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1、BRITISH STANDARD BS EN 62258-6:2006 Semiconductor die products Part 6: Requirements for information concerning thermal simulation The European Standard EN 62258-6:2006 has the status of a British Standard ICS 31.080.99 ? Licensed Copy: London South Bank University, London South Bank University, Sun
2、Dec 24 04:23:10 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS EN 62258-6:2006 This British Standard was published under the authority of the Standards Policy and Strategy Committee on 30 November 2006 BSI 2006 ISBN 0 580 49609 0 National foreword This British Standard was published by BSI. It is the
3、 UK implementation of EN 62258-6:2006. It is identical with IEC 62258-6:2006. It supersedes PD ES 59008-4-3:2000, which will be withdrawn on 1 September 2009. The UK participation in its preparation was entrusted to Technical Committee EPL/47, Semiconductors. A list of organizations represented on E
4、PL/47 can be obtained on request to its secretary. This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. Compliance with a British Standard cannot confer immunity from legal obligations. Amendments issued since pub
5、lication Amd. No. DateComments Licensed Copy: London South Bank University, London South Bank University, Sun Dec 24 04:23:10 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EUROPEAN STANDARD EN 62258-6 NORME EUROPENNE EUROPISCHE NORM September 2006 CENELEC European Committee for Electrotechnical Standar
6、dization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2006 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 62258-6:2006
7、 E ICS 31.080.99 Supersedes ES 59008-4-3:1999 English version Semiconductor die products Part 6: Requirements for information concerning thermal simulation (IEC 62258-6:2006) Produits de matrice de semi-conducteur Partie 6: Exigences pour linformation concernant la simulation thermique (CEI 62258-6:
8、2006) Halbleiter-Chip-Erzeugnisse Teil 6: Anforderungen fr Angaben hinsichtlich der thermischen Simulation (IEC 62258-6:2006) This European Standard was approved by CENELEC on 2006-09-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for
9、 giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three offic
10、ial versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical commi
11、ttees of Austria, Belgium, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom
12、. Licensed Copy: London South Bank University, London South Bank University, Sun Dec 24 04:23:10 GMT+00:00 2006, Uncontrolled Copy, (c) BSI Foreword The text of document 47/1870/FDIS, future edition 1 of IEC 62258-6, prepared by IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC para
13、llel vote and was approved by CENELEC as EN 62258-6 on 2006-09-01. This standard is to be used in conjunction with EN 62258-1 and EN 62258-2. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by end
14、orsement (dop) 2007-06-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2009-09-01 Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 62258-6:2006 was approved by CENELEC as a European Standard without
15、any modification. _ EN 62258-6:2006 Licensed Copy: London South Bank University, London South Bank University, Sun Dec 24 04:23:10 GMT+00:00 2006, Uncontrolled Copy, (c) BSI INTERNATIONAL STANDARD IEC 62258-6 First edition 2006-08 Semiconductor die products Part 6: Requirements for information conce
16、rning thermal simulation IEC 2006 Copyright - all rights reserved No part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from the publisher. International Electrotechnical Co
17、mmission, 3, rue de Varemb, PO Box 131, CH-1211 Geneva 20, Switzerland Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmailiec.ch Web: www.iec.ch J For price, see current catalogue PRICE CODE Commission Electrotechnique Internationale International Electrotechnical Commission EN 6225
18、8-6:2006 Licensed Copy: London South Bank University, London South Bank University, Sun Dec 24 04:23:10 GMT+00:00 2006, Uncontrolled Copy, (c) BSI 2 CONTENTS INTRODUCTION.3 1 Scope.4 2 Normative references .4 3 Terms and definitions.4 4 General 4 5 Requirements for information for thermal simulation
19、 .5 5.1 Requirements for bare die with or without added connection structures.5 5.2 Requirements for minimally-packaged die .5 5.3 Information on thermal simulation model .6 Bibliography .8 Annex ZA (normative) Normative references to international publications with their corresponding European publ
20、ications.7 EN 62258-6:2006 Licensed Copy: London South Bank University, London South Bank University, Sun Dec 24 04:23:10 GMT+00:00 2006, Uncontrolled Copy, (c) BSI 3 INTRODUCTION This standard is based on the work carried out in the ESPRIT 4th Framework project GOODDIE which resulted in the publica
21、tion of the ES 59008 series of European specifications. Organisations that helped prepare this part to IEC 62258 included the ESPRIT ENCAST project, the Die Products Consortium, JEITA, JEDEC and ZVEI. EN 62258-6:2006 Licensed Copy: London South Bank University, London South Bank University, Sun Dec
22、24 04:23:10 GMT+00:00 2006, Uncontrolled Copy, (c) BSI 4 SEMICONDUCTOR DIE PRODUCTS Part 6: Requirements for information concerning thermal simulation 1 Scope This part of IEC 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including: wafers; sing
23、ulated bare die; die and wafers with attached connection structures; minimally or partially encapsulated die and wafers. This part of IEC 62258 determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct
24、 functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. It is intended to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2
25、. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 62258-1: Semiconduct
26、or die products Part 1: Requirements for procurement and use IEC 62258-2: Semiconductor die products Part 2: Exchange data formats 3 Terms and definitions For the purposes of this document, the terms, definitions and acronyms as given in IEC 62258-1 apply. 4 General To comply with IEC 62258-1, suppl
27、iers of die devices shall furnish information, which is necessary and sufficient for users of the devices at all stages of design, procurement, manufacture and test of products containing them It is expected that much of the information supplied will be in the public domain and available from such s
28、ources as manufacturers data sheets. However, this standard does not place an obligation on a supplier to make information public. Any information that a supplier considers to be proprietary or commercially sensitive may be supplied under the terms of a non- disclosure agreement. EN 62258-6:2006 Lic
29、ensed Copy: London South Bank University, London South Bank University, Sun Dec 24 04:23:10 GMT+00:00 2006, Uncontrolled Copy, (c) BSI 5 Requirements and recommendations provided in this standard apply to thermal simulation models used to perform an analysis on how the thermal excursions within the
30、die affect the electrical performance of the die and system. 5 Requirements for information for thermal simulation 5.1 Requirements for bare die with or without added connection structures 5.1.1 General This clause covers the requirements for bare die with or without added connection structures. The
31、 following information shall be given as a minimum together with any information needed to satisfy a specific thermal simulation model. 5.1.2 Operating temperature conditions The range of temperature under which the device operates shall be stated. 5.1.3 Maximum junction temperature The maximum allo
32、wable junction temperature shall be stated. 5.1.4 Extended junction temperature range Further allowed junction temperatures exceeding the maximum junction temperatures with reduced lifetimes for the conditions in 5.1.2 should be stated where appropriate. 5.1.5 Power dissipation Maximum power dissipa
33、tion values under specified conditions shall be stated. Minimum and typical power dissipation values should also be given. 5.1.6 Distribution of heat sources When possible, a plot of the die surface indicating the position and area of heat sources should be given. 5.1.7 Type and power of each heat s
34、ource The type and power of each heat source when possible, should be described, including whether the heat is generated in the die surface or the bulk substrate. 5.1.8 Thermal conductivity The thermal conductivity of all materials should be given. 5.1.9 Specific thermal capacity If a transient simu
35、lation is required, then the specific thermal capacity of all materials should be given. 5.2 Requirements for minimally-packaged die 5.2.1 General Information as described in the following subclauses should be supplied in addition to any relevant information as defined in 5.1 Modelling methods for p
36、ackaged devices may be appropriate for this type of die device. EN 62258-6:2006 Licensed Copy: London South Bank University, London South Bank University, Sun Dec 24 04:23:10 GMT+00:00 2006, Uncontrolled Copy, (c) BSI 6 5.2.2 Package thermal resistance The junction-to-ambient and/or junction-to-refe
37、rence thermal resistance values of the package should be given. 5.2.3 Thermal resistance measurement test method and conditions A description of the test method and measurement test conditions including ambient temperature and airflow, reference temperature and reference location, under which therma
38、l resistance measurements have been carried out, should be supplied. The power applied to the device under test during the thermal resistance measurements should also be given. 5.2.4 Thermal properties of the encapsulation materials The thermal properties of all materials used for encapsulating the
39、die (e.g. encapsulant, adhesive, substrate dielectric, etc.) used in the package should be stated. 5.3 Information on thermal simulation model 5.3.1 General Where a thermal simulation model is provided, for example a finite-element model, the information as defined in the following subclauses shall
40、be given. 5.3.2 Model file name The name of the file containing the model shall be given. 5.3.3 Creation date The date on which the model file was created shall be given. 5.3.4 Model description A description of the model shall be provided in sufficient detail for a user to understand its scope and
41、apply the corresponding simulator correctly. 5.3.5 Model source The source and originator of the model shall be stated. 5.3.6 Simulation program The name(s) of the simulation program(s) that will accept the model file as valid input shall be given. NOTE Examples of such simulators include ANSYS, FLO
42、THERM and ICEPAK. 5.3.7 Program version The version(s) of the simulation program(s) that are compatible with the given file shall be given. 5.3.8 Compliance level The level(s) of the simulation program(s) with which the model file complies shall be given. 5.3.9 Model scope The scope of the model sha
43、ll be given, including any limitations in its use. EN 62258-6:2006 Licensed Copy: London South Bank University, London South Bank University, Sun Dec 24 04:23:10 GMT+00:00 2006, Uncontrolled Copy, (c) BSI Annex ZA (normative) Normative references to international publications with their correspondin
44、g European publications The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE When an internationa
45、l publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 62258-1 -1) Semiconductor die products Part 1: Requirements for procurement and use EN 62258-1 20052) IEC 62258-2 -1) Semiconductor die products Part 2: Exch
46、ange data formats EN 62258-2 20052) 1) Undated reference. 2) Valid edition at date of issue. EN 62258-6:2006 7 Licensed Copy: London South Bank University, London South Bank University, Sun Dec 24 04:23:10 GMT+00:00 2006, Uncontrolled Copy, (c) BSI 8 Bibliography EIA/JESD51, Methodology for the Ther
47、mal Measurement of Component Packages (Single Semiconductor Device) EIA/JESD51-1, Integrated Circuit Thermal Measurement Method Electrical Test Method (Single Semiconductor Device) EIA/JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions Natural Convection (Still Air) EIA/JESD5
48、1-5, Extension of Thermal Test Board Standards for Packages with Direct Thermal Attachment Mechanisms EIA/JESD51-6, Thermal Test Method Environmental Conditions Forced Convection EIA/JESD51-8, Thermal Test Method, Environmental Conditions: Junction to Board Thermal Resistance EIA/JESD51-9, Test Boar
49、ds for Area Array Surface Mount Package Thermal Measurements _ EN 62258-6:2006 Licensed Copy: London South Bank University, London South Bank University, Sun Dec 24 04:23:10 GMT+00:00 2006, Uncontrolled Copy, (c) BSI blank Licensed Copy: London South Bank University, London South Bank University, Sun Dec 24 04:23:10 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS