BS-CECC-63101-1985.pdf

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1、BRITISH STANDARD BS CECC 63101:1985 Incorporating Amendment No. 1 Specification for Harmonized system of quality assessment for electronic components Blank detail specification: film and hybrid integrated circuits Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09

2、01:27:23 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 63101:1985 BSI 10-1999 ISBN 0 580 35618 3 Amendments issued since publication Amd. No.Date of issueComments 6595July 1990Indicated by a sideline in the margin Licensed Copy: London South Bank University, London South Bank University, Sat De

3、c 09 01:27:23 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 63101:1985 BSI 10-1999i Contents Page National forewordii Forewordiii Text of CECC 631011 Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:27:23 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC

4、 63101:1985 ii BSI 10-1999 National foreword This British Standard has been prepared under the direction of the Electronic Components Standards Committee. It is identical with CENELEC Electronic Components Committee (CECC) 63101:1984 “Harmonized system of quality assessment for electronic components

5、. Blank detail specification: Film and hybrid integrated circuits”. Terminology and conventions. The text of the CECC specification has been approved as suitable for publication as a British Standard without deviation. Some terminology and certain conventions are not identical with those used in Bri

6、tish Standards; attention is drawn especially to the following. The comma has been used as a decimal marker. In British Standards it is current practice to use a full point on the baseline as the decimal marker. Cross-references. The British Standard which implements CECC 00100 is BS 9000 “General r

7、equirements for a system for electronic components of assessed quality” Part 2 “Specification for national implementation of CECC basic rules and rules of procedure”. The Technical Committee has reviewed the provision of IEC 147 and IEC 410, to which reference is made in the text, and has decided th

8、at they are acceptable for use in conjunction with this standard. A related British Standard for IEC 147 is BS 9300 “Semiconductor devices of assessed quality: Generic data and methods of test” and a related British Standard for IEC 410 is BS 6001 “Sampling procedures and tables for inspection by at

9、tributes”. Scope. This standard lists the ratings, characteristics and inspection requirements which shall be included as mandatory requirements in accordance with BS CECC 63100 in any detail specification for these devices. Detail specification layout. The front page layout of detail specifications

10、 released to BS CECC family or blank detail specifications will be in accordance with BS 9000 Circular Letter No. 15. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a

11、 British Standard does not of itself confer immunity from legal obligations. International StandardsCorresponding British Standards CECC 63000:1984BS CECC 63000:1985. Harmonized system of quality assessment for electronic components. Generic specification. Film and hybrid integrated circuits (Identi

12、cal) CECC 63100:1984BS CECC 63100:1985. Harmonized system of quality assessment for electronic components. Sectional specification. Film and hybrid integrated circuits (Identical) Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, the CECC title page, page

13、s ii to iv, pages 1 to 6 and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on the inside front cover. Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:2

14、7:23 GMT+00:00 2006, Uncontrolled Copy, (c) BSI Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:27:23 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 63101:1985 ii BSI 10-1999 Contents Page Forewordiii Section 1. General data 1.1Recommended methods of moun

15、ting1 1.2Dimensions, characteristics and conditions of use1 1.3Related documents1 1.4Marking1 1.5Ordering information1 1.6Certified test records1 1.7Additional information2 1.8Additional or increased severities or requirements to those specified in the generic and/or sectional specification2 Section

16、 2. Inspection requirements 2.1Procedures3 Table 1 91 Table 24 Table 35 Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:27:23 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 63101:1985 BSI 10-1999iii Foreword The CENELEC Electronic Components Committee (CE

17、CC) is composed of those member countries of the European Committee for Electrotechnical Standardization (CENELEC) who wish to take part in a harmonized System for electronic components of assessed quality. The object of the System is to facilitate international trade by the harmonization of the spe

18、cifications and quality assessment procedures for electronic components, and by the grant of an internationally recognized Mark, or Certificate, of Conformity. The components produced under the System are thereby accepted by all member countries without further testing. This specification has been f

19、ormally approved by the CECC, and has been prepared for those countries taking part in the System who wish to issue national harmonized specifications for FILM and HYBRID INTEGRATED CIRCUITS (F also national reference if different. 4 If different from the CECC number, the national number of the deta

20、il specification, date of issue and any further information required by the national system, together with any amendment numbers. DocumentsVoting dateReport on the voting CECC (Secretariat) 1182August 1982CECC (Secretariat) 1279 CECC (Secretariat) 1368July 1983CECC (Secretariat) 1415 Licensed Copy:

21、London South Bank University, London South Bank University, Sat Dec 09 01:27:23 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 63101:1985 iv BSI 10-1999 5 A brief description of the technique and the type or function of the hybrid circuit. 6 Information on typical construction (where applicable)

22、. For 5 and 6 the text to be given in the detail specification should be suitable for an entry in CECC 00200 (QPL) and CECC 00300 (Library List). 7 An outline drawing with main dimensions which are of importance for interchangeability and/or reference to the appropriate national or international doc

23、ument for outlines. Alternatively, this drawing may be given in an appendix to the detail specification. 8 The levels of quality assessment covered by the detail specification. 9 Reference data giving information on the most important properties of the F customers are advised to refer to 3.7.3 2) of

24、 CECC 63000. 1.7 Additional information (not for inspection purposes) The detail specification may include information (which is not normally required to be verified by the inspection procedure) such as circuit diagrams, curves, drawings and notes for the clarification of the detail specification. 1

25、.8 Additional or increased severities or requirements to those specified in the generic and/or sectional specification NOTEAdditions or increased requirements should be specified only when essential. Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:27:23 GMT+0

26、0:00 2006, Uncontrolled Copy, (c) BSI BS CECC 63101:1985 BSI 10-19993 Section 2. Inspection requirements (See Table 2 and Table 3) 2.1 Procedures 2.1.1 For qualification approval the procedure shall be in accordance with CECC 63100. 2.1.2 For quality conformance inspection the test schedule includes

27、 sampling, periodicity, severities and requirements. The formation of inspection lots is covered by 3.2.2 1) of CECC 63100. Table 2 and Table 3 NOTE 1Clause numbers of tests and performance requirements refer to CECC 63000. NOTE 2ILs and AQLs given in Table 3A of CECC 63100 are selected from IEC 410

28、. NOTE 3In these tables: p = periodicity (in months) n = sample size c = acceptance criterion (permitted number of defectives) D = destructive ND = non-destructive IL = inspection level IEC 410 AQL = acceptable quality level Licensed Copy: London South Bank University, London South Bank University,

29、Sat Dec 09 01:27:23 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 63101:1985 4 BSI 10-1999 Table 2 (See notes on page 6) Clause numbers, tests and test sequences D or ND Conditions of test Sample size and criterion of acceptability Performance requirements Screening(1)ND 4.6.1ScheduleRequired/N

30、ot required Group A Inspection ILAQL To be conducted on a sampling basis, lot-by-lot Sub-Group A1ND 4.3.2External visual examination and marking Sub-Group A2ND 4.4.11Major static/dynamic electrical characteristics at room temperature(2) Sub-Group A3ND 4.4.11Major static/dynamic electrical characteri

31、stics at extreme operating temperatures Group B Inspection To be conducted on a sampling basis, lot-by-lot Sub-Group B1D 4.5.10Solderability(3)(4) Sub-Group B2ND 4.3.3Dimensions (continued) Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:27:23 GMT+00:00 2006,

32、 Uncontrolled Copy, (c) BSI BS CECC 63101:1985 BSI 10-19995 Table 3 (See notes on page 6) Clause numbers, tests and test sequences D or ND Conditions of test Sample size and criterion of accept ability Performance requirements pnc Group C Inspection To be conducted on a sampling basis at prescribed

33、periodicity Sub-Group C1ND 4.4.11Major static/dynamic electrical characteristics at extreme operating temperatures Sub-Group C2D/ND Sequence(5) (6) Initial measurements4.4.11Sub-Group 05 4.5.6 Vibration, swept frequency and 4.5.7Acceleration, steady state or (7) 4.5.5Shock and 4.5.7Acceleration, ste

34、ady state Final measurements4.5.9 4.4.11 Sealing Sub-Group 05 Sub-Group C3D Sequence Initial measurements4.4.11Sub-Group 05 4.5.11 4.5.15 4.5.8 4.5.3 Resistance to soldering heat Resistance to solvents Change of temperature Damp heat, steady state (8) Final measurements4.5.9 4.4.11 4.3.2 Sealing (5)

35、 Sub-Group 05 External visual examination and marking Sub-Group C4ND Sequence Initial measurements4.4.11Sub-group 05 4.5.2 4.5.1 Cold Storage at high temperature Temperature: C Temperature: C Final measurements4.4.11Sub-group 05 (continued) Licensed Copy: London South Bank University, London South B

36、ank University, Sat Dec 09 01:27:23 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 63101:1985 6 BSI 10-1999 Table 3 Notes on Table 2 and Table 3 (1) For screening, the percentage of defects allowed (PDA) shall be prescribed in the detail specification. Screening schedule to be selected from CECC

37、 63000 unless otherwise stated in the detail specification. (2) Not mandatory if 100 % screened. (3) Use of electrical rejects permitted. (4) This test is destructive except where the lead finish is not materially altered by the test or when the customer is prepared to accept the solderability test

38、sample. (5) Cavity circuits only. (6) Mounting conditions as prescribed by the detail specification. (7) The detail specification shall prescribe which option is to be used. (8) The detail specification may waive the damp heat test for unencapsulated circuits. (9) Applicable to encapsulations having

39、 organic material used for sealing purpose. Clause numbers, tests and test sequences D or ND Conditions of test Sample size and criterion of accept ability Performance requirements pnc Group D Inspection To be conducted on a sampling basis at prescribed periodicity Sub-Group D1D Initial measurements

40、4.4.11Sub-Group 05 4.5.14Endurance: 1 000 h Endurance: 2 000 h Extended endurance: 8 000 h (for information only) Final measurements4.4.11Sub-group 05 Sub-Group D2D Sequence 4.5.12 (3) (1) Tensile (3) Bending (wire/strip) Final measurements or (7) 4.5.9Sealing (5) (1) Tensile (3) Bending (row) (2) T

41、hrust Final measurements4.5.9Sealing (5) 4.5.16Induced flammability (9) (for information only Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:27:23 GMT+00:00 2006, Uncontrolled Copy, (c) BSI blank Licensed Copy: London South Bank University, London South Bank

42、 University, Sat Dec 09 01:27:23 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 63101:1985 BSI 389 Chiswick High Road London W4 4AL BSI British Standards Institution BSI is the independent national body responsible for preparing British Standards. It presents the UK view on standards in Europe a

43、nd at the international level. It is incorporated by Royal Charter. Revisions British Standards are updated by amendment or revision. Users of British Standards should make sure that they possess the latest amendments or editions. It is the constant aim of BSI to improve the quality of our products

44、and services. We would be grateful if anyone finding an inaccuracy or ambiguity while using this British Standard would inform the Secretary of the technical committee responsible, the identity of which can be found on the inside front cover. Tel: 020 8996 9000. Fax: 020 8996 7400. BSI offers member

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48、 with standards developments and receive substantial discounts on the purchase price of standards. For details of these and other benefits contact Membership Administration. Tel: 020 8996 7002. Fax: 020 8996 7001. Copyright Copyright subsists in all BSI publications. BSI also holds the copyright, in

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