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1、a Date: 3 January 2008 Origin: International Latest date for receipt of comments: 29 February 2008 Project no.: 2008/00026 Responsible committee: EPL/47 Semiconductors Interested committees: EPL/40X Title: Draft BS EN 60191-6-18 General rules for the preparation of outline drawings of surface mounte
2、d semiconductor device packages - Design guide for ball grid array (BGA) Supersession information: If this document is published as a standard, the UK implementation of it will supersede NONE and partially supersede. NONE If you are aware of a current national standard which may be affected, please
3、notify the secretary (contact details below). WARNING: THIS IS A DRAFT AND MUST NOT BE REGARDED OR USED AS A BRITISH STANDARD. THIS DRAFT IS NOT CURRENT BEYOND 29 February 2008. This draft is issued to allow comments from interested parties; all comments will be given consideration prior to publicat
4、ion. No acknowledgement will normally be sent. See overleaf for information on commenting. No copying is allowed, in any form, without prior written permission from BSI except as permitted under the Copyright, Designs and Patent Act 1988 or for circulation within a nominating organization for briefi
5、ng purposes. Electronic circulation is limited to dissemination by e-mail within such an organization by committee members. Further copies of this draft may be purchased from BSI Customer Services, Tel: +44(0) 20 8996 9001 or email ordersbsi-. British, International and foreign standards are also av
6、ailable from BSI Customer Services. Information on the co-operating organizations represented on the committees referenced above may be obtained from the responsible committee secretary. Cross-references The British Standards which implement International or European publications referred to in this
7、 draft may be found via the British Standards Online Service on the BSI web site http:/www.bsi-. Direct tel: 020 8996 7009 Responsible Committee Secretary: Committee Service Centre (BSI) E-mail: cscbsi- Draft for Public Comment Head Office 389 Chiswick High Road London W4 4AL Telephone: +44(0)20 899
8、6 9000 Fax: +44(0)20 8996 7001 Form 36 Version 7.0 DPC: 08/30175763 DC Licensed Copy: London South Bank University, London South Bank University, Fri Feb 15 06:51:56 GMT+00:00 2008, Uncontrolled Copy, (c) BSI b Introduction This draft standard is based on international discussions in which the UK ha
9、s taken an active part. Your comments on this draft are welcome and will assist in the preparation of the consequent standard. If no comments are received to the contrary, then the UK will approve this draft. There is a high probability that this text could be adopted by CENELEC as a reference docum
10、ent for harmonization or as a European Standard. Recipients of this draft are requested to comment on the text bearing in mind this possibility. UK Vote Please indicate whether you consider the UK should submit a negative (with reasons) or positive vote on this draft. Submission The guidance given b
11、elow is intended to ensure that all comments receive efficient and appropriate attention by the responsible BSI committee. Annotated drafts are not acceptable and will be rejected. All comments must be submitted, preferably electronically, to the Responsible Committee Secretary at the address given
12、on the front cover. Comments should be compatible with Version 6.0 or Version 97 of Microsoft Word for Windows, if possible; otherwise comments in ASCII text format are acceptable. Any comments not submitted electronically should still adhere to these format requirements. All comments submitted shou
13、ld be presented as given in the example below. Further information on submitting comments and how to obtain a blank electronic version of a comment form are available from the BSI web site at: http:/www.bsi- Template for comments and secretariat observations Date: xx/xx/200x Document: ISO/DIS xxxxx
14、1 2 (3) 4 5 (6) (7) MB Clause No./ Subclause No./ Annex (e.g. 3.1) Paragraph/ Figure/Table/ Note (e.g. Table 1) Type of com- ment Comment (justification for change) by the MB Proposed change by the MB Secretariat observations on each comment submitted 3.1 Definition 1 ed Definition is ambiguous and
15、needs clarifying. Amend to read . so that the mains connector to which no connection . 6.4 Paragraph 2 te The use of the UV photometer as an alternative cannot be supported as serious problems have been encountered in its use in the UK. Delete reference to UV photometer. Microsoft and MS-DOS are reg
16、istered trademarks, and Windows is a trademark of Microsoft Corporation. Licensed Copy: London South Bank University, London South Bank University, Fri Feb 15 06:51:56 GMT+00:00 2008, Uncontrolled Copy, (c) BSI 47D/708/CD COMMITTEE DRAFT (CD) IEC/TC or SC: SC 47D Project number IEC 60191-6-18, Ed.1
17、Title of TC/SC: Mechanical standardization of semiconductor devices Date of circulation 2007-12-21 Closing date for comments 2008-03-21 Also of interest to the following committees Supersedes document 47D/677/NP-47D/701/RVN Functions concerned: Safety EMC Environment Quality assurance Secretary: H.
18、YOSHIDA THIS DOCUMENT IS STILL UNDER STUDY AND SUBJECT TO CHANGE. IT SHOULD NOT BE USED FOR REFERENCE PURPOSES. RECIPIENTS OF THIS DOCUMENT ARE INVITED TO SUBMIT, WITH THEIR COMMENTS, NOTIFICATION OF ANY RELEVANT PATENT RIGHTS OF WHICH THEY ARE AWARE AND TO PROVIDE SUPPORTING DOCUMENTATION. Title:
19、IEC 60191-6-18 Ed.1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (Titre) : Introductory note FORM CD (IEC) 2002-08-08 Copyright 2007 International Electrotechnical Commission, IEC. All rights reserved
20、. It is permitted to download this electronic file, to make a copy and to print out the content for the sole purpose of preparing National Committee positions. You may not copy or “mirror“ the file or printed version of the document, or any part of it, for any other purpose without permission in wri
21、ting from IEC. Licensed Copy: London South Bank University, London South Bank University, Fri Feb 15 06:51:56 GMT+00:00 2008, Uncontrolled Copy, (c) BSI 60191-6-18, Ed. 1 IEC:200X 47D/708/CD 2 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES- Part 6-5: General rules for the preparation of outline
22、 drawings of surface mounted semiconductor device packagers - Design guide for ball grid array (BGA) FOREWORD Licensed Copy: London South Bank University, London South Bank University, Fri Feb 15 06:51:56 GMT+00:00 2008, Uncontrolled Copy, (c) BSI 60191-6-18, Ed. 1 IEC:200X 47D/708/CD 3 Design guide
23、 for semiconductor packages Ball Grid Array Package (BGA) 1 Scope This part of IEC 60191 provides common outline drawings and dimensions for all types of structures and composed materials of ball grid array (hereinafter called BGA), whose terminal pitch is one millimetre or larger and whose package
24、body outline is square. 2 Normative references The following normative documents contain provisions which, through reference in this text, constitute provisions of this part of IEC 60191. For dated references, subsequent amendments to, or revisions of, any of these publications do not apply. However
25、, parties to agreements based on this part of IEC 60191 are encouraged to investigate the possibility of applying the most recent editions of the normative documents indicated below. For undated references, the latest edition of the normative documents referred to applies. Members of IEC and ISO mai
26、ntain registers of currently valid International Standards. IEC 60191-6: 2004, Mechanical standardization of semiconductor devices Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages 3 Definitions For the purpose of this part of IEC 60191, t
27、he definitions contained in IEC 60191-6 as well as the following definitions apply. 3.1 Ball grid array Low-profile package whose terminals are metal balls located on one surface in a matrix of at least three rows and three columns; terminals may be missing from some row-column intersections. NOTE:
28、BGA stands for “Ball Grid Array” in this standard to be aligned with IEC 60191-6-2, 60191-6-4, and 60191-6-5. Only IEC60191-4 refers BGA as “Bottom Grid Array”, and it is not common language in the industry and no other standard uses this name. 3.2 Plastic ball grid array (P-BGA) BGA whose substrate
29、 is made of organic printed wiring board 3.3 Tape ball grid array (T-BGA) BGA whose substrate is made of polyimide tape 3.4 Ceramic ball grid array (C-BGA) BGA whose substrate is made of ceramic circuit board Licensed Copy: London South Bank University, London South Bank University, Fri Feb 15 06:51
30、:56 GMT+00:00 2008, Uncontrolled Copy, (c) BSI 60191-6-18, Ed. 1 IEC:200X 47D/708/CD 4 3.5 P-BGA (Flip chip interconnection) BGA whose substrate is made of organic printed wiring board and is connected to the die by the bumps on the die. 3.6 Recommended BGA variations BGA variations that shall be co
31、nsidered to be the first choice for production Package variations other than recommended BGA variations are not recommended to prevent the endless proliferation of the BGA variations. 4 Terminal position numbering When a package is viewed from the terminal side with the index corner in the bottom le
32、ft corner position, terminal rows are lettered from bottom to top starting with A, then B, C, AA, AB, etc., while terminal columns are numbered from left to right starting with 1. Terminal positions are designated by a row-column grid system and shown as alphanumeric identification, e.g., A1, B1, or
33、 AC34. The letters I, O, Q, S, X and Z are not used for naming the terminal rows. 5 Nominal package dimension A nominal package dimension is defined as “the package width (E) X length (D)”, which is expressed in the tenths place in millimetre. Licensed Copy: London South Bank University, London Sout
34、h Bank University, Fri Feb 15 06:51:56 GMT+00:00 2008, Uncontrolled Copy, (c) BSI 60191-6-18, Ed. 1 IEC:200X 47D/708/CD 5 6 Symbols and drawings 6.1 BGA outline Figure 1Cavity down type A1 (8) (7) E w S B y S (1) S A A4 ( 9) v D A S w (3) (4) 4 MD E ABS X M b 1 B e (2) SE ZE (11) (11) e A SD (10) ZD
35、 (5) (6) ME 2 3 4 5 (7) D C B A (10) (2) Licensed Copy: London South Bank University, London South Bank University, Fri Feb 15 06:51:56 GMT+00:00 2008, Uncontrolled Copy, (c) BSI 60191-6-18, Ed. 1 IEC:200X 47D/708/CD 6 Figure 2Cavity up type E w S B y S (1) S A A1 ( 8) v D A S w (3) (4) 4 S y1 MD E
36、ABS X M b 1 B e (2) SE ZE (11) (11) e A SD (10) ZD (5) (6) ME 2 3 4 5 D C B A (10) (2) Licensed Copy: London South Bank University, London South Bank University, Fri Feb 15 06:51:56 GMT+00:00 2008, Uncontrolled Copy, (c) BSI 60191-6-18, Ed. 1 IEC:200X 47D/708/CD 7 NOTES: (1) Datum S is defined as th
37、e seating plane on which a package free stands by contact of the balls. (2) The distance between the centerlines of any two adjacent rows or columns of balls. (3) The hatched zone indicates the index-marking area where whole index mark will be contained. (4) The profile tolerance that controls of pa
38、ckage size and orientation is applied to all four sides of the package outline. (5) The tolerance of position that controls the relationship of the balls applies to all balls. (6) The terminal diameter “b” is the maximum diameter of individual balls as measured in the plane parallel to the seating p
39、lane. (7) It shows the lid made of mold compound, glob top resin, metal cap, ceramics, etc. It may be flat, convex, or concave shape. (8) The primary stand-off height is defined by the height from seating plane to the package substrate. (9) The secondary stand-off height is defined by the height fro
40、m the seating plane to the lid that is the lowest surface on the cavity-down configuration. (10) SD and SE are the dimensions that define the positions of balls next to the datum A and B. (11) Datum A and B are defined by the most outer balls which locate in the middle of all four sides. Remarks: An
41、 array pattern of permissible terminal-existing zones including true position tolerance is shown in Figure 3. Figure 3 b3 max SE e e SD b 3 max = bmax + x Licensed Copy: London South Bank University, London South Bank University, Fri Feb 15 06:51:56 GMT+00:00 2008, Uncontrolled Copy, (c) BSI 60191-6
42、-18, Ed. 1 IEC:200X 47D/708/CD 8 Dimensions 6.2 Group 1 Table 1 Unit: mm Term Symbol Specification Recommended value Nominal package dimension E D (1) A nominal package dimension is defined as “the package width (E) x length (D)”, which is expressed in the tenths place in millimetre. (2) Variations
43、on nominal package dimensions are: 07,07,0 25,025,0 08,08,0 27,027,0 99,09,0 29,029,0 10,010,0 31,031,0 11,011,0 33,033,0 12,012,0 35,035,0 13,013,0 37,537,5 14,014,0 40,040,0 15,015,0 42,542,5 16,016,0 45,045,0 17,017,0 47,547,5 18,018,0 50,050,0 19,019,0 52,552,5 20,020,0 55,055,0 21,021,0 57,557,
44、5 23,023,0 60,060,000 Refer to Table 5 through 10. Package length D (1) Package length D 7,0 25,0 08,0 27,0 99,0 29,0 10,0 31,0 11,0 33,0 12,0 35,0 13,0 37,5 14,0 40,0 15,0 42,5 16,0 45,0 17,0 47,5 18,0 50,0 19,0 52,5 20,0 55,0 21,0 57,5 Refer to Table 5 through 10. Licensed Copy: London South Bank
45、University, London South Bank University, Fri Feb 15 06:51:56 GMT+00:00 2008, Uncontrolled Copy, (c) BSI 60191-6-18, Ed. 1 IEC:200X 47D/708/CD 9 23,0 60,000.0.0 Table 1 (continued) Unit: mm Term Symbol Specification Recommended value Package width E (1) Package width E 7,0 25,0 08,0 27,0 99,0 29,0 1
46、0,0 31,0 11,0 33,0 12,0 35,0 13,0 37,5 14,0 40,0 15,0 42,5 16,0 45,0 17,0 47,5 18,0 50,0 19,0 52,5 20,0 55,0 21,0 57,5 23,0 60,0 Refer to Table 5 through 10. Profile tolerance of package body v v 0,20 Profile tolerance includes body-edge burr, - Off-center tolerance w e w 1,27 1,00 0,30 0,30 - Profi
47、le height A A max 1,20 1,70 6,00 ”A” includes heat slug thickness, package warpage and tilt errors. “A” does not include the height of external heat sink or chip capacitors. - Licensed Copy: London South Bank University, London South Bank University, Fri Feb 15 06:51:56 GMT+00:00 2008, Uncontrolled
48、Copy, (c) BSI 60191-6-18, Ed. 1 IEC:200X 47D/708/CD 10 The primary Stand-off height A1 e A1 min A1 nom A1 max 1,27 1,00 0,5 0,4 0,6 0,5 0,7 0,6 - Table 1 (continued) Unit mm Term Symbol Specification Recommended value The secondary Stand-off height A4 A4 min 0,25 - Terminal grid pitch e 1,27 1,00 - Terminal diameter b e b min b nom b max 1,27 1,00 0,60 0,50 0,75 0,60 0,90 0,70 - True position tolerance x e x 1,27 1,00 0,15 0,10 - Coplanarity y e y 1,27 1,00 0,20 0,20 - Parallelism tol