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1、BRITISH STANDARD BS EN 165000-1:1996 Harmonized system of quality assessment for electronic components Film and hybrid integrated circuits Part 1: Generic specification Capability approval procedure The European Standard EN 165000-1:1996 has the status of a British Standard ICS 31.200 Licensed Copy:
2、 sheffieldun sheffieldun, na, Fri Nov 17 08:29:55 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS EN 165000-1:1996 This British Standard, having been prepared under the direction of the Electrotechnical Sector Board, was published under the authority of the Standards Board and comes into effect on 15
3、October 1996 BSI 11-1998 The following BSI references relate to the work on this standard: Committee reference EPL/47/1 Draft for comment 92/216398 DC ISBN 0 580 26183 2 Committees responsible for this British Standard The preparation of this British Standard was entrusted by Technical Committee EPL
4、/47, Semiconductors, to Subcommittee EPL/47/1, Film and hybrid integrated circuits, upon which the following bodies were represented: Federation of the Electronics Industry Ministry of Defence National Supervising Inspectorate (BSI Product Certification) Amendments issued since publication Amd. No.D
5、ateComments Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 17 08:29:55 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS EN 165000-1:1996 BSI 11-1998i Contents Page Committees responsibleInside front cover National forewordii Foreword2 Text of EN 165000-15 List of referencesInside back cover Licens
6、ed Copy: sheffieldun sheffieldun, na, Fri Nov 17 08:29:55 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS EN 165000-1:1996 ii BSI 11-1998 National foreword This British Standard has been prepared by Subcommittee EPL/47/1 and is the English language version of EN 165000-1:1996, Film and hybrid integrat
7、ed circuits Part 1: Generic specification. Capability approval procedure published by the European Committee for Electrotechnical Standardization (CENELEC). Cross-references Publication referred toCorresponding British Standard BS EN 165000 Film and hybrid integrated circuits EN 165000-2:1996BS EN 1
8、65000-2:1996 Internal visual inspection and special tests EN 165000-3:1996BS EN 165000-3:1996 Self-audit checklist and report for film and hybrid integrated circuit manufacturers EN 165000-4:1996BS EN 165000-4:1996 Customer information, product assessment level schedules and blank detail specificati
9、on IEC 50BS 4727 Glossary of electrotechnical, power, telecommunication, electronics, lighting and colour terms EN 60068 Environmental testing EN 60068-1:1994 (IEC 68-1:1988) BS EN 60068-1:1995 General and guidance IEC 68-2BS EN 60068-2 Test methods EN 60068-2-1:1993 (IEC 68-2-1:1990) BS EN 60068-2-
10、1:1993 Tests A. Cold EN 60068-2-2:1993 (IEC 68-2-2:1974) BS EN 60068-2-2:1993 Tests B. Dry heat BS 2011 Environmental testing Part 2.1 Tests HD 323.2.3 S2:1987 (IEC 68-2-3:1969) Part 2.1Ca:1977 Test Ca. Damp heat, steady state BS EN 60068 Environmental testing BS EN 60068-2 Test methods EN 60068-2-6
11、:1995 (IEC 68-2-6:1995) BS EN 60068-2-6:1996 Test Fc. Vibration (sinusoidal) EN 60068-2-7:1993 (IEC 68-2-7:1983) BS EN 60068-2-7:1993 Test Ga and guidance. Acceleration, steady state BS 2011 Environmental testing Part 2.1 Tests HD 323.2.11 S1:1988 (IEC 68-2-11:1981) Part 2.1Ka:1982 Test Ka. Salt mis
12、t HD 323.2.14 S2:1987 (IEC 68-2-14:1984) Part 2.1N:1985 Test N. Change of temperature BS EN 60068 Environmental testing BS EN 60068-2 Test methods EN 60068-2-17:1994 (IEC 68-2-17:1994) BS EN 60068-2-17:1995 Test Q. Sealing BS 2011 Environmental testing Part 2.1 Tests Licensed Copy: sheffieldun sheff
13、ieldun, na, Fri Nov 17 08:29:55 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS EN 165000-1:1996 BSI 11-1998iii HD 323.2.20 S3:1988 (IEC 68-2-20:1979) Part 2.1T:1981 Test T. Soldering HD 323.2.21 S3:1988 (IEC 68-2-21:1983) BS 2011:Part 2.1U:1984 Test U. Robustness of terminations and integral mounting
14、 devices BS EN 60068 Environmental testing BS EN 60068-2 Test methods EN 60068-2-27:1993 (IEC 68-2-27:1987) BS EN 60068-2-27:1993 Environmental testing procedures. Tests. Test Ea and guidance. Shock BS 2011 Environmental testing Part 2.2 Guidance IEC 68-2-28:1990Part 2.2C Part 3: Self-audit checklis
15、t and report for film and hybrid integrated circuit manufacturers; Part 4: Customer information, product assessment level schedules and blank detail specification. Part 3 is primarily intended as a pro-forma for the manufacturer and is not considered essential for a customer in this form. Part 4 is
16、considered an essential document for all users; in particular it includes a helpful introductory section which is aimed at potential customers and seeks to explain the underlying philosophy upon which the whole standard is based. Contents Page Foreword2 1General5 1.1Scope5 1.2Normative references5 1
17、.3Units, symbols and terminology7 1.4Standard and preferred values9 1.5Marking9 2Quality assessment procedures9 2.1General9 2.1.1Eligibility for capability approval9 2.1.2Primary stage of manufacture9 2.1.3Subcontracting9 2.1.4Control of procurement sources and incoming material10 2.1.5Validity of r
18、elease for delivery10 2.1.6Rework10 2.2Procedures for capability approval11 2.2.1Application for capability approval11 2.2.2Granting of capability approval11 2.2.3Description of capability11 2.2.4Capability qualifying components12 2.2.5Demonstration and verification of capability12 2.2.6Procedures t
19、o be followed in the event of CQC failures15 2.2.7Abstract of description of capability15 2.3Procedures following the granting of capability approval15 2.3.1Maintenance of capability approval15 2.3.2Notification of changes likely to affect the validity of capability approval15 2.4Release for deliver
20、y16 2.4.1General16 2.4.2Quality conformance inspection requirements16 2.4.3Detail specification17 2.4.3(1)General17 2.4.3(2)Customer detail specification17 2.4.3(3)Detail specification for standard catalogue circuits to be included in the Qualified Products List (QPL)17 3Test and measurement procedu
21、res 18 3.1General18 3.2Standard conditions for testing18 latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement(dop) 1997-03-01 latest date by which the national standards conflicting with the EN have to be withdrawn(dow
22、) 1997-03-01 Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 17 08:29:55 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EN 165000-1:1996 BSI 11-19983 Page 3.3Visual inspections and package dimensions20 3.4Electrical measurement procedures20 3.5Environmental test procedures21 Figure 1 Definition of a
23、xis for mechanical and other tests19 Figure 2 Pulling force for bond strength test43 Figure 3 Apparatus requirements for the added component bond strength destructive test48 Table 1 Severities for damp heat, steady-state, Method 223 Table 2 Severities for damp heat, steady-state, Method 325 Table 3
24、Preferred conditions for shock27 Table 4 Parameters for sealing test, Method 131 Table 5 “Preheat” times34 Table 6 Minimum pulling force42 Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 17 08:29:55 GMT+00:00 2006, Uncontrolled Copy, (c) BSI 4 blank Licensed Copy: sheffieldun sheffieldun, na, Fr
25、i Nov 17 08:29:55 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EN 165000-1:1996 BSI 11-19985 1 General 1.1 Scope This specification prescribes the quality assessment procedures and methods of tests to be used in the assessment of film and hybrid integrated circuits intended for use in electronic equip
26、ment, under the capability approval procedure. It also applies to part completed devices supplied to customers for subsequent processing. It should be read in conjunction with EN 165000-2, EN 165000-3 and EN 165000-4. 1.2 Normative references This European Standard incorporates by dated or undated r
27、eference, provisions from other publications. These normative references are cited at the appropriate places in the text and the publications are listed hereafter. For dated references, subsequent amendments to or revisions of any of these publications apply to this European Standard only when incor
28、porated in it by amendment or revision. For undated references the latest edition of the publication referred to applies (including amendments). PublicationYearTitleEN/HDYear IEC 27Letter symbols to be used in electrical technology IEC 50International Electrotechnical Vocabulary IEC 68-11988Environm
29、ental testing Part 1: General and guidance EN 60068-11994 + Corrigendum + A1 1988 1992 IEC 68-2-1 A1 A2 1990 1993 1994 Part 2: Tests Tests A: ColdEN 60068-2-1 A1 A2 1993 1993 1994 IEC 68-2-2 + IEC 68-2-2A A1 A2 1974 1976 1993 1994 Tests B: Dry heatEN 60068-2-2 A1 A2 1993 1993 1994 IEC 68-2-3 + A1 19
30、69 1984 Test Ca: Damp heat, steady stateHD 323.2.3 S2 1987 IEC 68-2-6 + Corrigendum 1995 1995 Test Fc and guidance: Vibration (sinusoidal)EN 60068-2-6 1995 IEC 68-2-7 + A1 1983 1986 Test Ga and guidance: Acceleration, steady state EN 60068-2-7 1993 IEC 68-2-111981Test Ka: Salt mistHD 323.2.11 S11988
31、 IEC 68-2-14 + A1 1984 1986 Test N: Change of temperature HD 323-2-14 S2 1987 IEC 68-2-171994Test Q: SealingEN 60068-2-171994 IEC 68-2-20 + A1 + A2 1979 1986 1987 Test T: SolderingHD 323.2.20S3 1988 IEC 68-2-211983Test U: Robustness of terminations and integral mounting devices HD 323.2.21 S31988 +
32、A1 + A2 + A3 1985 1991 1992 IEC 68-2-271987Test Ea and guidance: ShockEN 60068-2-271993 Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 17 08:29:55 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EN 165000-1:1996 6 BSI 11-1998 PublicationYearTitleEN/HDYear IEC 68-2-281990Guidance for damp heat tests
33、IEC 68-2-30 + A1 1990 1985 Test Db: Damp heat, cyclicHD 323.2.30 S3 1988 IEC 68-2-33 + A1 1971 1978 Guidance on change of temperature testsHD 323.2.33 S1 1988 IEC 68-2-441979Guidance on Test T: SolderingHD 323.2.44 S11988 IEC 68-2-451980Test XA and guidance: Immersion in cleaning solvents EN 60068-2
34、-451992 A11993A11993 IEC 68-2-471982Mounting of components, equipment and other articles for dynamic tests including shock (Ea), bump (Eb), vibration (FC and FC), and steady-state acceleration (Ga) and guidance EN 60068-2-471993 IEC 1341961Rating systems for electronic tubes and valves and analogue
35、semiconductor devices IEC 191Mechanical standardization of semiconductor devices IEC 4401973Method of measurement for non-linearity in resistors IEC 617Graphic symbols for diagrams IEC 695-2-21991Fire hazard testing Part 2: Test methods Section 2: Needle-flame test EN 60695-2-2 + Corrigendum 1994 19
36、94 IEC 747-1a1983Semiconductor devices. Discrete devices Part 1: General + A1 + A2 1991 1993 IEC 748-1a1984Semiconductor devices. Integrated circuits Part 1: General IEC 7491984Semiconductor devices. Mechanical and climatic test methods + A1 + A2 1991 1993 CECC 00 007Sampling plans and procedures fo
37、r inspection by attributes CECC 00 114Quality Assessment Procedures (RP 14) Part I: Approval of manufacturers and other organizations (with addemdum) (RP 14/I) EN 100114-1 CECC 00 114/III Part III: Capability Approval of an electronic component manufacturing activity (RP 14/III) Radiographic inspect
38、ion of electronic components EN 100012 Protection of electrostatic sensitive devicesEN 100015 CECC 00 016Basic requirements for the use of Statistical Process Control (SPC) in the CECC systems Part 1: Minimum requirements CECC 00 020Register of firms, products and services approved under the CECC sy
39、stem Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 17 08:29:55 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EN 165000-1:1996 BSI 11-19987 1.3 Units, symbols and terminology 1.3.1 General Units, graphical symbols, letter symbols and terminology shall, wherever possible, be taken from the followin
40、g documents: Any other units, symbols and terminology peculiar to one of the components covered by a generic specification, shall be taken from the relevant IEC or ISO documents listed under “Related documents”, where not given below. 1.3.2 Terminology In addition to the general requirements of 1.3.
41、1, for the purposes of this generic and associated blank detail specifications the following definitions apply: Added component any component added to a hybrid film integrated circuit which is not formed on the surface of the substrate. NOTEAdded components are incorporated components (see 1.3 of RP
42、 14 Part III) excluding those formed on the substrate. Burn-in a non-destructive procedure designed to screen out early lifetime failures. Burn-in is an accelerated conditioning with a device under its operating electrical load at an elevated temperature, which is generally the maximum operating tem
43、perature that does not exceed the thermal rating of the device. Capability Qualifying Component (CQC) a test specimen used to assess, in part or in whole, a declared capability. It may be either a specially designed test specimen (process test vehicle) or a normal production circuit (qualification c
44、ircuit), or a combination of both. Category dissipation that fraction of the rated dissipation defined in the detail specification, applicable at the Upper Category Temperature taking account of the derating curve prescribed (where appropriate) in the detail specification. Custom built a qualifying
45、term for a circuit manufactured to a specific customers requirements. PublicationYearTitleEN/HDYear CECC 00 016Basic requirements for the use of Statistical Process Control (SPC) in the CECC systems Part 1: Minimum requirements CECC 00 020Register of firms, products and services approved under the C
46、ECC system CECC 00 300List of CECC European Standards (ENs), CECC Publications and Related National Documents CECC 00 400bHandbook for the production of CECC documents ECQAC 1120cHarmonized system of quality assessment for electronic components. ECQAC requirements for the drafting of qualification a
47、pproval and capability approval test reports ECQAC 1220cHarmonized system of quality assessment for electronic components. ECQAC policy or uncertainty of measurement ISO 1000SI units and recommendations for use of their multiples and of certain other units a Together with any other part of IEC 747 o
48、r IEC 748 relevant to the specific hybrid application, including terminology. b Superseded by the PNE-Rules (CEN/CENELEC internal regulations Part 3: Rules for the drafting and presentation of European Standards). c These documents were produced by the Electronic Components Quality Assurance Committ
49、ee of the CECC and may be obtained from the ONS. ECQAC 1120 is to be incorporated into the revision of RP 14 Part II, currently under discussion; this will be consist of two sections: Section 1: Qualification approval of electronic components, and Section 2: Release for delivery and validity of release. ECQAC 1220 will be incorporated into the revision RP 14 Part I, the voting for which is scheduled for completion in October 19