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1、BRITISH STANDARD BS CECC 200025:1998 Harmonized system of quality assessment for electronic components Process Assessment Schedule: Printed board assembly facilities ICS 31.180 Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:20 GMT+00:00 2006, Uncontrolled
2、 Copy, (c) BSI BS CECC 200025:1998 This British Standard, having been prepared under the direction of the Electrotechnical Sector Board, was published under the authority of the Standards Board and comes into effect on 15 August 1998 BSI 05-1999 ISBN 0 580 30192 3 National foreword This British Stan
3、dard is the English language version of CECC 200 025:1998 published by the European Electronic Components Committee (CECC) of the European Committee for Electrotechnical Standardization (CENELEC). The UK participation in its preparation was entrusted to Technical Committee EPL/501, Electronic Assemb
4、ly technology, which has the responsibility to: aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments
5、and promulgate them in the UK. A list of organizations represented on this committee can be obtained on request to its secretary. Cross-references The British Standards which implement international or European publications referred to in this document may be found in the BSI Standards Catalogue und
6、er the section entitled “International Standards Correspondence Index”, or by using the “Find” facility of the BSI Standards Electronic Catalogue. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct a
7、pplication. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, the CECC title page, pages 2 to 30 and a back cover. This standard has been updated (see copyright
8、date) and may have had amendments incorporated. This will be indicated in the amendment table on the inside front cover. Amendments issued since publication Amd. No.DateComments Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:20 GMT+00:00 2006, Uncontrolle
9、d Copy, (c) BSI BS CECC 200025:1998 BSI 05-1999i Contents Page National forewordInside front cover Foreword2 Text of CECC 200 0253 Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:20 GMT+00:00 2006, Uncontrolled Copy, (c) BSI ii blank Licensed Copy: London
10、South Bank University, London South Bank University, Sat Dec 09 01:23:20 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM CECC 200 025 May 1998 Process Assessment Schedule: Printed board assembly facilities Up-to-date lists and bibliographical references o
11、f other Process Assessment Schedules may be obtained on application to the Central Secretariat or to any CENELEC member. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, N
12、etherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom. CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B-1050 Brussels 1998
13、CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC members Ref. No. CECC 200 025:1998 E Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:20 GMT+00:00 2006, Uncontrolled Copy, (c) BSI CECC 200025:1998 BSI 05-1999 2
14、 Foreword This Process Assessment Schedule was prepared by: Joint BSI EPL91/EPL52 Working Party, (Now EPL 501) UK on behalf of Technical Committee CENELEC TC/CECC SC 91, Surface mount technology. It is based, wherever possible, on publications of the International Electrotechnical Commission (IEC).
15、Contents Page Foreword2 Introduction3 1General requirements3 1.1Scope3 1.2Definitions and abbreviations3 1.3Related documents3 1.4Units, symbols and terminology4 1.5Quality system4 1.6Rework and repair of printed board assemblies4 2Quality requirements of the process sequence5 2.1Process description
16、5 2.2Quality factors6 2.3Process specifications9 2.4Demonstration, verification and validation programmes9 2.5Maintenance programmes9 2.6Electrical, mechanical and environmental test methods9 2.7Identification and traceability10 3Specialist Assembly Facility documentation requirements10 3.1Process M
17、anual10 3.2Process Approval reports10 3.3Abstract of description of Process Approval10 4Audits11 4.1General11 4.2Audit preparation plans11 4.3Audit checklists11 4.4Internal audits11 4.5External audits11 5Corrective actions and failure analysis12 5.1Corrective actions12 5.2Failure analysis12 Page 6In
18、terface between Assembly Facility and Customer12 6.1General12 6.2Customer enquiries, orders and contracts13 6.3Guidance to Customer Document (GCD)13 6.4Customer Detail Specifications14 6.5Post-supply liaison16 7Training16 7.1General16 7.2Training procedures16 8Notification of modifications to capabi
19、lity16 Annex A Definitions17 Annex B Form and content of process specifications18 Annex C Form and content of Process Manuals19 Annex D Format of first page of Process Approval report23 Annex E Example abstract of description of Process Approval24 Annex F Audit check list (technical)24 Annex G Abbre
20、viations30 Figure C.1 Example activity flowchart for printed board assembly operations7 Table 1 Example matrix of critical parameters7 Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:20 GMT+00:00 2006, Uncontrolled Copy, (c) BSI CECC 200025:1998 BSI 05-199
21、93 Introduction The CECC 200 000 series of specifications applies to Process Approval of specialist contractors to the electronic components industry in accordance with RP14-V. The mechanism of Process Approval is described in the Process Assessment Schedule (PAS) which defines how the principles gi
22、ven in RP14-V are applied to a given process activity or service. PASs are a concept in CECC specifying in greater detail the manufacturing process and the associated quality factors. They are aimed at reducing or eliminating the need for costly end-of-line testing. PAS documentation also permits, w
23、here relevant, the application of Statistical Process Control techniques. This specification describes the requirements that a Printed Board Assembly Facility must satisfy in order to obtain a CECC Specialist Contractor Approval for the manufacture of soldered printed board assemblies. The Process A
24、pproval concept places emphasis on understanding of the technology concerned and on process control. NOTEThe term “Assembly Facility” has been chosen to describe the assembly activity of both contract equipment manufacturers (CEMs) and original equipment manufacturers (OEMs). 1 General requirements
25、1.1 Scope This PAS specifies the terms, definitions, symbols, quality system, assessment and verification methods, and other requirements relevant to the operation of a printed board Assembly Facility in compliance with the general requirements of the CECC System for electronic components of assesse
26、d quality. Whereas Technology Approval requires that constituent added electronic components shall be CECC-approved, under the Process Approval system, printed boards and the components attached to them need not necessarily be CECC-approved items. The use of CECC-approved added components and printe
27、d boards is recommended and where all of them are so released, the assembly may itself be released by the Assembly Facility under a CECC Certificate of Conformity. However, it is impractical to make the use of CECC-approved components mandatory and the wishes of the customer are of primary considera
28、tion. Where one or more non CECC-approved components are use in a specific assembly, the approved specialist Assembly Facility may release it as having been assembled using a CECC-approved process using the following wording: “This soldered printed board assembly is (or These soldered assemblies are
29、) released by a CECC-approved facility as having been assembled and tested using processes, methods and controls meeting the requirements of CECC 200 025”. 1.2 Definitions and abbreviations Definitions relevant to the technology in addition to those given in CECC RP14-V are given in Annex A. Where a
30、n Assembly Facility uses terms other than those found in Annex A, such terms shall be defined in the Assembly Facilitys Process Manual. Abbreviations are given in Annex G. 1.3 Related documents 1.3.1 Requirements The Assembly Facility shall list all documents referenced in its Process Manual under t
31、he following, or similar, headings: documents referenced in the PAS other National or International Standards internal (i.e. Assembly Facilitys own) issued documents The list shall give full titles and reference numbers in respect of documents to which reference is made in the Process Manual. Subseq
32、uently, it is sufficient to quote the reference number only (for example, “EN ISO 9002”). Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:20 GMT+00:00 2006, Uncontrolled Copy, (c) BSI CECC 200025:1998 4 BSI 05-1999 1.3.2 Documents referenced in this PAS EN
33、 100114-1, Rule of procedure 14 Quality Assessment Procedures Part 1: CECC requirements for the approval of an organization (RP14-I). CECC 00 114-5, Rule of procedure 14: Quality assessment procedures Part 5: Process approval of specialist contractors within the electronic components industry (RP14-
34、V). CECC 00 200, CECC Qualified Products List. CECC 00 401, Glossary of abbreviations, terms and definitions of the CECC System. EN ISO 9000, Quality management and quality assurance standards Guidelines for selection and use. EN ISO 9002, Quality systems Model for quality assurance in production, i
35、nstallation and servicing. IEC 61189, Test methods for electrical materials, printed boards and other interconnection structures and assemblies. IEC 61191-1, Printed board assemblies Part 1: Generic specification Soldered electrical and electronic assemblies using surface mount and related assembly
36、technologies. IEC 61191-2, Part 2: Sectional specification Surface mount soldered assemblies. IEC 61191-3, Part 3: Sectional specification Through-hole mount soldered assemblies. IEC 61191-4, Part 4: Sectional specification Terminal soldered assembly. IEC 61760-1, Surface mounting technology Part 1:
37、 Standard method for the specification of surface mounting components (SMDs). CECC 200 003, Technical assessment schedule for printed board manufacturing facilities. CECC 200 012, Process assessment schedule for printed board design facilities. 1.4 Units, symbols and terminology Units, graphical sym
38、bols, letter symbols and terminology shall, whenever possible, be taken from the following documents: ISO 1000, SI units and recommendations for the use of their multiples and of certain other units. IEC 60027, Letter symbols to be used in electrical technology. IEC 60050, International electrotechn
39、ical vocabulary. IEC 60617, Graphical symbols for diagrams. ISO 1000, SI units and recommendations for the use of their multiples and of certain other units. Any otherer units, symbols and terminology peculiar to the processes or services covered by this PAS shall be taken from the relevant IEC or I
40、SO documents, listed under “Related documents”. NOTEAll terms and concepts specifically relating to Process Approval are explained in RP14-V, in other parts of RP14 or in CECC 00 401. Specialist assemblers who are unfamiliar with these documents are advised to study them. 1.5 Quality system The Asse
41、mbly Facility shall establish and maintain a quality system satisfying the requirements of EN ISO 9002, as invoked by RP14-I and RP14-V. Certain of these requirements receive particular attention and are developed further in the following subclauses of this PAS. In carrying out the appraisal of an A
42、ssembly Facility, the ONS shall take account of any relevant certificate to EN ISO 9002 issued by an organisation declared competent to do so by the appropriate national authority. 1.6 Rework and repair of printed board assemblies 1.6.1 Rework Rework is defined in Annex A and may be carried out opti
43、onally to correct process deviations that are within the allowable process limits or as a mandatory operation where it is necessary to rectify errors classed as “unacceptable”. Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:20 GMT+00:00 2006, Uncontrolled
44、 Copy, (c) BSI CECC 200025:1998 BSI 05-19995 Rework is carried out either by means not differing from the current manufacturing process (reprocessing), or by the rework processes as permitted by the relevant Process Approval document(s)/Process Assessment Schedule(s) or by a combination of both; and
45、 using methods that do not cause unacceptable degradation of the reliability of the assembly. Where the purchaser of an assembly, or any other third party, performs an electrical test or visual inspection that may not have been carried out by the original approved facility and non-conformance occurs
46、, provided the assembly has not been released, it may be reworked by any facility approved to carry out the type of rework used, retested and inspected to the original applicable standard and then be released either by the original approved assembly facility, or by any other facility approved under
47、this specification. When the pre-release rework is carried out by an unapproved assembly facility or any other unapproved organisation, the assembly shall not be claimed as having been manufactured and released under this specification or under any other CECC specification. 1.6.2 Repair Repair is de
48、fined in Annex A. Under the CECC system for release of approved components or of assemblies made using processes of assessed quality by an approved facility, repaired products may not be re-released as conforming with the original or any other CECC specification, even though they may be tested and f
49、ound to meet the requirements. 2 Quality requirements of the process sequence 2.1 Process description The activities covered by this PAS are: The manufacture, electrical test and subsequent control of subcontracted electrical testing of soldered printed board assemblies (Class A), or, The manufacture and electrical test of soldered printed board assemblies (Class B). A Process Approval for this activity shall fall into one of the two categories (Class A or Class B) set out in 2.1.1 and 2.1.2. The Assembly Facility shall declare