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1、BRITISH STANDARD BS EN 61193-1:2002 IEC 61193-1:2001 Incorporating Corrigendum No. 1 Quality assessment systems Part 1: Registration and analysis of defects on printed board assemblies The European Standard EN 61193-1:2002 has the status of a British Standard ICS 31.180 NO COPYING WITHOUT BSI PERMIS
2、SION EXCEPT AS PERMITTED BY COPYRIGHT LAW Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 17:23:20 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS EN 61193-1:2002 This British Standard, having been prepared under the direction of the Electrotechnical Sector Policy and Strategy Committee, was pu
3、blished under the authority of the Standards Policy and Strategy Committee on 6 May 2002 BSI 14 May 2002 ISBN 0 580 39443 3 National foreword This British Standard is the official English language version of EN 61193-1:2002. It is identical with IEC 61193-1:2001. The UK participation in its preparat
4、ion was entrusted to Technical Committee EPL/501, Electronic assembly technology, which has the responsibility to: A list of organizations represented on this committee can be obtained on request to its secretary. From 1 January 1997, all IEC publications have the number 60000 added to the old numbe
5、r. For instance, IEC 27-1 has been renumbered as IEC 60027-1. For a period of time during the change over from one numbering system to the other, publications may contain identifiers from both systems. Cross-references The British Standards which implement international or European publications refe
6、rred to in this document may be found in the BSI Standards Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Find” facility of the BSI Standards Electronic Catalogue. A British Standard does not purport to include all the necessary provisions of a
7、contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the int
8、erpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. Summary of pages This document comprises a front cover, an inside front cover, the EN title page, pages 2 to 22, an inside back cover and a
9、 back cover. The BSI copyright date displayed in this document indicates when the document was last issued. Amendments issued since publication Amd. No. DateComments 13939 Corrigendum No.1 14 May 2002Correction to IEC date on covers. Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 17:23:20 GM
10、T+00:00 2006, Uncontrolled Copy, (c) BSI EUROPEAN STANDARDEN 61193-1 NORME EUROPENNE EUROPISCHE NORMFebruary 2002 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue
11、de Stassart 35, B - 1050 Brussels 2002 CENELEC -All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 61193-1:2002 E ICS 31.190 English version Quality assessment systems Part 1: Registration and analysis of defects on printed board assemblies (I
12、EC 61193-1:2001) Systme dassurance de la qualit Partie 1: Enregistrement et analyse des dfauts sur les cartes imprimes quipes (CEI 61193-1:2001) Qualittsbewertungssysteme Teil 1: Protokollierung und Analyse von Fehlern auf bestckten Leiterplatten (IEC 61193-1:2001) This European Standard was approve
13、d by CENELEC on 2002-02-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such nationa
14、l standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language a
15、nd notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Malta, Netherlands, Norway, Portugal,
16、 Spain, Sweden, Switzerland and United Kingdom. Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 17:23:20 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EN 69113-:10022- 2 - Foreword The text of document 91/265/FDIS, future edition 1 of IEC 61193-1, prepared by IEC TC 91, Electronics assembly tech
17、nology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 61193-1 on 2002-02-01. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement(dop)2002-11-01 latest
18、 date by which the national standards conflicting with the EN have to be withdrawn(dow)2005-02-01 Annexes designated “normative“ are part of the body of the standard. Annexes designated “informative“ are given for information only. In this standard, annexes A and ZA are normative and annexes B, C an
19、d D are informative. Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 61193-1:2001 was approved by CENELEC as a European Standard without any modification. _ Page 2 EN 611931:2002 2002 lirpA 81 ISB 2 egaP 2002:139116 NE 2002 yaM 3 ISB 2 egaP 2002:13
20、9116 NE BSI 6 May 2002 Page 2 EN 611931:2002 BSI 6 May 2002 Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 17:23:20 GMT+00:00 2006, Uncontrolled Copy, (c) BSI 69113-CEI 1:0210 3 CONTENTS INTRODUCTION 4 1Scope 5 2Normative references. 5 3Terms and definitions 6 4Defect registration . 9 4.1Acc
21、ept criteria 9 4.2Counting of defects. 9 4.3Post-soldering defect registration 10 4.3.1Defects found after testing.10 4.4Defect subdivision .10 4.4.1Defect sources.10 4.4.2Defect registration form .10 4.5Rework immediately prior to soldering .11 4.6Defect data categories.11 5Processing the data11 6A
22、nalysis12 Annex A (normative) Subprocesses.13 Annex B (informative) Examples of product defect qualification.14 Annex C (informative) Examples of calculations .16 Annex D (informative) Example of registration of defects and processing of the data 18 Annex ZA (normative) Normative references to inter
23、national publications with their corresponding European publications21 Figure B.1 Registration of defects 15 Figure D.1 Data for defect registration18 Figure D.2 Subdivision into type of defect 19 Figure D.3 Subdivision into type of component.19 Figure D.4 Subdivision into defect source.19 Figure D.
24、5 ppm level printed board A, of the past 10 production days 20 Figure D.6 ppm levels of the production per type of board20 Table A.1 Descriptions for subprocesses13 Table C.1 Example 1 (100 % check).16 Table C.2 Example 2 (random check).17 Table D.1 Three subdivisions .19 Page 3 EN 611931:2002 2002
25、lirpA 81 ISB 3 egaP 2002:139116 NE 2002 yaM 3 ISB Page 3 EN 611931:2002 BSI 6 May 2002 Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 17:23:20 GMT+00:00 2006, Uncontrolled Copy, (c) BSI 69113-CEI 1:0210 4 INTRODUCTION This part of IEC 61193 enables the counting of defects on soldered printed
26、 board assemblies in the manufacture of electronic circuits and the associated calculation of ppm (parts per million) data to be carried out in a standard manner. The number of defects occurring during the production process is usually expressed at lower defect levels in parts per million, commonly
27、indicated as ppm. On the face of it, the meaning of the ppm value of a soldering process is self-evident: a part is, in this context, a soldered joint that is defective, the million refers to a million soldered joints. For a uniform registration of defects it is emphasized that in this standard the
28、soldering defects are counted immediately after the actual soldering operation (on emergence of the soldered assembly from the soldering machine). By the Pareto analysis method it can be assessed whether the defect should be attributed to the soldering process proper or to another cause. In order to
29、 manage the ppm values to be calculated, there is a need to understand the mathematical significance of the number of defects found in a batch of a particular size (i.e. smaller than the size of the entire lot of products) and its consequences for the entire lot. Mentioning the ppm value of a certai
30、n soldering process, without reference to the number of soldered joints and without giving the level of confidence is of little use. For making ppm calculations, several methods are described by which the maximum ppm level to be expected can be determined, for example: by using the formula that desc
31、ribes the binomial distribution to construct this distribution; by using graphs or tables from the literature. Page 4 EN 611931:2002 2002 lirpA 81 ISB 4 egaP 2002:139116 NE 2002 yaM 3 ISB Page 4 EN 611931:2002 BSI 6 May 2002 Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 17:23:20 GMT+00:00 2
32、006, Uncontrolled Copy, (c) BSI 69113-CEI 1:0210 5 QUALITY ASSESSMENT SYSTEMS Part 1: Registration and analysis of defects on printed board assemblies 1 Scope This part of IEC 61193 defines methods of registration and analysis of defects on soldered printed board assemblies. Methods are described to
33、 allow effective comparison of perform- ance between products, processes and production locations and can serve as a basis for general quality improvement. The standard specifies defect data collection in two categories. Category 1 ppm data: this category provides data for registration purposes inte
34、nded to enable overall performance comparison of assembly operations. Category 2 ppm data: this category provides data intended for individual subprocess assessment, analysis and control purposes. 2 Normative references The following referenced documents are indispensable for the application of this
35、 document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60194, Printed board design, manufacture and assembly Terms and definitions IEC 61191-1, Printed board assemblies Part 1: Gen
36、eric specification Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies IEC 61191-2, Printed board assemblies Part 2: Sectional specification Requirements for surface mount soldered assemblies IEC 61191-3, Printed board assemblies Part
37、3: Sectional specification Requirements for through-hole mount soldered assemblies IEC 61191-4, Printed board assemblies Part 4: Sectional specification Requirements for terminal soldered assemblies IEC 61192-1, Product performance requirements Part 1: Generic standard Workmanship requirements and g
38、uidelines for soldered electronic assemblies 1 IEC 61192-2, Product performance requirements Part 2: Sectional standard Workmanship requirements and guidelines for soldered surface mount electronic assemblies 1 _ 1 To be published. Page 5 EN 611931:2002 2002 lirpA 81 ISB 5 egaP 2002:139116 NE 2002 y
39、aM 3 ISB Page 5 EN 611931:2002 BSI 6 May 2002 Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 17:23:20 GMT+00:00 2006, Uncontrolled Copy, (c) BSI 69113-CEI 1:0210 6 IEC 61192-3, Product performance requirements Part 3: Sectional standard Workmanship requirements for through-hole mount soldere
40、d assemblies 2 IEC 61192-4, Product performance requirements Part 4: Sectional standard Workmanship requirements for terminal soldered connections 2 3 Terms and definitions For the purposes of this part of IEC 61193 the definitions in IEC 601943 and the following apply. Where appropriate, an alpha-n
41、umerical code has been assigned to the term in order to assist the registration and disposition of defects or process deviation indicators. 3.1 general characterizations conditions or attributes of the final electronic assembly that may be compared to the require- ments of the appropriate documentat
42、ion or performance specification 3.1.1 defect registration uniform registration system for collecting information on electronic assembly attributes that can be accredited to a subprocess or a final product configuration, made before any touch-up or repair process 3.1.2 subprocesses major manufacturi
43、ng functions used to produce electronic assemblies that are an integral part of the manufacturing process to which process deviation indicators or defects defining non- conforming attributes may be assigned 3.1.3 printed board solder joint electrical/mechanical connection to a printed board or other
44、 interconnecting structure that employs solder for the joining of two or more metal surfaces NOTE See also the definitions of cold soldered connection, disturbed soldered connection, excess soldered connection, insufficient soldered connection, overheated soldered connection, preferred soldered conn
45、ection and rosin soldered connection in IEC 60194. 3.2 solder paste application (P0) subprocess used to apply solder paste to a land pattern on a printed board or interconnecting structure for the purpose of attaching components using solder reflow techniques 3.2.1 paste misalignment (P1) image of s
46、older paste geometric profiles positioned so that they are not registered to the land pattern on the printed board/interconnecting structure used to mount components _ 2 To be published. 3 Certain definitions of IEC 60194 have been translated into French. Page 6 EN 611931:2002 2002 lirpA 81 ISB 6 eg
47、aP 2002:139116 NE 2002 yaM 3 ISB Page 6 EN 611931:2002 BSI 6 May 2002 Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 17:23:20 GMT+00:00 2006, Uncontrolled Copy, (c) BSI 69113-CEI 1:0210 7 3.2.2 excessive paste (P2) solder paste geometric profiles that consist of greater paste volume than tha
48、t defined by the assembly process details 3.2.3 insufficient/no paste (P3) solder paste geometric profiles that consist of less paste volume than that defined by the assembly process details 3.2.4 paste smearing (P4) solder paste application that results in the paste being spread over the mounting s
49、urface in an uncontrolled manner rather than having a neat and well-defined geometric profile 3.2.5 paste bridging (P5) solder paste geometric profiles that are touching or have merged across more than one conductive pattern 3.2.6 paste deposit shape (P6) specific solder paste geometric profile located on the printed board mounting surface as determined by forcing the solder paste through the ste