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1、BRITISH STANDARD BS IEC 60747-12-3: 1998 Discrete semiconductor devices and integrated circuits Part 12-3: Optoelectronic devices Blank detail specification for light-emitting diodes (LEDs) for display applications ICS 31.260 Licensed Copy: sheffieldun sheffieldun, na, Sun Nov 26 12:00:09 GMT+00:00
2、2006, Uncontrolled Copy, (c) BSI BS IEC 60747-12-3:1998 This British Standard, having been prepared under the direction of the Electrotechnical Sector Committee, was published under the authority of the Standards Committee and comes into effect on 15 November 1998 BSI 07-1999 ISBN 0 580 29216 9 Nati
3、onal foreword This British Standard reproduces verbatim IEC 60747-12-3:1998 and implements it as the UK national standard. The UK participation in its preparation was entrusted by Technical Committee EPL/47, Semiconductors, to Subcommittee EPL/47/3, Performance of optoelectronic semiconductor device
4、s and liquid crystal displays, which has the responsibility to: aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and Europe
5、an developments and promulgate them in the UK. A list of organizations represented on this subcommittee can be obtained on request to its secretary. From 1 January 1997, all IEC publications have the number 60000 added to the old number. For instance, IEC 27-1 has been renumbered as IEC 60027-1. For
6、 a period of time during the change over from one numbering system to the other, publications may contain identifiers from both systems. Cross-references The British Standards which implement international or European publications referred to in this document may be found in the BSI Standards Catalo
7、gue under the section entitled “International Standards Correspondence Index”, or by using the “Find” facility of the BSI Standards Electronic Catalogue. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their co
8、rrect application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, the IEC title page, page ii, pages 1 to 8 and a back cover. This standard has been updated (
9、see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on the inside front cover. Amendments issued since publication Amd. No.DateComments Licensed Copy: sheffieldun sheffieldun, na, Sun Nov 26 12:00:09 GMT+00:00 2006, Uncontrolled Copy, (c) BSI B
10、S IEC 60747-12-3:1998 BSI 07-1999i Contents Page National forewordInside front cover Introduction1 1Mechanical description2 2Short description2 3Categories of assessed quality2 4Limiting values (absolute maximum rating system)2 5Electrical and optical characteristics3 6Marking3 7Ordering information
11、3 8Test conditions and inspection requirements4 9Group D Qualification approval tests7 10Additional information (not for inspection purposes)7 Annex A (normative) Electrical endurance8 Licensed Copy: sheffieldun sheffieldun, na, Sun Nov 26 12:00:09 GMT+00:00 2006, Uncontrolled Copy, (c) BSI ii blank
12、 Licensed Copy: sheffieldun sheffieldun, na, Sun Nov 26 12:00:09 GMT+00:00 2006, Uncontrolled Copy, (c) BSI Licensed Copy: sheffieldun sheffieldun, na, Sun Nov 26 12:00:09 GMT+00:00 2006, Uncontrolled Copy, (c) BSI ii blank Licensed Copy: sheffieldun sheffieldun, na, Sun Nov 26 12:00:09 GMT+00:00 20
13、06, Uncontrolled Copy, (c) BSI BS IEC 60747-12-3:1998 BSI 07-19991 Introduction The IEC quality assessment system for electronic components is operated in accordance with the statutes of the IEC and under the authority of the IEC. The object of this system is to define quality assessment procedures
14、in such a manner that electronic components released by one participating country as conforming with the requirements of an applicable specification are equally acceptable in all other participating countries without the need for further testing. This blank detail specification is one of a series of
15、 blank detail specifications for semiconductor devices and should be used with the following IEC publications: IEC 60747-10/QC 700000:1991, Semiconductor devices Part 10: Generic specification for discrete devices and integrated circuits. IEC 60747-12/QC 720100:1991, Semiconductor devices Part 12: S
16、ectional specification for optoelectronic devices. Required information Numbers shown in brackets on this and the following page correspond to the following items of required information, which should be entered in the spaces provided. Identification of the detail specification 1 The name of the nat
17、ional standards organization under whose authority the detail specification is issued. 2 The IECQ number of the detail specification. 3 The numbers and issue numbers of the generic and sectional specifications. 4 The national number of the detail specification, data of issue and any further informat
18、ion, if required by the national system. Identification of the component 5 Main function and type number. 6 Information on typical construction (materials, the main technology) and the package. If a device has several kinds of derivative products, those differences shall be indicated, for example fe
19、ature of characteristics in the comparison table. If a device is sensitive to electrostatic charges, a caution statement shall be added in the detail specification. 7 Outline drawing, terminal identification, marking and/or reference to the relevant document for outlines. 8 Category of assessed qual
20、ity according to 2.6 of the generic specification. 9 Reference data. The clauses given in square brackets on the next pages of this standard, which form the front page of the detail specification, are intended for guidance to the specification writer and shall not be included in the detail specifica
21、tion. When confusion may arise as to whether a paragraph is only an instruction to the writer or not, the paragraph shall be indicated between square brackets. Licensed Copy: sheffieldun sheffieldun, na, Sun Nov 26 12:00:09 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS IEC 60747-12-3:1998 2 BSI 07-1
22、999 4 Limiting values (absolute maximum rating system) These values apply over the operating temperature range, unless otherwise stated. Repeat only subclause numbers used, with title. Any additional values should be given at the appropriate place, but without clause number(s). Name (address) of res
23、ponsible NAI (and possibly of body from which specification is available). 1Number of IECQ detail specification, plus issue number and/or date. 2 ELECTRONIC COMPONENT OF ASSESSED QUALITY IN ACCORDANCE WITH: 3National number of detail specification.4 Generic specification:This box need not be used if
24、 national number repeats IECQ number. IEC 60747-10/QC700000 Sectional specification: IEC 60747-12/QC720100 and national references if different. DETAIL SPECIFICATION FOR: LIGHT EMITTING DIODES DISPLAY APPLICATION5 Type number(s) of the relevant device(s) Ordering information: see clause 7 of this st
25、andard. 1 Mechanical description 7 2 Short description 6 Outline references:Light emitting diode/IR emitting diode: IEC 60191-2. mandatory if available and/or national if there is no IEC outline. with/without pigtail Type: surface/edge emitting semiconductor material; Outline drawing:GaAs/GaAlAs/InP
26、/InGaAsP/. May be transferred to, or given with more details in clause 10 of this standard.Encapsulation: metal/glass/plastic/. Terminal identification:Some important reference data may be added. Drawing showing pin assignments, including graphical symbols. Marking: letters and figures 3 Categories
27、of assessed quality 8 The detail specification shall prescribe the information to be marked on the device, if any. See 2.5 of generic specification and/or clause 6 of this standard. From 2.6 of the generic specification. Reference data9 Information about manufacturers who have components qualified t
28、o this detail specification is available in the current qualified products list. Licensed Copy: sheffieldun sheffieldun, na, Sun Nov 26 12:00:09 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS IEC 60747-12-3:1998 BSI 07-19993 Curves should preferably be given in clause 10 of this standard. 5 Electrica
29、l and optical characteristics See clause 8 of this standard for inspection requirements. Repeat only subclause numbers used, with title. Any additional characteristics shall be given at the appropriate place, but without subclause number(s). When several devices are defined in the same detail specif
30、ication, the relevant values should be given on successive lines, avoiding identical values. Curves should preferably be given in clause 10 of this standard. 6 Marking Any particular information other than given in box 7 (clause 1) and/or subclause 2.5 of IEC 60747-10, shall be given here. 7 Orderin
31、g information The following minimum information is necessary to order a specific device, unless otherwise specified: precise type reference (and nominal voltage value, if required); IECQ reference of detail specification with issue number and/or date when relevant; category of assessed quality as de
32、fined in 3.7 of the sectional specification and, if required, screening sequence, as defined in 3.6 of the sectional specification; any other particulars. SubclauseLimiting valueSymbol RequirementsUnit Min.Max. 4.1Storage temperatureTstgC 4.2Operating ambient temperatureTambC 4.3Soldering temperatur
33、e (at maximum soldering time and minimum distance to case specified) Tsld C s mm 4.4Reverse voltageVRV 4.5Continuous forward current at ambient temperature of 25 C IFmA 4.6Peak forward current at ambient temperature of 25 C, under specified pulse conditions (where appropriate) IFMA 4.7Power dissipat
34、ionPtotW SubclauseCharacteristicsSymbol Conditions at Tamb or Tcase = 25 C unless otherwise specified RequirementsUnitTested Min.Max. 5.1Forward voltageVFIF as specifiedVA2b 5.2Reverse currentIRVR as specified4AA2b 5.3Luminous intensityIVIF as specified variant as specified mcdA2b 5.4Half-intensity
35、angle (where appropriate) “IF as specifieddegC2a 5.5Peak emission wavelength pIF as specifiednmA4 5.6Spectral radiation bandwidth 2IF as specifiednmC2a Licensed Copy: sheffieldun sheffieldun, na, Sun Nov 26 12:00:09 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS IEC 60747-12-3:1998 4 BSI 07-1999 8 Te
36、st conditions and inspection requirements These are given in the following tables, where the values and exact test conditions to be used shall be specified as required for a given type, and as required by the relevant test in the relevant IEC publication. When several devices are included in the sam
37、e detail specification, the relevant conditions and/or values should be given on successive lines, where possible avoiding repetition of identical conditions and/or values. The choice between alternative tests or test methods shall be made when a detail specifications is written. Throughout the foll
38、owing text, reference to subclause numbers are made with respect to the generic specification, unless otherwise stated, and test methods are quoted from clause 4 of the sectional specification. For sampling requirements, either refer to, or reference, values of 3.7 of the sectional specification, ac
39、cording to applicable category(ies) of assessed quality. For group A, the choice between AQL and LTPD system shall be made in the detail specification. GROUP A Lot-by-lot tests LSL = lower specification limit from group A USL = upper specification limit All tests are non-destructive (3.6.6 of the ge
40、neric specification) Inspection or testSymbolReference Conditions at Tamb or Tcase = 25 C, unless otherwise stated (see clause 4 of the generic specification) Inspection or test requirement/limits Min.Max. Subgroup A1 External visual inspection 4.2.1.1 of the generic specification Subgroup A2a Inope
41、rative devicesInverted polarity Polarity Luminous intensityIVIEC 60747-5, IV, 1.1IF as specifiedIv = 5 USL IR = 50 USL Forward voltageVFIEC 60747-3, IVVariant as specified Reverse currentIRIEC 60747-3, IVVR as specified SubGroup A2b Optical and electrical characteristics Luminous intensityIVIEC 6074
42、7-5, IV, 1.1IF as specifiedLSL Forward voltageVFIEC 60747-3, IVVariant as specified Reverse currentIRIEC 60747-3, IVIF as specifiedLSL VR as specifiedLSL Subgroup A4 Peak emission wavelength pIEC 60747-5, IV, 1.4IF as specifiedLSLUSL Licensed Copy: sheffieldun sheffieldun, na, Sun Nov 26 12:00:09 GM
43、T+00:00 2006, Uncontrolled Copy, (c) BSI BS IEC 60747-12-3:1998 BSI 07-19995 GROUP B Lot-by-lot tests (In the case of category I, see 2.6 of the generic specification) LSL = lower specification limit from group A USL = upper specification limit from group A Only tests marked (D) are destructive (see
44、 3.6.6 of the generic specification) Inspection or testSymbolReference Conditions at Tamb or Tcase = 25 C, unless otherwise stated (see clause 4 of the generic specification) Inspection or test requirement/limits Min.Max. Subgroup B1IEC 60747-10, 4.2.2 and Appendix B Dimensions(see clause 1 of this
45、standard) Subgroup B3(D) IEC 60749, II, 1.2As specified Lead bendingNo damage Subgroup B4 IEC 60749, II, 2.1As specifiedGood wetting Solderability Subgroup B5(D) Rapid change ofIEC 60749, III, 1 temperature followed by: either damp heat, cyclic(D)IEC 60749, III, 4As specified (for non-cavity devices
46、 only) with final measurements, reverse currentIRIEC 60747-3, IVVR as specifiedUSL forward voltageVFIEC 60747-3, IVIF as specifiedUSL luminous intensity; IvIEC 60747-5, IV, 1.1 IF as specifiedLSL orVariant as specified sealing (for cavity devices only)IEC 60749, III, 5 Subgroup B8 Electrical enduran
47、ceIEC 60747-3, VIF as specified as in 4.5, 168 h.with final measurements, reverse currentIEC 60747-3, IVVR as specified2 USL forward voltageIRIEC 60747-3, IVIF as specified1,2 USL luminous intensity VFIEC 60747-5, IV, 1.1 IF as specified0,5 LSL IVVariant as specified Subgroup CRRLAttributes informat
48、ion for B3, B4, and B5. Measurement information before and after B8. Licensed Copy: sheffieldun sheffieldun, na, Sun Nov 26 12:00:09 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS IEC 60747-12-3:1998 6 BSI 07-1999 GROUP C Periodic tests LSL = lower specification limit from group A USL = upper specifi
49、cation limit from group A Only tests marked (D) are destructive (see 3.6.6 of the generic specification) Inspection or testSymbolReference Conditions at Tamb or Tcase = 25 C, unless otherwise stated (see clause 4 of the generic specification) Inspection or test requirement/limits Min.Max. Subgroup C1IEC 60747-10, Dimensions4.2.2 and Appendix B(see clause 1 of this standard) Subgroup C2a Spectral radi