with the semiconductor packages mounted on printed circuit board as the guarantee is made to user. b) In general, measurement may be made
42、 either by hand or automatically. c) If a specified dimension is difficult to measure, the best alternative measuring method is defined as the formal measuring method. d) Even if a measuring method deviates out of the original definition of dimensions, it is defined as an alternative measuring metho
43、d along as it is equivalent in view of accuracy and can be used easily. e) The dimensions that cannot be measured unless the package is destroyed may be calculated from other dimensions or replaced by representative values. Licensed Copy: London South Bank University, South Bank University, 31/01/20
44、09 04:08, Uncontrolled Copy, (c) BSI 60191-6-20, Ed. 1 IEC:200X 5 47D/732/CD 4.2 Reference characters and drawing 4.2.1 Outline drawings Figure 1 SOJ outline drawings b3 eE e c c1 b1 bp A3 Lp bp L2L1 b2 M e Seating plane S y S S x A L eE A1 1 A n/2+1 HE n/2 n E D l1 B A2 P t M P S Figure 1a Figure 1
45、b Figure 1c Figure 1d Figure 1e Figure 1f Figure 2 Pattern of terminal position areas ZD Terminal 1 index area A-B A-B 1g Licensed Copy: London South Bank University, South Bank University, 31/01/2009 04:08, Uncontrolled Copy, (c) BSI 60191-6-20, Ed. 1 IEC:200X 6 47D/732/CD 4.3 Mounting height A 4.3
46、.1 Description Let the height of a package from the seating plane to the top of the package be denoted as the mounting height A. Figure 2 Mounting height 4.3.2 Measuring method a) Put the package on the surface plate to establish the seating plane. b) From the side or top, measure the distance to a
47、highest point. Let the distance be denoted as mounting height A. 4.4 Stand-off A1 4.4.1 Description Let a distance from the seating plane to the lowest point of a package be denoted as the stand-off A1. Figure 3 Stand-off 4.4.2 Measuring method a) Put the package on the surface plate to establish th
48、e reference surface (seating plane). b) Measure the distance from the reference surface (surface plate) to the lowest point of the package. Let the distance be denoted as the stand-off A1. 4.5 Body thickness A2 4.5.1 Description The body thickness is defined as a distance between two parallel planes
49、. It is tangent to the highest and lowest points of the body. Let the distance be denoted as the body thickness A2 Figure 4 Body thickness A2 S S S S Licensed Copy: London South Bank University, South Bank University, 31/01/2009 04:08, Uncontrolled Copy, (c) BSI 60191-6-20, Ed. 1 IEC:200X 7 47D/732/CD 4.5.2 Measuring method a) Put the package between vertically parallel surface p