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1、 EIA STANDARD Surface Mount Ferrite Chip Bead Qualification Specification EIA-944 NOVEMBER 2002 ELECTRONIC COMPONENTS, ASSEMBLIES approval levels and sampling plan Test method Ferrite chip bead inspection Sample size per lotTotal sample size Defects permitted 4.2 Electrical characteristics 83 249 0
2、4.3 Visual and mechanical 5 15 0 4.4 Life 16 48 0 4.5 Load Humidity 16 48 0 4.6 Thermal shock 16 48 0 4.7 Vibration 5 15 0 4.8 Shock 5 15 0 4.9 Bending 5 15 0 4.10 Flammability Present certificate of compliance 4.11 Solderability 10 30 0 4.12 Resistance to soldering heat 5 15 0 4.13 Terminal Strengt
3、h 5 15 0 4.2 Electrical characteristics The total samples required in Table 1 shall be measured initially at ambient room temperature, relative humidity, and atmospheric pressure (Typical: 25C, 50%, 760mm Hg) before subsequent testing. Initial electrical parameters shall meet the requirements listed
4、 in the applicable product specifications. The initial parameter testing shall include the measurement of impedance and DC resistance. Impedance values shall be measured at 100 MHz or per suppliers specification. In addition, the rated current shall be defined as the current required to achieve a ma
5、ximum self temperature rise (T) of: a) 25 oC for Signal level beads (30 B 20 C 15 D 10 E 5 EIA-944 Surface mount ferrite chip bead qualification specification Page 5 4.3 Visual and Mechanical Examination The ferrite chip beads shall be visually examined to verify that no defects in workmanship exist
6、. Mechanical dimensions will be measured and shall meet the requirements defined in the detailed specification sheet or reference documents. Unless otherwise specified, when ferrite chip beads are tested in accordance with the environmental and other stress tests listed below, there shall be no evid
7、ence of mechanical damage or measurable discontinuity. This test may be conducted at room temperature. -,-,- EIA-944 Page 6 Surface mount ferrite chip bead qualification specification 4.4 Life Test Ferrite chip beads shall be tested in accordance with MIL-STD-202, Method 108, Test Condition D where
8、applicable except: a) Preconditioning is required as specified in Section 5. b) Test temperature shall be 125* 3 oC. c) Apply maximum rated DC current for 1000 hours minimum. d) Measurements shall be taken at 0 h and 1000 h. The beads shall be allowed to stabilize at room temperature for 24 hours be
9、fore measurements are taken. The impedance value shall not change by more than (Refer to Maximum Impedance Change Chart Table 2) of the initial value at the intermediate or final measurements; the DC resistance (DCR) value shall not exceed the maximum specification value at intermediate or final mea
10、surements; no physical or mechanical damage shall be observed. * 85 3 oC for high current ferrite beads. 4.5 Aqueous Conditions Test 4.5.1 Load Humidity Test (Steady State) Ferrite chip beads shall be tested in accordance with MIL-STD-202, Method 103, Test Condition D where applicable except: a) Pre
11、conditioning as specified in Section 5, is required. b) Test temperature (+85 3) oC. c) Relative humidity shall be held at 85%. d) Apply 100% of the rated current continuously for 1000 hours. e) Measurements shall be taken at 0 h and 1000 h. The ferrite chip beads shall be allowed to stabilize at ro
12、om temperature for 24 hours before measurements are taken. f) The impedance value shall not change by more than (Refer to Maximum Impedance Change Chart Table 2) from the initial value. The DCR value shall not exceed the maximum specification value. No physical or mechanical damage shall be observed
13、. 4.6 Thermal shock Ferrite chip beads shall be tested either per MIL-STD-202, Method 107G, where applicable except: a) Preconditioning as specified in Section 5, is required. b) Air-to-air, Test Condition B-3 Subject units to 500 cycles in the following sequence: Measurements shall be made at 0 cyc
14、les and 500 cycles. Step Temperature (o C) Time (minutes) 1. Start -40 2 2. Hold -40 2 30 5 3. Transfer 0.5 Max. 4. Hold +105 2 30 5 5. Transfer 0.5 Max. OR -,-,- EIA-944 Surface mount ferrite chip bead qualification specification Page 7 4.6 Thermal shock (Continued) c) liquid-to-liquid, Test Condit
15、ion BB-2 Subject units to 200 cycles in the following sequence. Measurement shall be made at 0 cycles and 200 cycles. Step Temperature (o C) Time (minutes) 1. Start -40 2 2. Hold -40 2 5 3. Transfer 0.2 Max 4. Hold +105 2 5 5. Transfer 0.2 Max d) The beads shall be allowed to stabilize at room tempe
16、rature for 24 hours before measurements are taken. The impedance value at the specified intervals shall not change by more than (Refer to Maximum Impedance Change Chart 2). The DCR value shall not exceed the maximum specification value at intermediate or final measurements. No physical or mechanical
17、 damage shall be observed. 4.7 Vibration Ferrite chip beads shall be tested in accordance with MIL-STD-202, Method 204, Test Condition B (15 g). a) Preconditioning as specified in Section 5, is required. b) This test shall be done in series with paragraph 4.8, Shock. 4.8 Shock Ferrite chip beads sha
18、ll be tested in accordance with MIL-STD-202, Method 213, Test Condition A (50 g). a) Preconditioning as specified in Section 5, is required. b) Following tests 4.7 and 4.8, there shall be no physical or mechanical damage. The impedance value shall not change by more than (Refer to Maximum Impedance
19、Change Chart Table 2). The DCR value shall not exceed the maximum specification . 4.9 Bending Ferrite chip beads shall be tested in accordance with IEC 68-2-21 except: a) The components shall be mounted to a FR4 substrate of the following dimensions (LxWxH): 0805: 40x100x1.2mm 0805: 40x100x0.8mm b)
20、Preconditioning is required as specified in Section 5 c) The ferrite chip bead shall be subjected to one bend of 1.2mm for case sizes 0805, or 0.8mm for case sizes 0805, for a minimum duration of 10 seconds. d) The impedance shall not change by more than (Refer to Maximum Impedance Change Chart 2).
21、No physical or mechanical damage shall be observed. -,-,- EIA-944 Page 8 Surface mount ferrite chip bead qualification specification 4.10 Flammability The encapsulating material, and/or any other material employed in ferrite bead manufacture, when applicable, shall be certified to meet the minimum f
22、lammability requirements of UL-94V-0 or V-1 and an oxygen index of 28% minimum as defined in ASTM-2863-91. The supplier must provide certificates of compliance to both tests upon request. When UL and Oxygen-Index testing are not feasible, the IEC “Needle-Flame“ test (IEC 60965-2-2), may be used. In
23、all cases, appropriate documentation must be maintained. 4.11 Solderability Ferrite chip beads shall be tested in accordance with ANSI/ J-STD-002 Test Method B. Steam aging for components to be tested shall be in accordance with Category 3 of ANSI/J-STD-002 for tin/lead (Sn Pb) only. a) All terminat
24、ions shall exhibit a continuous solder coating free from defects for a minimum of 90% of the critical area of any individual termination. Anomalies other than dewetting, non-wetting, and pin holes are not cause for rejection. b) If solderability problems are encountered using the dip and look test,
25、the wetting balance test shall be employed. c) There shall be no evidence of mechanical abnormalities. 4.12 Resistance to soldering heat Ferrite chip beads shall be tested in accordance with MIL-STD-202, Method 210, Test Condition B where applicable except: a) The impedance value shall not change by
26、 more than (Refer to Maximum Impedance Change Chart 2) from the initial value. The DCR shall not exceed the maximum specification value b) No physical or mechanical damage shall be observed. 4.13 Terminal strength Ferrite chip beads shall be tested in accordance with MIL-STD-202, Method 211, Test Co
27、ndition A where applicable except: 4.13.1 Hanging Test a) This test is not applicable for case sizes 0402 and smaller. b) Solder two metal leads to each chip bead under test using 60/40 Sn/Pb solder. c) Use the metal leads to subject the ferrite chip beads to a hanging weight of 1.0kg for case sizes
28、 larger than 0805, and 0.5kg for case sizes 0805 and smaller. d) The ferrite chip bead shall be able to sustain the hanging weight for a minimum of 30 seconds. e) No physical or mechanical damage shall be observed. OR -,-,- EIA-944 Surface mount ferrite chip bead qualification specification Page 9 4
29、.13.2 Shear Test a) The ferrite chip beads shall be mounted on a FR4 board by reflowing or wave soldering, using 60/40 Sn/Pb solder. b) Gradually apply a pushing force in a direction parallel to the chip width (at the device centerline) and maintain for a period of 60 5 seconds. c) Devices with a ca
30、se size larger than 0805 shall withstand a force of 1.0kg, while devices with case sizes 0805 and smaller shall withstand a force of 0.5kg. d) No physical or mechanical damage shall be observed. OR 4.13.3 Bending Test a) This requirement may be satisfied by Paragraph 4.9, herein. 5 Preconditioning T
31、his process is intended to simulate exposure to the thermal and cleaning environments of the assembly process before qualification testing. The component assembly process simulation requirements for different types of processes are described in IPC-9504 Assembly Process Simulation for Evaluation of
32、Non-IC Components. Ferrite chip beads shall be tested in accordance with IPC-9504, device classification 214. Soldering process compatibility level 6 (X6Z) shall be used if the component is intended for use on the bottom side of a board. -,-,- EIA Document Improvement Proposal If in the review or us
33、e of this document, a potential change is made evident for safety, health or technical reasons, please fill in the appropriate information below and mail or FAX to: Electronic Industries Alliance Technology Strategy & Standards Department Publications Office 2500 Wilson Blvd. Arlington, VA 22201 FAX
34、: (703) 907-7501 Document No. Document Title: Submitters Name: Telephone No.: FAX No.: e-mail: Address: Urgency of Change: Immediate: At next revision: Problem Area: a. Clause Number and/or Drawing: b. Recommended Changes: c. Reason/Rationale for Recommendation: Additional Remarks: Signature: Date: FOR EIA USE ONLY Responsible Committee: Chairman: Date comments forwarded to Committee Chairman: -,-,- -,-,-