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1、BRITISH STANDARD BS EN 61189-3:2008 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 3: Test methods for interconnection structures (printed boards) ICS 31.180 ? Copyright British Standards Institution Provided by IHS under license with B
2、SI - Uncontrolled Copy Licensee=Boeing Co/5910770001 Not for Resale, 08/14/2008 21:29:06 MDTNo reproduction or networking permitted without license from IHS -,-,- BS EN 61189-3:2008 This British Standard was published under the authority of the Standards Policy and Strategy Committee on 31 March 200
3、8 BSI 2008 ISBN 978 0 580 61279 4 National foreword This British Standard is the UK implementation of EN 61189-3:2008. It is identical to IEC 61189-3:2007. It supersedes BS EN 61189-3:1997 which is withdrawn. The UK participation in its preparation was entrusted to Technical Committee EPL/501, Elect
4、ronic assembly technology. A list of organizations represented on this committee can be obtained on request to its secretary. This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. Compliance with a British Standard
5、 cannot confer immunity from legal obligations. Amendments/corrigenda issued since publication DateComments Copyright British Standards Institution Provided by IHS under license with BSI - Uncontrolled Copy Licensee=Boeing Co/5910770001 Not for Resale, 08/14/2008 21:29:06 MDTNo reproduction or netwo
6、rking permitted without license from IHS -,-,- EUROPEAN STANDARD EN 61189-3 NORME EUROPENNE EUROPISCHE NORM January 2008 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretaria
7、t: rue de Stassart 35, B - 1050 Brussels 2008 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 61189-3:2008 E ICS 31.180 Supersedes EN 61189-3:1997 + A1:1999 English version Test methods for electrical materials, printed boards and
8、 other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) (IEC 61189-3:2007) Mthodes dessai pour les matriaux lectriques, les cartes imprimes et autres structures dinterconnexion et ensembles - Partie 3: Mthodes dessai des structures dint
9、erconnexion (cartes imprimes) (CEI 61189-3:2007) Prfverfahren fr Elektromaterialien, Leiterplatten und andere Verbindungs- strukturen und Baugruppen - Teil 3: Prfverfahren fr Verbindungs- strukturen (Leiterplatten) (IEC 61189-3:2007) This European Standard was approved by CENELEC on 2007-12-01. CENE
10、LEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on a
11、pplication to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secre
12、tariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
13、 Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. Copyright British Standards Institution Provided by IHS under license with BSI - Uncontrolled Copy Licensee=Boeing Co/5910770001 Not for Resale, 08/14/2008 21:29:06 MDTNo reproduct
14、ion or networking permitted without license from IHS -,-,- Foreword The text of document 91/698/FDIS, future edition 2 of IEC 61189-3, prepared by IEC TC 91, Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 61189-3 on 2007-12-01. This
15、European Standard supersedes EN 61189-3:1997 + A1:1999. The major technical changes with regard to EN 61189-3:1997 + A1:1999 concern the addition of 25 new tests, as follows: 6 V: Visual test methods: 3V01, 3V02 and 3V03; 7 D: Dimensional test methods: 3D03; 8 C: Chemical test methods: 3C02, 3C13 an
16、d 3C14; 9 M: Mechanical test methods: 3M01, 3M03, 3M04, 3M07 and 3M09; 10 E: Electrical test methods: 3E03, 3E04, 3E05, 3E11, 3E12, 3E13, 3E16, 3E17 and 3E18; 11 N: Environmental test methods: 3N03, 3N07 and 3N12; 12 X: Miscellaneous test methods: 3X01. EN 61189-3:2007 also includes the deletion of
17、Annex B: Conversion table, as the referred documents have been withdrawn. Should anyone wish to consult such information, they should refer to EN 61189-3:1997. The new general title of EN 61189 series is Test methods for electrical materials, printed boards and other interconnection structures and a
18、ssemblies. Titles of existing standards in this series will be updated at the time of revision. This standard should be used in conjunction with the following parts: Part 1: General test methods and methodology Part 2: Test methods for materials for interconnection structures Part 5: Test methods fo
19、r printed board assemblies Part 6: Test methods for materials used in manufacturing electronic assemblies It should also be read in conjunction with the series EN 60068, Environmental testing. The following dates were fixed: latest date by which the EN has to be implemented at national level by publ
20、ication of an identical national standard or by endorsement (dop) 2008-09-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2010-12-01 Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 61189-3:2007 was
21、approved by CENELEC as a European Standard without any modification. _ 2 EN 61189-3:2008 Copyright British Standards Institution Provided by IHS under license with BSI - Uncontrolled Copy Licensee=Boeing Co/5910770001 Not for Resale, 08/14/2008 21:29:06 MDTNo reproduction or networking permitted wit
22、hout license from IHS -,-,- CONTENTS 1 2 3 4 5 6 7 8 9 10 11 12 3 EN 61189-3:2008 Annex ZA (normative) Normative references to international publications with their corresponding European publications.118 INTRODUCTION.5 Scope and object6 Normative references6 Accuracy, precision and resolution7 Cata
23、logue of approved test methods .10 P: Preparation/conditioning test methods 10 V: Visual test methods 10 D: Dimensional test methods 13 C: Chemical test methods.16 M: Mechanical test methods29 E: Electrical test methods .47 N: Environmental test methods .74 X: Miscellaneous test methods92 Annex A (i
24、nformative) Worked examples.116 Figure 1 Glow wire .18 Figure 2 Test apparatus .19 Figure 3a Horizontal specimen Flame applied to surface23 Figure 3b Horizontal specimen Flame applied to edge .23 Figure 3c Vertical specimen Lower edge horizontal Flame applied to edge24 Figure 3d Vertical specimen Lo
25、wer edge horizontal Flame applied to surface24 Figure 3e Needle burner test Side views of test board and burner 25 Figure 3 Needle burner test25 Figure 4 Flux type classification by copper mirror test.29 Figure 5a Hold down clamping system31 Figure 5 Copper foil for peel test 32 Figure 5b Single loa
26、d mode31 Figure 5c Multiple load mode31 Figure 5d Keyhole hold down fixture .32 Figure 6 Bow35 Figure 7 Twist 35 Figure 8 Test set-up for bow measurement.36 Figure 9 Specimen set-up for twist measurement36 Figure 10a Specimen set-up for referee test for twist, raised parallel surfaces 38 Figure 10b
27、Specimen setup for referee test for twist, supporting jacks or blocks .38 Figure 10c Specimen setup for referee test for twist measurements38 Figure 10 Specimen setup for referee test 38 Figure 11 Bow measurement39 Copyright British Standards Institution Provided by IHS under license with BSI - Unco
28、ntrolled Copy Licensee=Boeing Co/5910770001 Not for Resale, 08/14/2008 21:29:06 MDTNo reproduction or networking permitted without license from IHS -,-,- 4 EN 61189-3:2008 Figure 12 Twist measurement 39 Figure 13 Measuring equipment for peel strength of flexible printed boards.42 Figure 14 Pencil ho
29、lder.45 Figure 15a Location of test specimens53 Figure 15b Location of test specimens54 Figure 15 Composite test pattern54 Figure 16 Test specimen artwork60 Figure 17 Fluidized sand bath.63 Figure 18 Possible equipment configuration67 Figure 19 Schematic showing undisturbed interval67 Figure 20 Test
30、 wave form example.69 Figure 21 Incident wave voltage showing (2 X) air line delay.69 Figure 22 Details of test specimen71 Figure 23 Circuit diagram for measurement of contact resistance .72 Figure 24 Keypad contact patterns .74 Figure 25 Plier fixture for thermal shock test, dip soldering .81 Figur
31、e 26 Temperature cycles for moisture and insulation resistance test graph91 Figure 27 Insulation resistance coupon (m).91 Figure 28 Typical comb pattern .92 Figure 29 Suggested test specimen for surface mount features 103 Figure 30 Suggested test specimen for plated through holes.103 Figure 31 Rotar
32、y dip solderability test equipment 106 Figure 32 Effectiveness of solder wetting of plated through holes109 Figure 33 Test specimen115 Table 1 Students “t“ distribution 9 Table 2 Preferred land, hole and wire dimensions.43 Table 3 Resistance values60 Table 4 Chamber temperatures for one cycle85 Tabl
33、e 5 Accelerated ageing and test requirements104 Table 6 Maximum limits of solder bath contaminants 105 Copyright British Standards Institution Provided by IHS under license with BSI - Uncontrolled Copy Licensee=Boeing Co/5910770001 Not for Resale, 08/14/2008 21:29:06 MDTNo reproduction or networking
34、 permitted without license from IHS -,-,- INTRODUCTION IEC 61189 relates to test methods for printed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture. The standard is divided into separate parts, covering informati
35、on for the designer and the test methodology engineer or technician. Each part has a specific focus; methods are grouped according to their application and numbered sequentially as they are developed and released. In some instances test methods developed by other TCs (e.g. TC 50) have been reproduce
36、d from existing IEC standards in order to provide the reader with a comprehensive set of test methods. When this situation occurs, it will be noted on the specific test method; if the test method is reproduced with minor revision, those paragraphs that are different are identified. This part of IEC
37、61189 contains test methods for evaluating printed boards and other forms of interconnection structures. The methods are self-contained, with sufficient detail and description so as to achieve uniformity and reproducibility in the procedures and test methodologies. The tests shown in this standard a
38、re grouped according to the following principles: P: preparation/conditioning methods V: visual test methods D: dimensional test methods C: chemical test methods M: mechanical test methods E: electrical test methods N: environmental test methods X: miscellaneous test methods To facilitate reference
39、to the tests, to retain consistency of presentation, and to provide for future expansion, each test is identified by a number (assigned sequentially) added to the prefix (group code) letter showing the group to which the test method belongs. The test method numbers have no significance with respect
40、to an eventual test sequence; that responsibility rests with the relevant specification that calls for the method being performed. The relevant specification, in most instances, also describes pass/fail criteria. The letter and number combinations are for reference purposes, to be used by the releva
41、nt specification. Thus “3D02“ represents the second dimensional test method described in this publication. In short, for this example, 3 is the part of IEC standard (61189-3), D is the group of methods, and 02 is the test number. A list of all test methods included in this standard, as well as those
42、 under consideration is given in Annex B. This annex will be reissued whenever new tests are introduced. 5 EN 61189-3:2008 Copyright British Standards Institution Provided by IHS under license with BSI - Uncontrolled Copy Licensee=Boeing Co/5910770001 Not for Resale, 08/14/2008 21:29:06 MDTNo reprod
43、uction or networking permitted without license from IHS -,-,- TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES Part 3: Test methods for interconnection structures (printed boards) 1 Scope This part of IEC 61189 is a catalogue of test methods r
44、epresenting methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, on
45、ly the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60051 (all parts), Direct acting indicating analogue electrical measuring instruments and their accessories IEC 60068-1: 1988, Environmental testing Part 1: Gen
46、eral and guidance IEC 60068-2-20: 1979, Environmental testing Part 2: Tests Test T: Soldering Amendment 2 (1987) IEC 60068-2-78, Environmental testing Part 2-78: Tests Test Cab: Damp heat, steady state IEC 6016915, Radio-frequency connectors Part 15: RF coaxial connectors with inner diameter of oute
47、r conductor 4,13 mm (0,163 in) with screw coupling Characteristic impedance 50 ohms (Type SMA) IEC 60454-1:1992, Specifications for pressure-sensitive adhesive tapes for electrical purposes Part 1: General requirements IEC 60454-3-1:1998, Pressure-sensitive adhesive tapes for electrical purposes Part 3: Specifications for individual materials Sheet 1: PVC film tapes with pressure-sensitive adhesive IEC 60584-1, Thermocouples Part 1: reference tables IEC 60695-11-5, Fire hazard testing Part 11-5: Test flames Needle flame test method Apparatus, confirmatory test arran