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1、o O a ELECTRONIC INDUSTRIES ASSOCIATION a O O i ENGINEERING DEPARTMENT IC I w 0 ANSI/EIA-700AOAC-1996 Approved: June 19, 1996 EIA S P ECI F I CATI O N Detail Specification for 1.00 mm Pitch, 88 Circuit Dram Memory Card Interconnect System EIA-700AOAC 1 AUGUST 1996 the NECQ Svstem Copyright Electroni
2、c Components, Assemblies N=Number n L EIA Generic Specification Designator EIA Sectional Specification for Printed Circuit Board Connector Designator EIA Blank Detail Designator (use “Zero“ if no Blank Detail) EIA Detail Specification Designator Number of Contacts H=Host Connector (header); R=DRAM M
3、emory Card Connector (receptacle) Mounting Orientation and Termination Type (see Tables 4.1 and 4.2) Mounting Style (see Figures 4.2.1 through 4.2.8 and Figures 4.3.1 through 4.3.3) Voltage Polarization (see Figures 4.4.1 and 4.4.2) Finish on Contact Wipe Surfaces (see Table 4.5) Finish on Terminati
4、on Surfaces (see Table 4.6) Durability Level (see Par. 4.7) Copyright Electronic Components, Assemblies 147m/S(15G)peak Reference Figure 7.3.4 for mounting Mechanical Shock Conditions: EIA 364-27, Condition A 490 m/s2 (50G) acceleration, standard holding time 11 ms, semi-sine wave Reference Figure 7
5、.3.4 for mounting Types B +15 O C to +85 O C , Humidity; 95% maximum, Class 1.3 is further described as operating in a “harsh environmentai“ state, but with no manne atmosphere. Accordingly, the test groupings, sequences within each group, and the test procedures will follow the recommendations of A
6、NSIEIA 364, except where unique requirements of the Memory Card Interconnect System may call for tests which are not covered in ANSEIA 364, or where the requirements deviate substantially from those in that document. In those cases, test procedures of other recognized authorities, will be cited. Hos
7、t connectors (headers) and DRAM Memory Card receptacles shall pass all the following tests, in the groups, and sequences shown, and in the sample sizes shown. Testing may be done as follows: a) Host connector (header) and DRAM Memory Card receptacle only. In this case, for those test groups that req
8、uire it, the receptacle may be assembled to a test DRAM Memory Card PCB by the connector manufacturer or by a DRAM Memory Card manufacturer or by a PCB supplier. Host connector (header) only or DRAM Memory Card receptacle only. In this case, the other half shall be procured from a source, which has
9、successfully passed performance testing, according to this standard. For those test groups that require it, the receptacle may be assembled to a test DRAM Memory Card PCB by the connector manufacturer or by a DRAM Memory Card manufacturer or by a PCB supplier. b) Notes: 1) 2) All performance testing
10、 is to be done with test PCB as shown in Figure 7.0.1 and Figure 7.0.2. All resistance values shown in the following test groups are for connectors only, excluding the resistance attributed to the PCB When overall resistance measurements are taken which include the resistance attributed to the PCB,
11、the resistance of a unused PCB shall be measured, and that value shall be subtracted from the overall resistance value to provide the resistance through the interconnect system. All resistance readings shall be temperature compensated to 20 “C. The contact specimens shall be prepared with tools reco
12、mmended by the connector manufacturer 3) _ . Copyright Electronic Components, Assemblies ; I A I 39.2 N (8.8 Ib.) maximum I I nmatingforce I ANSIIEIA I 8.63 N (1.9 Ib) minimum ontv 364-1 3 39.2 N (8.8 Ib) maximum I wleveicontact I ANSIIEIA I 40 milliohms maximum, initial resistance 364-23 per contac
13、t pair. -55 C (-67 F) 96 hours Mount host connector rigidly. Rate: 25 mmmin (1 inimin) Visual and dimensional normal operation. No deviation I I AZYEIA I 39.2 N (8.8 Ib) maximum Copyright Electronic Components, Assemblies DRAM Memory Card Receptacle: 2 days Copyright Electronic Components, Assemblie
14、s & Materials Association Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/29/2007 02:09:27 MDTNo reproduction or networking permitted without license from IHS -,-,- EIA-7mAMC - DETAIL SPEUFICAl” E I A 7OOAOAC 9b 3234600 0577288 O42 Pige
15、2 1 1.m mm h h . 88 Circuit DRAM Memory Card Intemnnect Cvrtem Phase PH1 7.3.6 Test Group PH: Solderability Test Measurements to be Requirements Title ID No. Seventy or rile ID No. Performance Level Soldering ANSIIEIA 95% coverage performed conditions 36452 Number of sampies: O Pl O (21 Host connect
16、ors (headers), unassembled to PCB Host connectors (headers), assembled to PCB DRAM Memory Card Receptacles, unassembied to memory card PCB DRAM Memory Card Receptacles, assembled to memory card PCB 7 PI1 Table 7.10 Test Group PH: Solderability - PI3 PI4 - 7.3.7 Test Group PI: Resistance to Solder Pr
17、ocess Number of samples: Pl Pl O1 i 2 1 Host connectors (headers), unasembled to PCB Host connectors (headers), assembled to PCB DRAM Memory Card Receptacles, unassembled to memory card PCB DRAM Memory Card Receptacles, assembled to memory card PCB - Measurements to be perfomied Title ID No. Table 7
18、.1 1 Test Group PI: Resistance to Solder Process _ Requirements Performance Level Phase I D No. ANSIIEIA 36418 ANSIIEIA 364-56 ANSIIEIA -1 1 Seventy or Conditions Unmated connectors Procedures 3,4,8 5 PI2 Dimensional inspection per Figures 4.2.1 normal operations. No through deviation from overall 4
19、.2.7 dimensions. No defects that wuid impair Test Tlle Visual and dimensional inspect i on Resistance to solder heat Resistance to solvents Visual and dimensional inspection ANSIIEIA Unmated 36418 I connectors I Dimensional inspection 4.2.1 normal operations. No through deviation from overall Note:
20、Test group PI3 may be omitted by submitting instead a certification from the supplier of the plastic material, that the material used in the connector bodies will meet the requirements of test group P13. Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under licens
21、e with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/29/2007 02:09:27 MDTNo reproduction or networking permitted without license from IHS -,-,- IA 700AOAC 96 3234600 0577289 T89 IA-7AOAC - DETAIL SPECIFICATION 1 O0 mm Rah. O tircuit DRAM Msmory Card Inionionneci S - -22
22、 Test Group Test Phase Number of Connectors to be Tested A A l -4 12 PA PA1 - 2 8. Quality Assessment Procedures Qualification approval procedures shall be as prescribed in EIA E7000000. Performance level requirements are detailed in Table 8.1. Number of Defect Permitted O .o Table 8.1 Testing Requi
23、rements for Qualification Approval - PB PBl-8 2 O PC PC1-5 2 O PO PE PD1-5 4 O PE1 2 O PF PFl-7 2 PG PG1-12 2 PH PH1 2 PI PI14 2 O O O O NOTE: Total number of defectives permitted (sum of all groups). The qualification test report shall contain the certificate of attributes of surface treatment as s
24、pecified in EIA-5400000, 3.5. O 8.1 Primary Stage of Manufacture The primary stage of the interconnect system manufacture is defined as the finished host connector (header) or the DRAM Memory Card receptacle. The primary stage of manufacture and all subsequent processes shall be carried out under th
25、e direct surveillance of the manufacturers approved chief inspector and operated under statistical process control. on all functional product characteristics. as described in ANSIEIA-557, “Statistical Process Control System“ and ANSIEIA-557-1. “Guidance for the selection of critical manufacturing op
26、erations for use in implementing an SPC system for Passive components, AppendDc A l o . Functional product characteristics are defined as those product features that, if nonconforming to specihcation, will render the device inoperative. SPC must be carried out under the surveillance of a quality sys
27、tem conforming to the quality assurance model described in International Standard 9002, “Quality Systems - Model for Quality Assurance in Production and Installation“. 8.2 Structurally Similar Connectors Structurally similar connectors are connectors produced by the same manufacturer with essentiall
28、y the same design, materiais, processes, and methods. They are such that the results of a given test carried out on one type of these connectors can be recognized as being valid for other types of the group. They are separately idenable. Connectors having the same basic design, common contact sizes,
29、 and the same contact surface finish, are considered to be structurally similar components. They may be different in other features, such as number of contacts, overall size, mounting, etc., but must be produced by the same manufacturing processes and methods. Copyright Electronic Components, Assemb
30、lies & Materials Association Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/29/2007 02:09:27 MDTNo reproduction or networking permitted without license from IHS -,-,- E I A 7 O O A O A C Yb 3234b00 0577290 7T0 EIAJMAOAC - DETAIL SPECIFI
31、CATION 1 00 mm Pitch. B8 CircuB ORAM Memory C a r d Intereonnett Syrtem Title ID No. Page 23 I Defectives I Specimens 9. Quality Conformance Inspection 9.1 Lot by Lot Inspection Tests Lot by lot inspection requirements are specified in Table 9.1 (reference EIA E7000000). The sequence of tests is opt
32、ional unless otherwise specified. Al A2 Table 9.1 Lot by Lot Inspection Tests Al Visual and dimensional ANSIIEIA 5 O A2 Mating force ANSIIEIA 5 O inspection. 3641 8 3641 3 I Inspection I TestPhase I Testormeasurementtobeperformed I Numberof I Numberof I 81 82 83 I Group I PDl Low level contact resis
33、tance ANSIIEIA 5 O 36423 PD2 Dielectnc Withstanding ANSIIEIA 1 O Voltage 364-20 PD4 Insulation Resistance ANSIIEIA 1 O 364-21 Unmating force I I A3 I A3 ANSIIEIA 136413 5 IO1 I A4 I A4 I Misinsertion force I ANSIIEIA 1364-13 5 Copyright Electronic Components, Assemblies & Materials Association Provi
34、ded by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/29/2007 02:09:27 MDTNo reproduction or networking permitted without license from IHS -,-,- EIA-7OOAOAC - DETAIL SPECIFICATION E I A 7ORAOAC 96 3234600 0577293 637 Page 24 1 .o0 mm Pmh, 88 Circui
35、t DRAM Mmwy Cord Intermnnect System Inspection Group 9.2 Periodic Inspection Tests Test Phase Test o r measurement to be performed Number of Number of Specimens Defectives Title ID No. The periodic tests with single test phases (Inspection groups C1 and C2) shall be carried out on specimens that hav
36、e successfully passed the lot-by-lot tests (see Subclause 9.1). D1 D1 The periodic tests with complete test groups (Inspection groups D1 and D2) shall be carried out on specimens that have successfully passed tests PA1 to PA6 and that have been taken from lots which have already satisfied the lot-by
37、-lot tests (see Subclause 9.1). TaMes 9.2 and 9.3 specify the required testing for periodic inspection. A2 Mating force ANSIIEIA 5 O A3 Unmating force ANSIIEIA 5 O 364-1 3 364-1 3 Table 9.2 Periodic Inspection Tests D1 D1 Di D1 PDl Low level contact resistance ANSIIEIA 5 O 364-23 PD2 Dielectric With
38、standing ANSIIEIA 1 O v*ge 36420 A14 Test Group A PF1-7 Test Group PF 1 C1 I PH1 I Soldering D1 D1 I ANSIIEIA 364-52 PIO1 PG1-12 Test Group PG PD1 -5 Test Group PD I C2 1 PD1 I Lowlevelcontactresistance O I D1 1 A4 1 Misinsertion force 1364-13 AN SIIE IA l5Io Copyright Electronic Components, Assembl
39、ies & Materials Association Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/29/2007 02:09:27 MDTNo reproduction or networking permitted without license from IHS -,-,- EIA-7MAOAC . DETAIL SPECIFICATWN EIA 700AOAC 96 W 3234600 0577292 573
40、m Page 25 1 00 mm ntch. 88 Circuit DRAM Memary Card Intsrmnmct System - _ _ _ inspection Test Phase Test or measurement to be performed Number of Number of Group Specimens Defectives Title ID No. I TaMe 9.3 Periodic Inspection Tests D2 A4 Misinsertion force ANSIIEIA 1 O 364-1 3 1 D2 I A2 I Matingfor
41、ce 7 1 D2 1 A3 I Unmatingforce Test Phase ANSIIEIA 1-13 Test or measurement to be performed Titie ID No. ANSIIEIA 1-13 1 1 OI 1 D2 I PD2 I DielectricWithstanding ANSIIEIA Volage 1 OI 9.3 Delayed Delivery, Re-Inspection Any connectors stored for a period of more than 6 months after the release of the
42、 lot shall be tested prior to delivery according to the following table. Once a lot has been satisfactorily re-inspected the quality is assessed for a further 6 months. Table 9.4 Delayed Delivery, Re-Inspection Tests Inspection Group A l C1 Visual and dimensional ANSIIEIA inspection. Soldering ANSII
43、EIA 36452 Number of Specimens Number of Defectives Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/29/2007 02:09:27 MDTNo reproduction or networking permitted without li
44、cense from IHS -,-,- E I A 7OOAOAC 96 3234600 0577293 40T EIA.7OAOAC - DETAIL SPECIFICATION 1 00 mm Rtch, 88 CinuR DRAM Mamory Card Intenonneci System 1 O. Ordering Information For ordering connectors according to this detail specification, the styie designation described in Clause 2 chail be U d .
45、Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/29/2007 02:09:27 MDTNo reproduction or networking permitted without license from IHS -,-,- Page 27 THROUGH HOLE Table 4.1
46、 Host Connector (Header) Styles and Mounting Information SURFACE MOUNT SURFACE MOUNT SINGLE ROW DUAL ROW I DENT IF I CAT I ON I NUMBER I 4 I PCB MOUNTING INFORMATION I IDENTIFICATION LETTER MOUNTING ORIENTATION RIW mLsiwm mmitiiiw B Flgure 4.2.3 Flgure 4.2.4 Flgure 4.2.3 Flgure 4.2.4 N/A NIA C Flgur
47、e 4.2.5 Figure 4.2.6 Flgure 4.2.5 Flgure 4.2.6 NIA Flgure 4.2.8 Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/29/2007 02:09:27 MDTNo reproduction or networking permitt
48、ed without license from IHS -,-,- EIA=MOMAC -DETAIL SPECIFICATION E I A 700AOAC 96 3234600 0577295 282 WP 28 1.00 rnm Pitch. 88 circuit DRAM Memory Card Intemmct System Table 4.2 DRAM Memory Card Receptacle Styles and Mounting Information PCB MOUNTING CONFIGURATION SURFACE MOUNT MOUNTING ORIENTATION SIIQE SIDL leo m - - - # -a Figure 4.3.3 SINGLE SIDC SBIGLE R o w 3 Flgure 4.3.3 S I I U E SIDL SIW(LE ROI Copyright Electronic Components, Ass