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1、BRITISH STANDARD BS 123100:2001 System of quality assessment Sectional specification Rigid single-sided and double-sided printed boards with plain holes ICS 31.180 NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAW Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 24 06:26:53 G
2、MT+00:00 2006, Uncontrolled Copy, (c) BSI BS 123100:2001 This British Standard, having been prepared under the direction of the Electrotechnical Sector Policy and Strategy Committee, was published under the authority of the Standards Policy and Strategy Committee on 17 December 2001 BSI 17 December
3、2001 The following BSI references relate to the work on this British Standard: Committee reference EPL/501 Draft for comment 01/204152 DC ISBN 0 580 38518 3 Committees responsible for this British Standard The preparation of this British Standard was entrusted to Technical Committee EPL/501, Electro
4、nic assembly technology, upon which the following bodies were represented: Association of Contract Engineers Manufacturers Federation of the Electronics Industry GAMBICA Ministry of Defence National Supervising Inspectorate Printed Circuit Interconnection Federation Surface Mounting and Related Tech
5、nologies (Smart Group) Ltd. Amendments issued since publication Amd. No.DateComments Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 24 06:26:53 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS 123100:2001 BSI 17 December 2001 i Contents Page Committees responsibleInside front cover Forewordii 1Sco
6、pe1 2Normative references1 3Terms and definitions1 4General requirements1 5Capability approval1 6Relevant specification2 7Capability test programme2 8Quality conformity inspection2 9Test patterns and test boards6 Bibliography9 Figure 1 Composite test pattern7 Figure 2 Examples of multiple arrangemen
7、ts8 Table 1 Group A quality conformity inspection3 Table 2 Group B quality conformity inspection4 Table 3 Group C quality conformity inspection5 Table 4 Test specimen details6 Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 24 06:26:53 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS 123100:2001 ii
8、 BSI 17 December 2001 Foreword This British Standard has been prepared by Technical Committee EPL/501, Electronic assembly technology. The BS 123000:2001 series of British Standards is based on draft proposals to revise the EN 123000 series dated 1992 and 1997. These were circulated and voted on in
9、CENELEC, but the CENELEC Technical Board decided not to approve them for publication. Following repeated attempts by the British National Committee to get them published, the Technical Board agreed to grant derogation from standstill to the British National Committee to publish national standards on
10、 the basis of the prEN 123000 series (Technical Board decision D106/092). These standards are published to complement the BS EN 123000 series, which remains current. They will be withdrawn only if they are replaced by revised EN standards. They have been published because they are considered to be a
11、n improvement upon the EN series, for the following reasons. a) Requirements for modern materials and surface finishes required by the electronics industry have been incorporated. b) Reference is made to ANSI/IPC A-600F for many of the inspection criteria. This has been undertaken in response to ind
12、ustry requests. c) References to obsolete CECC regulatory documents have been replaced. d) Tests and requirements that are no longer considered relevant have been removed. e) The UK electronics industry requires standards that are subject to ongoing revision, in order to take account of new European
13、 Eco-Directives. This British Standard is a sectional specification. It should be read in conjunction with the generic specification, BS 123000, and any associated capability detail specification. It has been assumed in the preparation of this British Standard that the execution of its provisions wi
14、ll be entrusted to appropriately qualified and experienced people, for whose use it has been produced. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standa
15、rd does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, pages 1 to 9 and a back cover. The BSI copyright notice displayed in this document indicates when the document was last issued. Licensed Copy:
16、sheffieldun sheffieldun, na, Fri Nov 24 06:26:53 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS 123100:2001 BSI 17 December 2001 1 1 Scope This British Standard specifies characteristics to be assessed and test methods to be used for capability approval testing and for quality conformity inspection (
17、lot-by-lot and periodic inspection). It is applicable for all rigid single-sided and double-sided printed boards with plain holes, irrespective of their method of manufacture, when they are ready for the mounting of components. This British Standard is a sectional specification intended for use with
18、 the IECQ system of quality assessment for electronic components. 2 Normative references The following normative documents contain provisions which, through reference in this text, constitute provisions of this British Standard. For dated references, subsequent amendments to, or revisions of, any of
19、 these publications do not apply. For undated references, the latest edition of the publication referred to applies. BS 4727-1:Group 11 (IEC 60194), Glossary of electrotechnical, power, telecommunication, electronics, lighting and colour terms Part 1: Terms common to power, telecommunications and el
20、ectronics Group 11: Printed circuits. BS 6001-1:1999 (ISO 2859-1:1999), Sampling procedures for inspection by attributes Part 1: Sampling schemes indexed by acceptance quality limit (AQL) for lot-by-lot inspection. BS 6221-2:1991 (IEC 60326-2:1990), Printed wiring boards Part 2: Methods of test. BS
21、6221-3 (IEC 60326-3), Printed wiring boards Guide for the design and use of printed wiring boards. BS 123000:2001, System of quality assessment Generic specification Printed boards. 3 Terms and definitions For the purposes of this British Standard the terms and definitions given in BS 4727-1:Group 1
22、1 and BS 123000 together with the following apply. 3.1 relevant specification product specification for an actual batch of printed boards, i.e. a customer detail specification as well as a capability detail specification applied to a specific material, surface finish etc., as applicable 4 General re
23、quirements The following specifications for rigid single-sided and double-sided printed boards with plain holes shall be prepared, unless a suitable capability detail specification already exists, using this British Standard as a basis: a) capability detail specifications for general use or applying
24、 to specific applications; b) customer detail specifications, which shall be prepared in accordance with BS 123000:2001, 7.2. NOTE 1BS 123100-003 is an example of a capability detail specification for rigid single-sided and double-sided printed boards with plain holes. NOTE 2A capability detail spec
25、ification is prepared either by an international or national body or by a manufacturer (see also BS CECC 00111-4). A customer detail specification should preferably be written by the customer and allocated a number within the customers own system. Further details are given in BS 123000 and BS CECC 0
26、0114-3. 5 Capability approval 5.1 Basic capability Testing shall be carried out on the composite test pattern detailed in clause 9. 5.2 Additional capability BS 123000:2001, 5.3.3 shall apply. NOTEFor multiple arrangements see also clause 9. 5.3 Maintenance of capability approval BS 123000:2001, 5.6
27、 shall apply. Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 24 06:26:53 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS 123100:2001 2 BSI 17 December 2001 6 Relevant specification The relevant specification shall contain all the information necessary to define the printed board clearly and compl
28、etely. Care shall be taken to avoid unnecessary proscriptions. Tolerances shall be stated as necessary. Nominal values without tolerances, or simple maximum or minimum values, shall be given where these are sufficient. Where tolerances are necessary for certain areas or parts of the printed board on
29、ly, they shall be applied and restricted to those areas or parts. If there are several possibilities of presentation, of tolerance classes etc., the selections given in BS 6221-3 shall be applied as practical. In the case of discrepancy between the customer detail specification and other pertinent s
30、pecifications (e.g. generic specification, sectional specification or capability detail specification), the customer detail specification shall prevail. 7 Capability test programme For initial demonstration and subsequent re-demonstration, the capability approval test programme shall be in accordanc
31、e with the relevant capability detail specification. Demonstration of additional capability shall be in accordance with BS 123000:2001, 5.3.3. NOTEFor composite test pattern specimens, see clause 9 and Figure 1. Examples of multiple arrangements of test patterns are shown in Figure 2. There shall be
32、 no failures during any demonstration of capability. 8 Quality conformity inspection 8.1 General Quality conformity inspection shall be conducted on samples that are either taken from the production batch, or representative of the production batch (i.e. manufactured using the same processes, having
33、the same features, and concurrent with the released batch). 8.2 Sampling plans The sampling plans of BS 6001-1, as referenced in Table 1, Table 2 and Table 3, shall be used. In all cases there shall be no defects. NOTE 1Unless otherwise specified, production boards and/or specially designed test pat
34、terns may be used for carrying out tests for the lot-by-lot and periodic inspection. NOTE 2Where specially designed test patterns are used, they may be included in the panel. They may be based upon the appropriate pattern of the composite test pattern as detailed in clause 9. 8.3 Inspection groups I
35、nspection level C shall be used, unless another inspection level is specified in the customer detail specification. Other inspection levels shall be in accordance with Table 1 and Table 2. Printed boards shall be aggregated into inspection lots in accordance with BS 123000:2001, 6.1. NOTEFor definit
36、ion of the inspection groups, see BS 123000:2001, 6.3. Quality conformity inspection shall be carried out in accordance with Table 1, Table 2 and Table 3. Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 24 06:26:53 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS 123100:2001 BSI 17 December 2001 3
37、Table 1 Group A quality conformity inspection Inspection group CharacteristicsTest no.aAssessment level AAssessment level BAssessment level CAssessment level D ILbAQLcILAQLILAQLILAQL Sub-group A1 Visual inspection See BS 123000:2001, 7.2.5 See BS 123000:2001, 7.2.5 Conformity1S22.5 %100 % Identifica
38、tion1S22.5 %100 % Appearance1aS22.5 %100 % Workmanship1aS22.5 %100 % Conductor defects1aS22.5 %100 % Misalignment of solder resist and land1aS22.5 %100 % Particles between conductors1b, 1cS22.5 %100 % Sub-group A2 Dimensional examination Board dimensions2S14.0 %S42.5 % Holes2S14.0 %S42.5 % Slots, no
39、tches2S14.0 %S42.5 % Conductor width2S14.0 %S42.5 % Conductor spacing2S14.0 %S42.5 % Misalignment of hole and land2S14.0 %S42.5 % Positional tolerance of hole centres2S14.0 %S42.5 % Misalignment of solder resist and land2aS12.5 %S42.5 % Subgroup A3Spare group for additional group A tests NOTEThis li
40、sting may be subject to continuing review, as required by the publication and revision of new capability detail specifications. a As specified in BS 6221-2:1991. b Inspection level (defined in BS 6001-1:1999, Table 1). c Acceptable quality level. Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 2
41、4 06:26:53 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS 123100:2001 4 BSI 17 December 2001 Table 2 Group B quality conformity inspection Inspection group CharacteristicsTest no. aAssessment level AAssessment level BAssessment level CAssessment level D ILbAQLcILAQLILAQLILAQL Sub-group B1 Dimensional
42、 interchangeability See BS 123000:2001, 7.2.5 See BS 123000:2001, 7.2.5 Board thickness (contact zone)2S22.5 % Flatness12aS32.5 % Sub-group B2 Solderability As received14aS22.5 %S32.5 % After accelerated ageing20aS22.5 %S32.5 % Sub-group B3 Thermal shock tests Not applicable Sub-group B4 Mechanical
43、tests Peel strength, standard atmospheric conditions 10aS22.5 % Pull-off strength, lands with plain holes11aS22.5 % Sub-group B5 Surface finish tests Adhesion of plating13aS12.5 %S22.5 % Porosity of edge contact plating13d #, 13e S12.5 %S22.5 % Thickness of plating, contact areas13fS22.5 % Sub-group
44、 B6 Spare group for additional group B tests Testing details marked “#” shall be included in the relevant capability detail specification. NOTEThis listing may be subject to continuing review, as required by the publication and revision of new capability detail specifications. a As specified in BS 6
45、221-2:1991. b Inspection level (defined in BS 6006-1:1999, Table 1). c Acceptability quality level. Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 24 06:26:53 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS 123100:2001 BSI 17 December 2001 5 Table 3 Group C quality conformity inspection Inspectio
46、n group CharacteristicsTest no.a Assessment level AAssessment level BAssessment level CAssessment level D No.b DefectscNo. DefectsNo.DefectsNo.Defects Sub-group C1 Tests in 3-month intervals See BS 123000:2001, 7.2.5 See BS 123000:2001, 7.2.5 Insulation resistance: as received, and after damp heat6a
47、201 Process contamination#201 Resistance to solder#61 Solvent and flux resistance#61 Sub-group C2 Tests in 12-month intervals Not applicable Sub-group C3 Spare group for additional intervals Testing details marked “#” shall be included in the relevant capability detail specification. NOTEThis listin
48、g may be subject to continuing review, as required by the publication and revision of new capability detail specifications. a As specified in BS 6221-2:1991. b Number of specimens to be tested. c Maximum permissible number of defects. Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 24 06:26:53 G
49、MT+00:00 2006, Uncontrolled Copy, (c) BSI BS 123100:2001 6 BSI 17 December 2001 9 Test patterns and test boards 9.1 General A test pattern shall consist of: a) a part of a conductive pattern on a production board (and used in the application of the printed board); or b) a special test pattern particularly designed and prepared for the purpose of testing only. A test pattern shall be located: 1) on a test coupon (a portion of a printed board or a panel detached prior to using the printed board); or 2) on a separate test board.