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1、ANSIIEIA-654-2000 Approved: August 16,2000 EIA STANDARD Resistance to Soldering Heat Test Procedure for Wire and Electrical Components EIA-654 AUGUST 2000 ELECTRONIC COMPONENTS, ASSEMBLIES & MATERIALS ASSOCIATION THE ELECTRONIC COMPONENT SECTOR OF THE ELECTRONIC INDUSTRIES ALLIANCE Copyright Electro
2、nic Industries Alliance Provided by IHS under license with EIALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/30/2007 21:42:04 MDTNo reproduction or networking permitted without license from IHS -,-,- NOTICE EL4 Engineering Standards and Publications are designed to serve the
3、 public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need. Existence of such Standards
4、and Publications shall not in any respect preclude any member or nonmember of EL4 fiom manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude their voluntary use by those other than EIA members, whether
5、 the standard is to be used either domestically or internationally. Standards and Publications are adopted by EIA in accordance with the American National Standards Institute (ANSI) patent policy. By such action, EL4 does not assume any liability to any patent owner, nor does it assume any obligatio
6、n whatever to parties adopting the Standard or Publication. This EIA Standard is considered to have International Standardization implication, but the International Electrotechnical Commission activity has not progressed to the point where a valid comparison between the EIA Standard and the IEC docu
7、ment can be made. This Standard does not purport to address all safety problems associated with its use or all applicable regulatory requirements. It is the responsibility of the user of this Standard to establish appropriate safety and health practices and to determine the applicability of regulato
8、ry limitations before its use. (From Standards Proposal No. 2272-C, formulated under the cognizance of the Soldering Technology Committee (STC).) Published by ELECTRONIC INDUSTRIES ALLIANCE 2000 Technology Strategy & Standards Department 2500 Wilson Boulevard Arlington, VA 2220 1 PRICE: Please refer
9、 to the current Catalog of EIA Electronic Industries Alliance Standards and Engineering Publications or call Global Engineering Documents, USA and Canada (1-800-854-7179) International (303-397-7956) All rights reserved Printed in U.S.A. Copyright Electronic Industries Alliance Provided by IHS under
10、 license with EIALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/30/2007 21:42:04 MDTNo reproduction or networking permitted without license from IHS -,-,- Copyright Electronic Industries Alliance Provided by IHS under license with EIALicensee=IHS Employees/1111111001, User=W
11、ing, Bernie Not for Resale, 03/30/2007 21:42:04 MDTNo reproduction or networking permitted without license from IHS -,-,- Page Foreword iii Clause 1 2 3 4 5 6 7 Annex A Table 1 Figure 1 Purpose Apparatus Materials Test procedures Examination and measurement Details to be specified Documentation IRR
12、equipment Solder test procedures Placement of wire leads 7 8 9 i Copyright Electronic Industries Alliance Provided by IHS under license with EIALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/30/2007 21:42:04 MDTNo reproduction or networking permitted without license from IHS
13、 -,-,- Copyright Electronic Industries Alliance Provided by IHS under license with EIALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/30/2007 21:42:04 MDTNo reproduction or networking permitted without license from IHS -,-,- Foreword The Soldering Technology Committee (STC) o
14、f the Electronic Components, Assemblies & Materials Association, the electronic component sector of Electronic Industries Alliance prepared this specification. Copyright Electronic Industries Alliance Provided by IHS under license with EIALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for
15、Resale, 03/30/2007 21:42:04 MDTNo reproduction or networking permitted without license from IHS -,-,- iv Copyright Electronic Industries Alliance Provided by IHS under license with EIALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/30/2007 21:42:04 MDTNo reproduction or netwo
16、rking permitted without license from IHS -,-,- EIA-654 Page 1 1 Purpose These tests are performed to determine whether wire and other component parts can withstand the effects of the heating and/or environment to which they will be subjected during the soldering of their terminations by soldering ir
17、on, solder dip, solder wave, or other soldering techniques. The solder dip method is used as a reasonably close simulation of conditions encountered in wave soldering in regard to radiated and conducted heat. The heat and/or environment of soldering may affect the parametric and/or physical characte
18、ristics of the component part. 2 Apparatus 2.1 Solder pot A static solder pot, of sufficient size to accommodate the mounting board and to immerse the termination to the depth specified for the solder dip without touching the bottom of the pot, shall be used. This apparatus shall be capable of maint
19、aining the solder at the temperature specified. The solder bath temperature shall be measured in the center of the pot at a depth of at least 12.7 mm (0.50 in), but no deeper then 25.4 mm (1 .O0 in) below the surface of the solder. The solder shall be dedrossed immediately before each test. 2.2 Heat
20、 sinks or shielding The use of heat sinks or shielding is prohibited except when it is part of the component. When applicable, heat sinks or shielding shall be specified in the Detail Specification, including all of the details such as materials, dimensions, method of attachment, and location of the
21、 necessary protection. 2.3 Fixtures Fixtures, when required, shall be made of a nonsolderable material designed in such a way that they will make minimum contact (e.g., minimum heat sink) with the component. Further, they shall not place undue stress on the component when fixtured. 2.4 Mounting boar
22、d A mounting board, in accordance with IPC-4101, IPC-4110, IPC-4130, or MlL-I-24768/2 and /3, Insulation, plastic, laminated, thermosetting, glass-cloth, epoxy-resin (e.g., 3 x 3, 1 x 9, etc.) minimum area, (1 5 7 f 0.19) mm (0.062 f 0.007) in thick, shall be used unless otherwise specified. For thr
23、ough-hole applications the terminal hole size shall be such that diametrical clearance between the hole and component terminals shall not exceed 0.38 mm (0.015 in) unless otherwise specified. In the event plated- through holes are specified in the detail specification, said holes shall be in accorda
24、nce with IPC-6012, MIL-P-55110, or equivalent. Surface mount boards shall have pads of sufficient size and number to accommodate the component being tested per latest revision of IPC-SM-782/EIA PDP-100. In lieu of a mounting board, a ceramic substrate, e.g., 0.89 mm (0.035 in) thick may be used. 2.5
25、 Solder iron A solder iron rated for 25 watts and capable of maintaining a temperature of (350 f IO) O C shall be used. Copyright Electronic Industries Alliance Provided by IHS under license with EIALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/30/2007 21:42:04 MDTNo reprod
26、uction or networking permitted without license from IHS -,-,- E IA-654 Page 2 2.6 Reflow chambers The reflow chambers or equivalent vapor phase reflow (VPR) chamber, infrared/convection reflow (IRR) oven, air circulating oven, etc. shall be of sufficient size to accommodate the components to be eval
27、uated. They shall be capable of generating the specified heating rate, temperatures and environments. See annex A. 2.7 Temperature measurement Low-mass thermocouples that do not affect the heating rate of the sample shall be used. A temperature- recording device is advisable. The equipment shall be
28、capable of maintaining an accuracy of f 1 O C at the temperature range of interest. 3 Materials 3.1 Solder Unless otherwise specified, the solder or solder paste shall be a tin-lead alloy with a nominal tin content of 50 % to 70 % per ANSI J/STD-005, -006. Other solders can be used so long as they a
29、re molten at the specified temperature and are designated in the Detail Specification. 3.2 Flux If used, the type of flux to be applied shall be specified in the Detail Specification. 3.3 VPR fluid A perfluorocarbon fluid that has a boiling point of 215 O C -265 O C shall be used. 4 Test procedures
30、4.1 Procedures The test technique and category shall be selected based on the component type and application (application shall be agreed upon between vender and user), unless specifically stated in the Detail Specification. There are six types of solder techniques covered by these procedures. The p
31、rocedures are outlined in table 1. 1) Solder iron-solder cup, hand soldering, through-hole components, tab and post terminations, solder eyelet terminations 2) Solder dip-practice of hot solder dipping (tinning) of leaded components 3) Wave solder simulation-topside board mount product 4) Wave solde
32、r simulation-bottomside board mount product 5) VPR-VPR environment without preheat 6) IRR-I RR, natural convection and forced air convection reflow environments Copyright Electronic Industries Alliance Provided by IHS under license with EIALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for
33、 Resale, 03/30/2007 21:42:04 MDTNo reproduction or networking permitted without license from IHS -,-,- EIA-654 Page 3 4.1.1 Technique 1 : solder iron a) When testing a solder cup, tab and post termination or solder eyelet termination, the applicable wire size properly prepared for the solder termina
34、tion shall be attached in the appropriate manner. When testing a board mount component, the component shall be placed in a suitable board per 2.4 b) If flux is to be used, the test assemblies shall be fluxed per 3.2 c) A solder iron per 2.5 shall be used. When required, due to the termination size b
35、eing evaluated, the appropriate solder iron wattage shall be specified in the Detail Specification. d) The soldering iron shall be heated to a temperature of (350 f IO) O C and shall be applied to the termination for a time duration of 4 s-5 s after the solder has become molten. See test category A
36、in table 1. For surface mount components the iron shall be placed only on the circuit board pad. e) The solder iron and solder shall be applied to the area of the assembly designated in the Detail Specification. In the absence of such a designation the solder and iron shall be applied to the area of
37、 the assembly closest to the component body that the product is likely to experience. f) Remove the iron and allow the specimens to cool and stabilize at room ambient conditions. If flux was used the specimen shall be cleaned using an appropriate cleaning solution. g) The test specimens shall be exa
38、mined per clause 5. 4.1.2 Technique 2 : solder dip a) Place specimen in appropriate fixture per 2.3 b) Special preparation of specimen: Any special preparation of specimens prior to testing shall be as specified in the Detail Specification. This could include specific instructions such as bending or
39、 any other relocation of terminations, cleaning or attachment of heat sinks prior to the solder dip. c) If flux is to be used, the leads shall be fluxed per 3.2 d) Test category B in table 1, detailing time, temperature and immersion speed, shall be used unless otherwise designated in the Detail Spe
40、cification. e) The terminations shall be immersed to the depth designated by the Detail Specification. They shall remain immersed for the time specified in 4.1.2d. In the absence of such a designation the terminations shall be immersed to within 1.27 mm (0.050 in) of the component body. Terminations
41、 shall be immersed simultaneously, if the geometry of the component permits. f) After the dip, the specimens shall be allowed to cool and stabilize at room ambient conditions. If flux was used the specimen shall be cleaned using an appropriate cleaning solution. g) The test specimens shall be examin
42、ed per clause 5. Copyright Electronic Industries Alliance Provided by IHS under license with EIALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/30/2007 21:42:04 MDTNo reproduction or networking permitted without license from IHS -,-,- E IA-654 Page 4 4.1.3 Technique 3: wave s
43、older simulation - topside board mount product a) The test specimens shall be mounted on a printed circuit board (PCB) with terminals seated in the termination holes as specified in the Detailed Specification. The PCB shall be as described in 2.4. - Wire leads: Wire leads shall be brought through th
44、e board holes and bent at least 30“ from a line perpendicular to the board. Leads shall extend from 1.27 mm to 2.54 mm (0.050 in to 0.100 in) from the bottom of the board. Axial leads shall be bent at a 90“ angle at a point between 1.5 mm-2.0 mm (0.06 in-0.08 in) from the body, eyelet fillet or weld
45、s unless otherwise specified as shown in figure 1. - Pin leads: where the component is designed with rigid pin leads, the full length of the termination shall be retained. b) Special preparation of specimen: Any special preparation of specimens prior to testing shall be as specified in the Detail Sp
46、ecification. This could include specific instructions such as bending or any other relocation of terminations, cleaning or attachment of heat sinks prior to the solder immersion. c) If flux is to be used, the leads shall be fluxed per 3.2 d) Test category C in table 1, detailing time, temperature, a
47、nd immersion speed, shall be used unless otherwise designated in the Detail Specification. e) The test specimens mounted on the PCB shall be immersed in the solder pot so that the bottom of the board “floats“ on the solder. They shall remain immersed for the time specified in 4.1.3d. f) After the fl
48、oat, the specimens shall be allowed to cool and stabilize at room ambient conditions. If flux was used the specimen shall be cleaned using an appropriate cleaning solution. g) The test specimens shall be examined per clause 5. 4.1.4 Technique 4: wave solder simulation - bottomside board mount product a) Place specimen in appropriate sample fixture per 2.3. b) Special preparation of specimen: Any special preparation of specimens prior to testing shall