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1、- . I EIA 540A000-A 90 m 3234600 0074359 8 m F . % - U I 9 O O U O I w - s. ANSI/EIA-64OAOOO-A-l990 . . . APPROVED: May 4, 1990 EIA STANDARD Sectional Specification for Sockets for Chip Carriers for Use in Electronic Equipment EIA-540A000-A ( Revision of EIA- 54 O A O 00) AUGUST 1990 ELECTRONIC INDU
2、STRIES ASSOCIATION ENGINEERING DEPARTMENT Copyright Electronic Components, Assemblies for example, by an asterisk. Copyright Electronic Components, Assemblies 1 cycle constitutes moving one direction in the same plane from the original position and then returning to the original position. Porosity (
3、When Specified) Porosity testing shall be performed on individual contacts. When tested, the corrosion count shall not exceed the value specified. This test applies only to contacts with gold finishes . Examination of Dimension and Mass Sockets shall be examined to verify that the dimensions and mas
4、s are in accordance with the Detail Specification. Visual Examination Sockets shall be examined to verify that the marking and workmanship are in accordance with the related Specification. Solder Wicking When tested there shall be no evidence of mechanical failure o of the contacts or solder wicking
5、 up the terminal to a point of reducing contact deflection. The Classification shall be as specified in the Detail Specification. YI Copyright Electronic Components, Assemblies MO-O82 and MO-084. LEADLESS CERAMIC CHIP CARRIER (LCCC): A rectangular or square package with conductors extending to each
6、side of the package. The conductors are metal pad surfaces deposited on the ceramic housing. The chip is hermetically sealed in a cavity by a metal or ceramic lid. Reference: JEDEC/EIA Publication 95; MS-002 through MS-009, MO-041, MO-O42 and MO-062. PLASTIC LEADED CHIP CARRIER (PLCC): A rectangular
7、 or square package with leads extending from each side of the package. The conductors of the package are typically a stamped lead frame that are formed into .a “J“ configuration to terminate to a printed circuit board. The chip is encapsulated in plastic and the leads are formed under the plastic. R
8、eference: JEDEC/EIA Publication 95;MO-047 and MO-052. PLASTIC QUAD FLAT PACK (PQFP): A square package with leads extending from each side of the package. The conductors of the package are typically a stamped lead frame that are formed into a “gull wing“ configuration to terminate to a printed circui
9、t board. The chip is encapsulated in plastic and protective bosses or bumpers are formed in the corners to protect the leads from damage. Reference: JEDEC/EIA Publication 95; MO-069, MO-O86 and MO-089. Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license
10、with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/30/2007 01:41:06 MDTNo reproduction or networking permitted without license from IHS -,-,- E I A 540A000-A 90 m 3234b00 0074374 4 m z NO. OF SOCKETS C PERFORMANCE NO. OF SEQUENCE TEST NO. CONTACTS DESCR I PTION EIA TABL
11、E I SEQUENTIAL QUALIFICATION APPROVAL INSPECTION TESTS O EIA-540A000-A Page 12 GROUP I 4 SAMPLES(See Note 2) PERFORMANCE NO. OF NO. O F SEQUENCE SOCKETS CONTACTS DESCRIPTION TEST NO. EIA ALL * NO. O F SOCKETS 4 4 4 4 4 4 ALL ALT. CONT. ALL ALT. CONT. * PERFORMANCE TEST SET-UP NO. OF SEQUENCE TEST NO
12、. CONTACTS DESCRIPTION EIA DEVICE PCB ALL VISUAL 364-1 8 EMPTY UNMOUNTED * LOW LEVEL CONTACT RESISTANCE 364-23 PACKAGE MOUNTED ALL THERMAL SHOCK 364-32 PACKAGE MOUNTED * LOW LEVEL CONTACT RESISTANCE 364-23 PACKAGE MOUNTED ALL HUMIDITY 364-31 PACKAGE MOUNTED * L O W LEVEL CONTACT RESISTANCE 364-23 PA
13、CKAGE MOUNTED I ALL PERFORMANCE NO. OF NO. O F SEQUENCE TEST NO. SOCKETS CONTACTS DESCRIPTION EIA 2 ALL V I SUAL 364-1 8 2 ALL INSULATION RESISTANCE 364-21 2 ALL DIELECTRIC WITHSTANDING VOLTAGE 364-20 2 ALL THERMAL SHOCK 364-32 2 ALL HUMIDITY 364-31 2 ALL INSULATION RES I STANCE 364-21 2 ALL DIELECT
14、RIC WITHSTANDING VOLTAGE 364-20 V I SU AL INSULATION RESISTANCE DIELECTRIC GIITHSTANDING VOLTAGE LOW LEVEL CONTACT RESISTANCE MECHANICAL SHOCK CONTINUITY VIBRATION CONTINUITY L O W LEVEL CONTACT RESISTANCE DIELECTRIC WITHSTANDING VOLTAGE TEST SET-UP DEVICE PCB EMPTY UNMOUNTED EMPTY UNMOUNTED EMPTY U
15、NMOUNTED EMPTY UNMOUNTED EMPTY UNMOUNTED EMPTY UNMOUNTED EMPTY UNMOUNTED 364-1 8 364-21 364-20 364-23 364-27 364-46 364-28 364-46 364-23 364-20 PERFORMANCE TEST SET-UP NO. OF NO. OF SEQUENCE TEST NO. -SOCKETS CONTACTS DESCRIPTION EIA DEVICE PCB 2 ALL VISUAL 364-1 8 EMPTY UNMOUNTED 5 EACH TERMINAL ST
16、RENGTH 364-62 DESTRUCTIVE DESTRUCTIVE 2 2 5 EACH CONTACT RETENTION 364-29 DESTRUCTIVE DESTRUCTIVE 2 10 EACH POROSITY 364-53 DESTRUCTIVE DESTRUCTIVE I TEST SET-UP EMPTY UNMOUNTED EMPTY MOUNTED EMPTY MOUNTED PACKAGE MOUNTED MOUNTED 4 4 4 4 4 4 4 4 4 4 4 ALL 2 EA ALL ALL ALL ALL ALL * * * * VISUAL CAPA
17、CITANCE LOW LEVEL CONTACT RESISTANCE MATING MECHANICAL OPERATION MATING LOW LEVEL CONTACT RESISTANCE TEMPERATURE LIFE LOW LEVEL CONTACT RESISTANCE GAS TIGHT LOW LEVEL CONTACT RESISTANCE 364-18 364-30 364-23 364-1 3 364-09 364-1 3 364-23 364-1 7 364-23 364-36 364-23 TEST SET-UP DEVICE EMPTY EMPTY PAC
18、KAGE MAX GAUGE MAX GAUGE MAX GAUGE PACKAGE PACKAGE PACKAGE PACKAGE PACKAGE PC8 UNMOUNTED UNMOUNTED MOUNTED MUNTED MOUNTED MUNTED MOUNTED MOUNTED MOUNTED MOUNTED MOUNTED Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=IHS Employees/1
19、111111001, User=Wing, Bernie Not for Resale, 03/30/2007 01:41:06 MDTNo reproduction or networking permitted without license from IHS -,-,- EIA 540A000-A 90 m 3234b00 0074375 b m 2 2 2 TABLE I (CONTINUED) - ALL v I SUN. 364-1 8 EMPTY U “ T E D ALL RESISTME TO SOLDERIHG HEAT 364-56 EMPTY MOUNTED 10 EA
20、CH SOLDERABILITY 364-52 DESTRUCTIVE DESTRUCTIVE EIA- 540A00 -A Tage 13 NO. O F Ifo. O f - SOCKETS CONTACTS 2 ALL 2 5 EACH SEOUENTIAL QUALIFICATION APPROVAL INSPECTION TESTS PERFORME TEST SET-UP SEQUENCE TEST NO. DESCRIPTION EIA VISUAL 364-1 8 EMPTY UNMUNTED W O R W FORCE 364-04 EMPTY 1 MOUNTED1 DEST
21、RUCTIVE DESTRUCTIVE PCB - DEVICE - GROUP V I 2 SAIIPtES I I PERFORHAME I I TEST SET-UP I 2 ALL VISUAL 2 ALL SOiDER WICKIWG 364-18 EMPTY UWUNTED 364-71 EPTY WNTED GROUP V I 1 2 SAHPtES INSPECTION TEST PHASE CHARACTERISTICS PERFORMANCE BASIC TEST SEVERITY AQL TO BE REQUIREMENT METHOD AND OR (X DEFECTI
22、VE) MEASURED PARAGRAPH TEST NUMBER CONDITION MAJOR MINOR PERFORME SEQUENCE DESCRI PT ION TEST SET-UP DEVICE TEST NO. I EIA NOTES : 1. Indlcates that 15 Indlvldual contacts or 2oX of total 2 . contacts shall be used, whlchever Is greater. O f the 4 sanplts In Group I, 2 to be wired for contact resist
23、ance testlng and 2 to be wired for continuity testing. TABLE 2 LOT-BY-LOT INSPECTION TESTS G R O U P I 1 _ VISUAL EXAMINATION - I1 - I MATING FORCE 4 . 2 . 2 1 CONTACT RESISTANCE (LOW LEVEL) I 4 . 3 . 3 . - Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/30/2007 01:41:06 MDTNo reproduction or networking permitted without license from IHS -,-,-