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1、Surface mounting technology Environmental and endurance test methods for surface mount solder joint Part 1-4: Cyclic bending test BS EN 62137-1-4:2009 raising standards worldwide NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAW BSI British Standards Licensed CopyChinese Univers
2、ity of Hong Kong, 11/04/2009 08:14, Uncontrolled Copy, (c) BSI National foreword This British Standard is the UK implementation of EN 62137-1-4:2009. It is identical to IEC 62137-1-4:2009. The UK participation in its preparation was entrusted to Technical Committee EPL/501, Electronic assembly techn
3、ology. A list of organizations represented on this committee can be obtained on request to its secretary. This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. BSI 2009 ISBN 978 0 580 59252 2 ICS 31.190 BRITISH STA
4、NDARDBS EN 62137-1-4:2009 Compliance with a British Standard cannot confer immunity from legal obligations. This British Standard was published under the authority of the Standards Policy and Strategy Committee on 31 March 2009. Amendments issued since publication Amd. No. Date Text affected License
5、d CopyChinese University of Hong Kong, 11/04/2009 08:14, Uncontrolled Copy, (c) BSI EUROPEAN STANDARD EN 62137-1-4 NORME EUROPENNE EUROPISCHE NORM February 2009 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elek
6、trotechnische Normung Central Secretariat: avenue Marnix 17, B - 1000 Brussels 2009 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 62137-1-4:2009 E ICS 31.190 English version Surface mounting technology - Environmental and endura
7、nce test methods for surface mount solder joint - Part 1-4: Cyclic bending test (IEC 62137-1-4:2009) Technologie de montage en surface - Mthodes dessais denvironnement et dendurance des joints brass monts en surface - Partie 1-4: Essai de flexion cyclique (CEI 62137-1-4:2009) Oberflchenmontage-Techn
8、ik - Verfahren zur Prfung auf Umgebungseinflsse und zur Prfung der Haltbarkeit von Oberflchen-Ltverbindungen - Teil 1-4: Zyklische Biegeprfung (IEC 62137-1-4:2009) This European Standard was approved by CENELEC on 2009-02-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulati
9、ons which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This E
10、uropean Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members a
11、re the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, S
12、pain, Sweden, Switzerland and the United Kingdom. BS EN 62137-1-4:2009 Licensed CopyChinese University of Hong Kong, 11/04/2009 08:14, Uncontrolled Copy, (c) BSI EN 62137-1-4:2009 - 2 - Foreword The text of document 91/815/FDIS, future edition 1 of IEC 62137-1-4, prepared by IEC TC 91, Electronics a
13、ssembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 62137-1-4 on 2009-02-01. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2
14、009-11-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2012-02-01 Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 62137-1-4:2009 was approved by CENELEC as a European Standard without any modificati
15、on. _ BS EN 62137-1-4:2009 Licensed CopyChinese University of Hong Kong, 11/04/2009 08:14, Uncontrolled Copy, (c) BSI - 3 - EN 62137-1-4:2009 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following referenced documents are
16、indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE When an international publication has been modified by common modifications, indica
17、ted by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 60068-1 -1) Environmental testing - Part 1: General and guidance EN 60068-1 19942) IEC 60194 -1) Printed board design, manufacture and assembly - Terms and definitions EN 60194 20062) IEC 61188-5 Series Printed boards an
18、d printed board assemblies - Design and use - Part 5: Attachment (land/joint) considerations EN 61188-5 Series IEC 61190-1-2 -1) Attachment materials for electronic assembly - Part 1-2: Requirements for soldering paste for high-quality interconnects in electronics assembly EN 61190-1-2 20072) IEC 61
19、190-1-3 -1) Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications EN 61190-1-3 20072) IEC 61249-2-7 -1) Materials for printed boards and other interconnecting structures -
20、 Part 2-7: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad EN 61249-2-7 + corr. September 20022) 2005 IEC 61760-1 -1) Surface mounting technology - Part 1: Standard method for the specification of surface
21、 mounting components (SMDs) EN 61760-1 20062) 1) Undated reference. 2) Valid edition at date of issue. BS EN 62137-1-4:2009 Licensed CopyChinese University of Hong Kong, 11/04/2009 08:14, Uncontrolled Copy, (c) BSI 2 62137-1-4 IEC:2009 CONTENTS 1 Scope.5 2 Normative references .6 3 Terms and definit
22、ions .6 4 Test equipment and material 6 4.1 Test equipment for cyclic bending .6 4.2 Test substrate .7 4.3 Solder alloy.7 4.4 Solder paste7 4.5 Reflow soldering equipment 7 4.6 Surface mount component for testing 7 5 Mounting method7 6 Test conditions.8 6.1 Pre-treatment 8 6.2 Test procedures 8 6.3
23、Judging criteria9 7 Items to be included in the test report.9 8 Items to be prescribed in the product specifications9 Annex A (normative) Cyclic bending test equipment.11 Figure 1 Image drawing on evaluation area of joint strength.5 Figure 2 Typical reflow soldering profile.8 Figure A.1 Sample struc
24、ture of substrate bending jig .12 Figure A.2 Sample structure of cyclic bending strength test .13 BS EN 62137-1-4:2009 Licensed CopyChinese University of Hong Kong, 11/04/2009 08:14, Uncontrolled Copy, (c) BSI 62137-1-4 IEC:2009 5 SURFACE MOUNTING TECHNOLOGY ENVIRONMENTAL AND ENDURANCE TEST METHODS
25、FOR SURFACE MOUNT SOLDER JOINT Part 1-4: Cyclic bending test 1 Scope The test method described in this part of IEC 62137 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder joints between component leads an
26、d lands on a substrate by cyclic bending of substrate. This test also evaluates the effects of repeated mechanical stress, such as key pushing in cell phones, the strength of the solder joint between component terminals and lands on a substrate. In this test method, the evaluation requires first to
27、mount the surface mount component on the substrate by reflow soldering, then cyclically bend the substrate to a certain degree of depth until fracture of the solder joints occurs. The properties of the solder joints (e.g, solder alloy, substrate, mounted device or design, etc.) are evaluated to assi
28、st in improving the strength of the solder joints. Component lead Substrate Enlarge Evaluation area Plated layers Substrate land Intermetallic compound layers Solder Substrate Component lead IEC 1174/07 Figure 1 Image drawing on evaluation area of joint strength BS EN 62137-1-4:2009 Licensed CopyChi
29、nese University of Hong Kong, 11/04/2009 08:14, Uncontrolled Copy, (c) BSI 6 62137-1-4 IEC:2009 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest e
30、dition of the referenced document (including any amendments) applies. IEC 60068-1, Environmental testing Part 1: General and guidance IEC 60194, Printed board design, manufacture and assembly Terms and definitions IEC 61188-5 (all parts 5), Printed boards and printed board assemblies Design and use
31、Part 5: Attachment (land-joint) considerations IEC 61190-1-2, Attachment materials for electronic assembly Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly IEC 61190-1-3, Attachment materials for electronic assembly Part 1-3: Requirements for electro
32、nic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications IEC 61249-2-7, Materials for printed boards and other interconnecting structures Part 2-7: Reinforced base materials clad and unclad Epoxide woven E-glass laminated sheet of defined flammability (ve
33、rtical burning test), copper-clad IEC 61760-1, Surface mounting technology Part 1: Standard method for the specification of surface mounting components (SMDs) 3 Terms and definitions For the purposes of this document, the terms and definitions given in IEC 60194, IEC 60068-1 and IEC 61249-2-7 as wel
34、l as the following apply. 3.1 cyclic bending strength intensity of the strength, which is expressed in the number of cycles to attain the joint fracture between surface mount component terminals mounted on the printed board and the copper land of the substrate after bending the substrate cyclically
35、to a certain degree to allow the surface of the component side of the board to become a convex shape 3.2 displacement rate moving velocities of the indenter when cyclically bending the substrate 3.3 displacement range distance from the initial test position at the centre of the substrate to the maxi
36、mum indentation caused by pushing the indenter down and by pulling it back 4 Test equipment and materials 4.1 Test equipment for cyclic bending The equipment for cyclic bending tests consists of a tension compression testing machine, substrate bending jigs, a resistance measuring instrument and a re
37、corder. The specifications shall comply with those of the cyclic bending test equipment described in Annex A. BS EN 62137-1-4:2009 Licensed CopyChinese University of Hong Kong, 11/04/2009 08:14, Uncontrolled Copy, (c) BSI 62137-1-4 IEC:2009 7 4.2 Test substrate Unless otherwise prescribed by the rel
38、evant product specifications, the test substrate shall meet the following conditions: a) Material: Epoxide woven, glass fabric, copper-clad laminated sheet, general purpose grade (see IEC 612492-7), with foil bonded to one side and a nominal thickness of the sheet, including the metal foil, of 1,6 m
39、m with a tolerance of 0,20 mm. The copper foil should have a thickness of 0,035 mm 0,010 mm. b) Size: The size of the substrate depends on the size and shape of a surface mount device soldered on the substrate. The substrate shall be able to be fastened to the pull test equipment. c) Land geometry:
40、The shape and size of a land shall comply with the IEC 61188-5 series or the pad geometry recommended by the respective component supplier. d) Surface protection: The solderable areas of the substrate (lands) shall be protected against oxidization by suitable means, for example by an organic surface
41、 protection layer (OSP). This protective layer shall not adversely effect the solderability of the lands under the soldering conditions of the reflow soldering equipment. 4.3 Solder alloy Unless otherwise specified, the solder alloy shall consist of a ternary composition of Sn, Ag and Cu with the Ag
42、 content ranking from 3,0 % to 4,0 % by weight and the Cu content ranking from 0,5 % to 1,0 % by weight with Sn for balance, for example SnAg3,0Cu0,5. The solder alloy shall be in accordance with IEC 61190-1-3. 4.4 Solder paste Unless otherwise stated in the relevant product specifications, solder p
43、aste should be chosen from IEC 61190-1-2. However, the solder to be used shall be the one specified in 4.3 above. 4.5 Reflow soldering equipment Unless otherwise prescribed by the relevant product specifications, reflow-soldering equipment should be the one that can realize the temperature profile a
44、s shown in Figure 2. 4.6 Surface mount component for testing Unless otherwise prescribed by the relevant product specifications, the surface mount component shall have the structure that enables the measurement of electrical resistance (for example, daisy chain). NOTE In connecting a daisy chain, ca
45、re should be given to prevent breaking the wiring pattern, such as by drawing the wiring pattern forth from a shorter rather than a longer direction of the board. 5 Mounting method Unless otherwise prescribed by the relevant product specifications, the surface mount component shall be mounted on the
46、 substrate in the following sequence: a) Apply the solder paste specified in 4.4 to the lands of a test substrate as specified in 4.2, using a stainless steel mask that has openings of the same size, shape and configuration as the lands as specified in 4.2 c) with a thickness of 100 m to 150 m. b) M
47、ount the test specimen on the test substrate with the printed solder paste. c) Perform soldering using the reflow soldering equipment specified in 4.5 and the solder paste specified in 4.4 under the following conditions: typical temperature profile of reflow soldering is given in Figure 2 and as pro
48、posed in IEC 61760-1; the temperature shall be measured at the land. BS EN 62137-1-4:2009 Licensed CopyChinese University of Hong Kong, 11/04/2009 08:14, Uncontrolled Copy, (c) BSI 8 62137-1-4 IEC:2009 300 250 200 150 100 50 0 0 30 60 90 120150180210240270300330 360 220 C 235 C 245 C 250 C 180 C 150
49、 C Typical Ramp up rate 220 C SnAgCu Reflow Preheating Continous line: typical process (terminal temperaure) Dotted line: process limits. Bottom process limit (terminal temperature). Upper process limit (top surface temperature) Temperature C IEC 1176/07 Time s Figure 2 Typical reflow soldering profile 6 Test conditions 6.1 Pre-treatment Unless otherwise stated in the relevant product specifications, the specimen