BS-EN-60068-2-54-2006.pdf

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1、BRITISH STANDARD BS EN 60068-2-54: 2006 Environmental testing Part 2-54: Tests Test Ta: Solderability testing of electronic components by the wetting balance method The European Standard EN 60068-2-54:2006 has the status of a British Standard ICS 19.040; 31.020 ? BS EN 60068-2-54:2006 This British S

2、tandard was published under the authority of the Standards Policy and Strategy Committee on 29 September 2006 BSI 2006 ISBN 0 580 49292 3 National foreword This British Standard was published by BSI. It is the UK implementation of EN 60068-2-54:2006. It is identical with IEC 60068-2-54:2006. It supe

3、rsedes BS 2011-2.1TA:1989 which is withdrawn. The UK participation in its preparation was entrusted to Technical Committee EPL/501, Electronic assembly technology. A list of organizations represented on EPL/501 can be obtained on request to its secretary. This publication does not purport to include

4、 all the necessary provisions of a contract. Users are responsible for its correct application. Compliance with a British Standard cannot confer immunity from legal obligations. Amendments issued since publication Amd. No. DateComments EUROPEAN STANDARD EN 60068-2-54 NORME EUROPENNE EUROPISCHE NORM

5、August 2006 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2006 CENELEC - All rights of exploitation in any form and by any mea

6、ns reserved worldwide for CENELEC members. Ref. No. EN 60068-2-54:2006 E ICS 19.040; 31.020 Supersedes HD 323.2.54 S1:1987 English version Environmental testing Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method (IEC 60068-2-54:2006) Essais denvi

7、ronnement Partie 2-54 : Essais - Essai Ta : Essai de brasabilit des composants lectroniques par la mthode de la balance de mouillage (CEI 60068-2-54:2006) Umweltprfungen Teil 2-54: Prfungen - Prfung Ta: Prfung der Ltbarkeit elektronischer Bauelemente mit der Benetzungswaage (IEC 60068-2-54:2006) Thi

8、s European Standard was approved by CENELEC on 2006-07-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical ref

9、erences concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC

10、 member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Irel

11、and, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. Foreword The text of document 91/576/FDIS, future edition 2 of IEC 60068-2-54, prepared by IEC TC 91, Electronics assembly tech

12、nology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60068-2-54 on 2006-07-01. This European Standard supersedes HD 323.2.54 S1:1987. The major technical changes with regard to HD 323.2.54 S1:1987 concern: the addition of lead free solder alloy (see Clause 7, Mate

13、rials); reversal of force-time curves to align with EN 60068-2-69 (see Figure 2 and Figure B.1); modification to the test requirement for progress of wetting (see Clause 9). The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an ident

14、ical national standard or by endorsement (dop) 2007-04-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2009-07-01 Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 60068-2-54:2006 was approved by CENE

15、LEC as a European Standard without any modification. _ EN 60068-2-54:2006 2 3 CONTENTS FOREWORD.2 1 Scope.4 2 Normative references4 3 Terms and definitions .4 4 General description of the test 4 5 Description of the test apparatus.5 5.1 Test system.5 5.2 Solder bath5 6 Preconditioning.5 6.1 Preparat

16、ion of specimens 5 6.2 Ageing.5 7 Materials 6 7.1 Solder .6 7.2 Flux.6 8 Procedure.6 8.1 Test temperature .6 8.2 Fluxing 6 8.3 Flux drying.7 8.4 Test.7 9 Presentation of results7 9.1 Form of chart-recorder trace7 9.2 Points of significance.8 9.3 Reference wetting force.8 9.4 Test requirements9 10 In

17、formation to be given in the relevant specification.9 Annex A (normative) Equipment specification .10 Annex B (informative) Guide to the use of the wetting balance for solderability testing 11 Bibliography17 Figure 1 Test arrangement .5 Figure 2 Wetting conditions8 Figure B.1 Representative force-ti

18、me curves 14 Table 1 Time sequence of the test7 EN 60068-2-54:2006 Annex ZA (normative) Normative references to international publications with their Annex B corresponding European publications 18 ENVIRONMENTAL TESTING Part 2-54: Tests Test Ta: Solderability testing of electronic components by the w

19、etting balance method 1 Scope This part of IEC 60068 outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by othe

20、r methods. For surface mounting devices (SMD), IEC 60068-2-69 should be applied if it is suitable. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. 2 Normative references The following referenced documents are indispensable for th

21、e application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60068-1:1988, Environmental testing Part 1: General and guidance IEC 60068-2-20:1979, Environmental test

22、ing Part 2: Tests Test T: Soldering IEC 61190-1-3, Attachment materials for electronic assembly Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications 3 Terms and definitions For the purposes of this document, the terms

23、 and definitions, as defined in IEC 60068-1 and IEC 60068-2-20, apply. 4 General description of the test The specimen is suspended from a sensitive balance (typically a spring system) and immersed edgewise to a set depth in a bath of molten solder at a controlled temperature. The resultant of the ve

24、rtical forces of buoyancy and surface tension acting upon the immersed specimen is detected by a transducer and converted into a signal which is continuously recorded as a function of time on a high-speed chart recorder. The trace may be compared with that derived from a perfectly wetted specimen of

25、 the same nature and dimensions. Two modes of testing exist: The stationary mode, intended to study the solderability of a particular place on the specimen. It is this mode which is standardized in this standard. The scanning mode, intended to study the homogeneity of the solderability of an extende

26、d region of the surface of the specimen. The standardization of this mode is still under consideration. EN 60068-2-54:2006 4 5 Description of the test apparatus 5.1 Test system A diagram of an arrangement suitable for the test is shown in Figure 1. Balance and transducer Signal conditioner Computer

27、or chart recorder Specimen Solder bath Bath lifting mechanism Control box IEC 477/06 Figure 1 Test arrangement Any other system capable of measuring the vertical forces acting on the specimen is admissible, provided that the system has the characteristics given in Annex A. 5.2 Solder bath The solder

28、 bath dimensions shall comply with the requirements of Clause A.7. The material of the solder bath container shall be resistant to the relevant liquid solder alloy. 6 Preconditioning 6.1 Preparation of specimens The specimen shall be tested in the “as-received“ condition unless otherwise specified b

29、y the relevant specification. Care should be taken that no contamination, by contact with the fingers or by other means, occurs. The specimen may be cleaned by immersion in a neutral organic solvent at room temperature, but only if required by the relevant specification; no other cleaning is permitt

30、ed. 6.2 Ageing When accelerated ageing is prescribed by the relevant specification, one of the methods of 4.5 of IEC 60068-2-20 shall be used. EN 60068-2-54:2006 5 7 Materials 7.1 Solder 7.1.1 General Solder composition shall be specified in the relevant specification. 7.1.2 Solder alloy containing

31、lead The solder composition shall be either 60 % by mass (wt %) Sn(tin) and 40 wt % Pb(lead) according to Appendix B of IEC 60068-2-20 (Sn60Pb40A, according to IEC 61190-1-3) or 63 wt % Sn (tin) and 37 wt % Pb(lead) (Sn63Pb37A, according to IEC 61190-1-3). 7.1.3 Lead-free solder alloy Unless otherwi

32、se specified in the relevant specification, the solder composition shall be either 3,0 wt % Ag(silver), 0,5 wt % Cu(copper) and the remainder of Sn(tin), Sn96,5Ag3,0Cu0,5, or 0,7 wt % Cu(copper) and the remainder of Sn(tin), Sn99,3Cu0,7, is preferred. NOTE The solder alloys consist of 3,0 wt % to 4,

33、0 wt % Ag, 0,5 wt % to 1,0 wt %Cu, and the remainder of Sn may be used instead of Sn96,5Ag3,0Cu0,5. The solder alloys consist of 0,45 wt % to 0,9 wt % Cu and the remainder of Sn may be used instead of Sn99,3Cu0,7. 7.2 Flux The flux to be used shall be either rosin based non-activated or rosin based

34、activated as follows: a) rosin based non-activated: consist of 25 wt % of colophony in 75 wt % of 2-propanol (isopropanol) or of ethyl alcohol (as specified in Appendix C of IEC 60068-2-20). b) rosin based activated flux: the activated flux which is above flux with the addition of diethylammonium ch

35、loride (analytical reagent grade), up to an amount of 0,2 % or 0,5 % chloride (expressed as free chlorine based on the colophony content). Information about the used flux type shall be given in the relevant specification. 8 Procedure 8.1 Test temperature 8.1.1 Solder alloy containing lead Solder tem

36、perature prior to test and during test shall be 235 C 3 C. 8.1.2 Lead-free solder alloy Unless otherwise specified in the relevant specification, solder temperature prior to test and during test shall be 245 C 3 C for Sn96,5Ag3,0Cu0,5 alloy and 250 C 3 C for Sn99,3Cu0,7 alloy respectively. 8.2 Fluxi

37、ng After mounting the specimen in a suitable holder, the portion of the surface specified shall be immersed in flux at room temperature. Excess flux is immediately drained off by standing the specimen vertically on clean filter paper for 1 s to 5 s. EN 60068-2-54:2006 6 8.3 Flux drying The temperatu

38、re of the solder prior to test shall be as specified in 8.1. The specimen is then suspended vertically with lower edge 20 mm 5 mm above the bath for 30 s 15 s to allow most of the flux solvent to evaporate, before initiating the test. During this drying period the suspension and the chart recorder t

39、race shall be adjusted to the desired zero position, and immediately before starting the test, the surface of the solder bath is scraped with a blade of suitable material to remove oxides. 8.4 Test The specimen is then immersed at a speed of 5 mm/s 1 mm/s to 20 mm/s 1 mm/s to the specified depth in

40、the molten solder and held in this position for a specified time and then withdrawn. The relevant part of the recorder trace of force versus time is obtained when the specimen is held stationary in the immersed position. NOTE The specimen should be immersed to the required depth within 0,2 s. The tr

41、ace shall be recorded starting immediately before immersion into molten solder and throughout test period. Table 1 Time sequence of the test Procedure Time s Duration s 1) Immersion in flux 0 5 2) Flux drain 10 1 to 5 3) Hang the specimen on the apparatus 15 - 4) Preheat 20 30 15 5) Wipe the oxide f

42、rom the solder surface 60 6) Start test 65 1 to 5 7) Solder immersion 70 max. 5 NOTE Time is elapsed time from immersion in flux. Duration is time for relevant procedure. 9 Presentation of results 9.1 Form of chart-recorder trace The trace may be recorded in two forms, the only difference being the

43、polarity of the force readings. In Figure 2, upward forces (non-wetting) are shown as negative and downward forces (wetting) are positive. Usually, force at E is equal to force at D indicating stable wetting conditions. If force at E is less than at D, some instability in wetting is present (see B.6

44、.1.3). EN 60068-2-54:2006 7 B Fmax: Maximum wetting force 2/3 of Fmax Force +Ve Time t0 Buoyancy line A C D E Ve IEC 478/06 Figure 2 Wetting conditions 9.2 Points of significance 9.2.1 Time t0 is, the time at which the solder surface and the specimen first make contact, as indicated by movement of t

45、he trace from the zero force line. 9.2.2 At point A the solder meniscus starts to rise up the specimen termination. This is normally characterized by a significant increase in the wetting force. 9.2.3 At point B the contact angle is 90. The measured force is that due to the buoyancy of the component

46、. 9.2.4 At point C the wetting force reaches two-thirds of the maximum value of the resultant wetting force. At point C, the wetting force shall exceed a specified value within a specified time. 9.2.5 Point D is the maximum value of the resultant wetting force is reached during the specified immersi

47、on period. 9.2.6 Point E is the point at the end of the specified immersion period. Points D and E may have the same force value on the same specimen (see B.6.1.3). 9.2.7 Interpretation of the trace formed during the withdrawal of the specimen is not considered in the stationary mode. 9.3 Reference

48、wetting force In order to obtain a practical reference against which to compare experimental results, the following procedure shall be carried out for each kind of component to be tested. A specimen is taken from the sample to be tested and is pre-tinned under optimum conditions using the activated

49、flux (refer to 7.2). This pre-tinning can be done on the wetting balance, set at the same conditions as are used for the wetting test. The procedure of pre-tinning shall be repeated on the same specimen till the maximum force reading does not further increase. The reference wetting force is this maximum force. EN 60068-2-54:2006 8 In order to investigate the general suitability

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