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1、BRITISH STANDARD BS EN 61967-6:2002 Integrated circuits Measurement of electromagnetic emissions, 150 kHz to 1 GHz Part 6: Measurement of conducted emissions Magnetic probe method The European Standard EN 61967-6:2002 has the status of a British Standard ICS 31.200 ? Licensed Copy: sheffieldun sheff
2、ieldun, na, Sat Nov 11 07:17:45 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS EN 61967-6:2002 This British Standard, having been prepared under the direction of the Electrotechnical Sector Policy and Strategy Committee, was published under the authority of the Standards Policy and Strategy Committee
3、 on 24 October 2002 BSI 24 October 2002 ISBN 0 580 40603 2 National foreword This British Standard is the official English language version of EN 61967-6:2002. It is identical with IEC 61967-6:2002. The UK participation in its preparation was entrusted to Technical Committee EPL/47, Semiconductors,
4、which has the responsibility to: A list of organizations represented on this committee can be obtained on request to its secretary. Cross-references The British Standards which implement international or European publications referred to in this document may be found in the BSI Catalogue under the s
5、ection entitled “International Standards Correspondence Index”, or by using the “Search” facility of the BSI Electronic Catalogue or of British Standards Online. This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application
6、. Compliance with a British Standard does not of itself confer immunity from legal obligations. aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor
7、related international and European developments and promulgate them in the UK. Summary of pages This document comprises a front cover, an inside front cover, the EN title page, pages 2 to 26, an inside back cover and a back cover. The BSI copyright date displayed in this document indicates when the
8、document was last issued. Amendments issued since publication Amd. No. DateComments Licensed Copy: sheffieldun sheffieldun, na, Sat Nov 11 07:17:45 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EUROPEAN STANDARDEN 61967-6 NORME EUROPENNE EUROPISCHE NORMOctober 2002 CENELEC European Committee for Electr
9、otechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2002 CENELEC -All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No
10、. EN 61967-6:2002 E ICS 31.200 English version Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz Part 6: Measurement of conducted emissions - Magnetic probe method (IEC 61967-6:2002) Circuits intgrs - Mesure des missions lectromagntiques, 150 kHz 1 GHz Partie 6: Mesure
11、 des missions conduites - Mthode de la sonde magntique (CEI 61967-6:2002) Integrierte Schaltungen - Messung von elektromagnetischen Aussendungen im Frequenzbereich von 150 kHz bis 1 GHz Teil 6: Messung der leitungsgefhrten Aussendungen - Magnetsondenverfahren (IEC 61967-6:2002) This European Standar
12、d was approved by CENELEC on 2002-09-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning
13、 such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its o
14、wn language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta, Netherla
15、nds, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom. Licensed Copy: sheffieldun sheffieldun, na, Sat Nov 11 07:17:45 GMT+00:00 2006, Uncontrolled Copy, (c) BSI Foreword The text of document 47A/645/FDIS, future edition 1 of IEC 61967-6, prepared by SC 47A, Integrated circu
16、its, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 61967-6 on 2002-09-01. This European Standard should be read in conjunction with EN 61967-1:2002. The following dates were fixed: latest date by which the EN has to be implement
17、ed at national level by publication of an identical national standard or by endorsement(dop)2003-06-01 latest date by which the national standards conflicting with the EN have to be withdrawn(dow)2005-09-01 Annexes designated “normative“ are part of the body of the standard. Annexes designated “info
18、rmative“ are given for information only. In this standard, annexes A and ZA are normative and annexes B, C and D are informative. Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 61967-6:2002 was approved by CENELEC as a European Standard without an
19、y modification. _ Page 2 EN 619676:2002 Licensed Copy: sheffieldun sheffieldun, na, Sat Nov 11 07:17:45 GMT+00:00 2006, Uncontrolled Copy, (c) BSI CONTENTS 1Scope 5 2Normative references 5 3Definitions .5 4General 5 4.1 Measurement philosophy.5 4.2 Measurement principle.6 5Test conditions.6 5.1 Gene
20、ral 6 5.2 Frequency range .6 6Test equipment .6 6.1 General 6 6.2 Magnetic probe.6 6.3 Probe spacing fixture and placement 6 7Test set-up 9 7.1 General 9 7.2 Probe calibration .9 7.3 Modifications to standardized IC test board.9 7.3.1Layer arrangement9 7.3.2Layer thickness .9 7.3.3Decoupling capacit
21、ors 9 7.3.4I/O pin loading .10 8Test procedure 14 8.1 General 14 8.2 Test technique .14 9Test report .14 9.1 General 14 9.2 Documentation 14 Annex A (normative)Probe calibration procedure Microstrip line method 16 Annex B (informative) Measurement principle and calibration factor .19 Annex C (inform
22、ative) Spatial resolution of magnetic probe.23 Annex D (informative) Angle pattern of probe placement .24 Annex ZA (normative) Normative references to international publications with their corresponding European publications.25 Bibliography 26 Page 3 EN 619676:2002 Licensed Copy: sheffieldun sheffie
23、ldun, na, Sat Nov 11 07:17:45 GMT+00:00 2006, Uncontrolled Copy, (c) BSI Figure 1 Magnetic probe 7 Figure 2 Magnetic probe 1st and 3rd layers .7 Figure 3 Magnetic probe 2nd layer 8 Figure 4 Magnetic probe layer construction 8 Figure 5 Standardized IC test board (sectional view 1) .10 Figure 6 Standa
24、rdized IC test board (sectional view 2 measurement line) 10 Figure 7 Power line pattern on the standardized IC test board Bottom layer .11 Figure 8 I/O signal line pattern on the standardized IC test board Bottom layer 12 Figure 9 Multi-power lines on the standardized IC test board Bottom layer .12
25、Figure 10 Measurement set-up 13 Figure 11 Measurement circuit schematic .13 Figure 12 Transfer constant for current calculation as a function of insulator thickness of microstrip board 15 Figure A.1 Cross-sectional view of a microstip line for calibration 16 Figure A.2 Measurement set-up for probe c
26、alibration .18 Figure B.1 Cross-sectional view of a microstrip line19 Figure B.2 Measurement of magnetic probe output 21 Figure B.3 Example of calibration factor for the magnetic probe specified in figures 1, 2, 3 and 4.22 Figure C.1 Diagram for measuring a magnetic field distribution .23 Figure C.2
27、 Magnetic field distribution across the microstrip line (800 MHz)23 Figure D.1 Diagram for measuring an angle pattern of probe placement .24 Figure D.2 Probe output to angle 24 Page 4 EN 619676:2002 Licensed Copy: sheffieldun sheffieldun, na, Sat Nov 11 07:17:45 GMT+00:00 2006, Uncontrolled Copy, (c
28、) BSI INTEGRATED CIRCUITS MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 kHz TO 1 GHz Part 6: Measurement of conducted emissions Magnetic probe method 1 Scope This part of the IEC 61967 specifies a method for evaluating RF currents on the pins of an integrated circuit (IC) by means of non-contact cur
29、rent measurement using a miniature magnetic probe. This method is capable of measuring the RF currents generated by the IC over a frequency range of 0,15 MHz to 1 000 MHz. This method is applicable to the measurement of a single IC or a chip set of ICs on the standardized test board for characteriza
30、tion and comparison purposes. It is also usable to evaluate the electromagnetic characteristics of an IC or group of ICs on an actual application PCB for emission reduction purposes. This method is called the “magnetic probe method“. 2 Normative references The following referenced documents are indi
31、spensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 61967-1, Integrated circuits Measurement of electromagnetic emissions, 150 kHz to 1 GHz
32、Part 1: General conditions and definitions IEC 61967-4, Integrated circuits Measurement of electromagnetic emissions, 150 kHz to 1 GHz Part 4: Measurement of conducted emissions 1 /150 direct coupling method 3 3 Definitions For the purposes of this part of IEC 61967 the definitions found in IEC 6196
33、7-1 apply. 4 General 4.1 Measurement philosophy The emissions radiated from a PCB are, in part, caused by RF current generated by the onboard IC which drives PCB traces, PCB ground and supply planes, and cables connected to the PCB. All of these can act as RF antennas to radiate the emissions. The e
34、mission level is proportional to the driving RF current, and is also affected significantly by PCB design, radiation effectiveness of the pseudo-antennas, and noise coupling path coefficients from the IC to the pseudo-antennas. For this emission mechanism, the driving force of the IC can be a signif
35、icant parameter for both users and manufacturers to estimate and predict the electromagnetic characteristics of a PCB, module, or system. A measure of the emission driving force can be obtained by measuring the RF currents generated by the IC under test. Thus, the measured RF noise current can be re
36、garded as an indicator of the undesirable electromagnetic emission driving force generated by the IC. _ 3 To be published. Page 5 EN 619676:2002 Licensed Copy: sheffieldun sheffieldun, na, Sat Nov 11 07:17:45 GMT+00:00 2006, Uncontrolled Copy, (c) BSI 4.2 Measurement principle Using this test method
37、, the RF current on the power supply pins and I/O pins of an IC under test can be measured using a miniature triplate-structured magnetic probe. This probe measures the magnetic field at a specified height over a power supply or I/O strip conductor on the standardized test board in a controlled mann
38、er. The RF current is calculated from the measured magnetic field using the formula described in 8.2. With accurate mechanical placement of the magnetic probe, this method provides a high degree of repeatability. In addition, the frequency range of this method can be extended subject to the limitati
39、ons described in 5.2. Higher frequencies can be obtained without a substantial influence on accuracy. The estimation of the RF current over the power supply or I/O strip conductor is an easy and handy way of characterizing and comparing the ICs. 5 Test conditions 5.1 General General test conditions
40、are described in IEC 61967-1. 5.2 Frequency range The effective frequency range of this measurement method is 0,15 MHz to 1 000 MHz. The maximum frequency can be extended, if desired, subject to the limitations of the test set-up. The upper limit of the frequency range is directly related to high fr
41、equency characteristics of the magnetic probe and its distance from the line under test as described in annex B. At a low frequency region of 0,15 MHz to 10 MHz, however, it may be advisable to use a low noise pre-amplifier to improve dynamic range of the measurement. 6 Test equipment 6.1 General Fo
42、r general information on test equipment see IEC 61967-1. 6.2 Magnetic probe The magnetic probe shall be a triplate-structured strip line composed of a three-layer PCB. Recommended probe construction details are shown in figures 1, 2, 3 and 4. An SMA connector is attached at the edge of the PCB oppos
43、ite to the rectangular loop portion of the probe as shown in the figures . Attachment pads for the SMA connector are on layers 1 and 3, which are connected to each other through four vias. The strip conductor pattern is on layer 2, which is connected to the centre pin of the SMA connector. 6.3 Probe
44、 spacing fixture and placement The probe output voltage depends on the distance between the probe tip and the strip conductor under measurement. This makes it very critical to maintain a 1 mm space between the strip conductor and the magnetic probe tip during this measurement. Therefore, a probe spa
45、cing fixture shall be used to maintain 1,0 mm 0,1 mm spacing between the bottom of the rectangular loop portion of the probe and strip line on the IC test board, or the entire probe can be molded into a piece of fixing block which houses the probe so as to maintain the specified space precisely as s
46、hown in figure 10. Page 6 EN 619676:2002 Licensed Copy: sheffieldun sheffieldun, na, Sat Nov 11 07:17:45 GMT+00:00 2006, Uncontrolled Copy, (c) BSI In addition, the probe output voltage depends on probe placement angle () to direction of microstrip line under measurement. According to an experimenta
47、l measurement on angle patterns of probe directional placement, the angle shall be less than 15 for amplitude error to be less than 2 dB. See annex D for details. 30 mm 10 mm 50 strip line Via through layers 1, 2, and 3 Signal line pattern on layer 2 Pads for SMA connector on layer 1 and 3 Via for S
48、MA connector through layers 1, 2, and 3 Rectangular loop portion for detection Via for SMA connector through layers 1, 2, and 3 Ground plane patterns on layer 1 and layer 3 IEC 1468/02 Figure 1 Magnetic probe 1,8 mm 30 mm0,8 mm Via: 0,25 mm diameter 0,2 mm 10 mm 8,4 mm 0,1 mm 10 mm Center line Via V
49、ia IEC 1469/02 Figure 2 Magnetic probe First and third layers Page 7 EN 619676:2002 Licensed Copy: sheffieldun sheffieldun, na, Sat Nov 11 07:17:45 GMT+00:00 2006, Uncontrolled Copy, (c) BSI 30 mm Via 0,1 mm 10 mm 4,6 mm 0,4 mm 1,0 mm Center line Via: 0,25 mm diameter IEC 1470/02 Figure 3 Magnetic probe Second layer Layer 3 Layer 2 Layer 1 Insulator Thickness of copper foil