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1、BRITISH STANDARD BS EN 61190-1-1:2002 Attachment materials for electronic assembly Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly The European Standard EN 61190-1-1:2002 has the status of a British Standard ICS 31.190 ? Licensed Copy: sheffieldu
2、n sheffieldun, na, Fri Nov 10 16:57:46 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS EN 61190-1-1:2002 This British Standard, having been prepared under the direction of the Electrotechnical Sector Policy and Strategy Committee, was published under the authority of the Standards Policy and Strategy
3、Committee on 16 August 2002 BSI 16 August 2002 ISBN 0 580 40261 4 National foreword This British Standard is the official English language version of EN 61190-1-1:2002. It is identical with IEC 61190-1-1:2002. The UK participation in its preparation was entrusted to Technical Committee EPL/501, Elec
4、tronic assembly technology, which has the responsibility to: A list of organizations represented on this committee can be obtained on request to its secretary. Cross-references The British Standards which implement international or European publications referred to in this document may be found in t
5、he BSI Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Search” facility of the BSI Electronic Catalogue or of British Standards Online. This publication does not purport to include all the necessary provisions of a contract. Users are responsible
6、 for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the U
7、K interests informed; monitor related international and European developments and promulgate them in the UK. Summary of pages This document comprises a front cover, an inside front cover, the EN title page, pages 2 to 22, an inside back cover and a back cover. The BSI copyright date displayed in thi
8、s document indicates when the document was last issued. Amendments issued since publication Amd. No. DateComments Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 16:57:46 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EUROPEAN STANDARDEN 61190-1-1 NORME EUROPENNE EUROPISCHE NORMJune 2002 CENELEC
9、European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2002 CENELEC -All rights of exploitation in any form and by any means reserved worldwide
10、 for CENELEC members. Ref. No. EN 61190-1-1:2002 E ICS 31.190 English version Attachment materials for electronic assembly Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly (IEC 61190-1-1:2002) Matriaux de fixation pour les assemblages lectroniques
11、 Partie 1-1: Exigences relatives aux flux de brasage pour les interconnexions de haute qualit dans les assemblages de composants lectroniques (CEI 61190-1-1:2002) Verbindungsmaterialien fr Baugruppen der Elektronik Teil 1-1: Anforderungen an Weichlt- Flussmittel fr hochwertige Verbindungen in der El
12、ektronikmontage (IEC 61190-1-1:2002) This European Standard was approved by CENELEC on 2002-06-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
13、Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translati
14、on under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Hun
15、gary, Iceland, Ireland, Italy, Luxembourg, Malta, Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom. Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 16:57:46 GMT+00:00 2006, Uncontrolled Copy, (c) BSI NE 161-09-1:12002-2 - Foreword The text of document 91/
16、277/FDIS, future edition 1 of IEC 61190-1-1, prepared by IEC TC 91, Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 61190-1-1 on 2002-06-01. The following dates were fixed: latest date by which the EN has to be implemented at national
17、 level by publication of an identical national standard or by endorsement(dop) 2003-03-01 latest date by which the national standards conflicting with the EN have to be withdrawn(dow) 2005-06-01 Annexes designated “normative“ are part of the body of the standard. In this standard, annexes A and ZA a
18、re normative. Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 61190-1-1:2002 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to be added for the standards
19、indicated: IEC 61190-1-2NOTEHarmonized as EN 61190-1-2:2002 (not modified). IEC 61190-1-3NOTEHarmonized as EN 61190-1-3:2002 (not modified). IEC 61191-1NOTEHarmonized as EN 61191-1:1998 (not modified). IEC 61191-2NOTEHarmonized as EN 61191-2:1998 (not modified). IEC 61191-3NOTEHarmonized as EN 61191
20、-3:1998 (not modified). IEC 61191-4NOTEHarmonized as EN 61191-4:1998 (not modified). ISO 9000NOTEHarmonized as EN ISO 9000:2000 (not modified). ISO 9001NOTEHarmonized as EN ISO 9001:2000 (not modified). Page 2 EN 6119011:2002 Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 16:57:46 GMT+00:00
21、2006, Uncontrolled Copy, (c) BSI 161-09-11 ? EI:C0022 3 CONTENTS INTRODUCTION.5 1Scope and object6 2Normative references .6 3Terms and definitions .6 4Requirements.7 4.1Conflict7 4.2Flux classification and testing7 4.2.1Standard classification for products .7 4.2.2Composition 7 4.2.3Activity 8 4.2.4
22、Flux characterization test methods 9 4.2.5Qualification 11 4.2.6Quality conformance11 4.2.7Performance11 4.2.8Labelling13 5Quality assurance provisions13 5.1Responsibility for inspection13 5.1.1Responsibility for compliance 13 5.1.2Test equipment and inspection facilities 13 5.1.3Inspection conditio
23、ns.13 5.2Classification of inspections 14 5.3Materials inspection 14 5.4Qualification inspection .14 5.4.1Sample size.14 5.4.2Inspection routine14 5.5Performance inspection.15 5.6Quality conformance15 5.6.1Sampling plan15 5.6.2Rejected lots .16 5.7Preparation of fluxes for testing.16 5.7.1Flux form
24、for test .16 5.7.2Liquid fluxes 16 5.7.3Solid fluxes16 5.7.4Paste flux 16 5.7.5Solder paste17 5.7.6Other materials17 6Preparation for delivery 18 6.1Preservation-packing and packaging .18 7Additional information.18 7.1Flux activity.18 7.2Flux and cleaning relationship .19 7.3Ordering data 19 Page 3
25、EN 6119011:2002 Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 16:57:46 GMT+00:00 2006, Uncontrolled Copy, (c) BSI 161-09-11 ? EI:C0022 4 Annex A (normative) .20 Annex ZA (normative) Normative references to international publications with their corresponding European publications .22 Bibliog
26、raphy21 Figure 1 Wetting balance curve12 Table 1 Flux identification, materials of composition, activity levels8 Table 2 Test requirements for flux activity classification.9 Table 3 Typical spread areas.12 Table 4 Solder flux test method classification.15 Table 5 Flux form for test.16 Table A.1 Qual
27、ification test report20 Page 4 EN 6119011:2002 Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 16:57:46 GMT+00:00 2006, Uncontrolled Copy, (c) BSI 161-09-11 ? EI:C0022 5 INTRODUCTION This part of IEC 61190 defines the classification of soldering materials through specifications of test method
28、s and inspection criteria. These materials include liquid flux, paste flux, solder- paste flux, solder-preform flux, and flux cored solder. It is not the intent of this standard to exclude any acceptable flux or soldering aid material; however, these materials must produce the desired electrical and
29、 metallurgical interconnection. Requirements for soldering fluxes are defined in general terms for standardized classification. In practice, where more stringent requirements are necessary or other manufacturing processes are used, these should be defined as additional requirements by the user. Form
30、ic acid is not considered a flux for the purpose of this document. The generic specifications for soldering fluxes are given by ISO. This standard is intended to be applicable to all types of flux as used for soldering in general and to soldering in electronics in particular. The fluxes involved rel
31、ate to all aspects of application, such as in wave soldering, printed wiring board (PWB) fabrication, lead tinning, and solder reflow. Materials include solder pastes, flux-cored wire, and flux-coated preforms. Soldering fluxes covered by this standard are intended for use in various consumer, indus
32、trial and commercial electronics soldering applications of industry applications. Page 5 EN 6119011:2002 Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 16:57:46 GMT+00:00 2006, Uncontrolled Copy, (c) BSI 161-09-11 ? EI:C0022 6 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY Part 1-1: Requiremen
33、ts for soldering fluxes for high-quality interconnections in electronics assembly 1 Scope and object This part of IEC 61190 specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux charact
34、erization, quality control, and procurement document for solder flux and flux containing material in electronics assembly technology. 2 Normative references The following referenced documents are indispensable for the application of the document. For dated references, only the edition cited applies.
35、 For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60194, Printed board design, manufacture and assembly Terms and definitions IEC 61189-2, Test methods for electrical materials, interconnection structures and assemblies Part 2: Test method
36、s for materials for interconnection structures IEC 61189-3, Test methods for electrical materials, interconnection structures and assemblies Part 3: Test methods for interconnection structures (printed boards) ISO 9002:1994, Quality systems Model for quality assurance in production, installation and
37、 servicing ISO 9455-16, Soft soldering fluxes Test methods Part 16: Flux efficacy tests, wetting balance method 3 Terms and definitions For the purposes of this part of IEC 61190, the terms and definitions given in English only in IEC 60194 1) and the following apply. 3.1 form flux additionally clas
38、sified according to the form that it takes liquid (L), solid (S), or paste (P) 3.2 inorganic flux aqueous flux solution of inorganic acids and halides IEC 60194 _ 1) Certain definitions of IEC 60194 have been translated into French. Page 6 EN 6119011:2002 Licensed Copy: sheffieldun sheffieldun, na,
39、Fri Nov 10 16:57:46 GMT+00:00 2006, Uncontrolled Copy, (c) BSI 161-09-11 ? EI:C0022 7 3.3 organic flux primarily composed of organic materials other than rosin or resin 3.4 resin flux resin and small amounts of organic activators in an organic solvent IEC 60194 3.5 rosin flux rosin in an organic sol
40、vent or rosin as a paste with activators IEC 60194 (primarily composed of natural resin, extracted from the oleoresin of pine trees and refined. Consists of one or more of the following types of rosin: gum rosin, wood rosin, tall oil rosin, modified or natural rosin. The rosins used must have a mini
41、mum acid value of 130, as deter- mined by 6C07 of the future IEC 61189-6.) 4 Requirements Except when otherwise specified on the design or assembly drawings or instructions by the user, the soldering fluxes covered by this part of IEC 61190 shall conform with the following subclauses. 4.1 Conflict I
42、n the event of conflict between the requirements of this specification and other requirements of the applicable acquisition documents, the precedence in which documents shall govern, in descending order, is as follows: a) the applicable acquisition document; b) the applicable specification sheet/dra
43、wing; c)this specification; d) normative references. 4.2 Flux classification and testing 4.2.1 Standard classification for products Fluxes used in the process of soldering shall be classified according to the corrosive or conductive properties of the flux or flux residue (see table 1). 4.2.2 Composi
44、tion Soldering fluxes shall also be classified according to the general chemical composition of the non-volatile portion. Based on a minimum 51 % composition of the non-volatile portion, the flux shall be classified as either rosin, resin, organic or inorganic (see table 1). Page 7 EN 6119011:2002 L
45、icensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 16:57:46 GMT+00:00 2006, Uncontrolled Copy, (c) BSI 161-09-11 ? EI:C0022 8 Table 1 Flux identification, materials of composition, activity levels a Flux materials of composition a Flux activity levels (weight % halide) b IEC flux designator cISO
46、flux designator d Low (2,0)H1ROH11.1.2.Z Low (2,0)H1REH11.2.2.Z Low (2,0)H1ORH12.2.2 Low (2,0)H1INH1 Not applicable (inorganic ISO flux is different) a Fluxes are available in S (solid), P (paste/cream) or L (liquid) forms. b The 0 and 1 indicate absence and presence of halides, respectively. See 4.
47、2.3 for an explanation of L, M and H nomenclature. c See 7.2 and 7.3 for comparisons of RO, RE, OR and IN composition classes and L, M and H activity levels with the traditional classes such as R, RMA, RA, water soluble and low solids “no-clean“. d ISO designations are similar to IEC designators wit
48、h minor differences in characteristics. 4.2.3 Activity The soldering fluxes of table 1 shall be further classified by test requirements relating to the activity of the flux and its residue. Soldering fluxes shall be characterized according to one of the following three types: a) Lis low or no flux/f
49、lux residue activity; b) Mis moderate flux/flux residue activity; c)His high flux/flux residue activity. Page 8 EN 6119011:2002 Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 16:57:46 GMT+00:00 2006, Uncontrolled Copy, (c) BSI 161-09-11 ? EI:C0022 9 These classes shall be further characterized using 0 or 1 to indicate the absence or the presence of halide in the flux. Both the L, M, H and 0, 1 classifica