《EIA-886-2001.pdf》由会员分享，可在线阅读，更多相关《EIA-886-2001.pdf（20页珍藏版）》请在三一文库上搜索。
1、EIA STANDARD Thick Film Resistor Array Specification EIA-886 APRIL 2001 ELECTRONIC COMPONENTS, ASSEMBLIES it specifies 1 hour at -55 C followed by 45 minutes of rated continuous voltage applied while maintaining the same temperature. 3.3.6High temperature exposure High temperature exposure shall be
2、tested in accordance with 4.8.7 of MIL-PRF-55342; it specifies 100 hours at +150 C. 3.3.7Short time overload Short time overload is tested in accordance with 4.8.6 of MIL-PRF-55342; it specifies 2.5 times rated continuous working voltage shall be applied for 5 seconds but not exceeding twice the max
3、imum voltage. 3.3.8Moisture resistance Moisture resistance is tested in accordance with MIL-STD-202 method 106 which specifies 10 cycles for 240 hours. 3.3.9Life Life is tested in accordance with MIL-STD-202 method 108 which specifies at 70 C 10 cycles for 250 hours. 3.3.10Temperature cycling Temper
4、ature cycling is tested - 30 minutes at -55 C; 15 minutes at +25 C; 30 minutes at +125 C; 15 minutes at +25 C for 5 cycles 3.3.11Post environmental & mechanical conditioning The devices that require electrical testing after environmental and mechanical stress may be allowed to remain at room tempera
5、ture for a period up to 24 hours prior to electrical testing. 3.3.12Acceptance criteria for environmental & mechanical tests The devices shall meet all specifications herein and there shall be no evidence of mechanical damage or corrosion 4 Quality Assurance Provisions Parts shall be inspected to as
6、sure compliance to the requirements of this specification. EIA-886 Thick film resistor array specification Page 4 5 Packaging The devices should be packaged in tape and reel. The tape and reel shall meet the latest version of EIA standard (EIA-481). The size of the reel shall be 178 mm, 254 mm, or 3
7、30 mm (7 in, 10 in, or 13 in). The tape and reel should be placed in a pizza-style box or sleeve and its material should comply with the EIA Packaging Material Standards for ESD Sensitive Items (EIA-541). The outside of the pizza-style box or sleeve should be bar-coded in accordance with the latest
8、version of EIA standard (EIA-556). SIZE CODELWdCt 0603x2 0402x2 0.026 (0.65) 0805x2 0805x8 1206x4 a (ref.) inch (mm) 0.062+0.008 (1.6) 0.006+0.004 (0.15+0.1) 0.012+0.008 (0.3+0.2) 0.012 (0.33) 0.020 (0.5) 0.252 +0.008 (6.4+0.2) 0.063 +0.008 (1.6+0.2) 0.016+0.006 (0.4+0.15) 0.014+0.004 (0.35+0.1) 0.0
9、06 (0.15) 0.1+0.008 (2.54) 0.2 +0.008 (5.08+0.2) 0.4 +0.008 (10.16+0.2) 0.079+0.008 (2.0+0.2) 0.016+0.012 (0.4+0.3) 0.024+0.004 (0.6+0.1) 0.1 +0.008 (2.54) 0.2+0.008 (5.08+0.2) 0.020+0.012 (0.5+0.3) 0.022+0.006 (0.55+0.15) 0.031 (0.8) 0.177 +0.008 (10.16+0.2) 0.126+0.008 (3.2+0.2) 0.126+0.008 (3.2+0
10、.2) 0.31 (0.8) max. 0.050 (1.27) 0603x4 0603x8 0805x4 1206x2 1206x8 0.039+0.004 (1.0+0.1) b (ref.) p (ref.) 0402x4 0.079+0.004 (2.0+0.2) 0.013 (0.33) 0.017 (0.17) 0.039+0.004 (1.0+0.1) 0.020 (0.5) p L b a W C d t L p b a W C d t Convex Terminations w/ Square Corners Concave Terminations w/ Square Co
11、rners a W C d t p L ? ? b ? ? ? ? ? ? ? ? ? ? ? ? ? ? Convex Terminations w/ Scallopped corners b a W C d t Term. 6 Indicator Term. 1 Indicator p L EIA-886 Thick film resistor array specification Page 5 Figure 1Dimensions Concave terminations with square corners Convex terminations with scalloped co
12、rners Convex terminations with square corners Figure 2Termination configurations ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? SIZE CODELWdCt 0.252+0.008 (6.4+0.2) 0.05 (1.27) a (ref.) inch (mm) 0.014+0.006 (0.35+0.15) 0.022+0.006 (0.55+0.15) 0.024 (0.6) 0.024+0.004 (0.6+0.1) 0.006 (0.15) 2512 Bussed 0.122+0.008
13、(3.1+0.2) b (ref.) p (ref.) EIA-886 Thick film resistor array specification Page 6 Figure 3Solder Pad Figure Dimensions D D BWA L C E Solder Mast Soldering Pad Chip Component TYPESTYLE DIMENSIONS - mm COMPONENT SIZE LW ABCDE 0402x2 0402x4 0603xn 0805xn 1206xn 1.0 2.0 0.8 X n 1.27 X n 6.42512 Bussed
14、Arrays 1.0 1.0 1.6 2.0 3.2 3.1 0.5 0.5 0.8 1.0 2.2 2.1 1.5 1.5 2.6 3.0 4.2 4.1 0.3 0.3 0.4 0.65 0.65 0.5 0.25 0.25 0.5 0.5 0.5 0.5 0.67 0.50 0.8 1.27 1.27 1.27 EIA-886 Thick film resistor array specification Page 7 Isolated Bussed Zero ohm jumper Figure 4Available circuits R1 R2Rn R1=R2= . =Rn (n =
15、2,4 or 8) 12345 9876 Circuit 1 10 987610 12345 Circuit 2 EIA Document Improvement Proposal If in the review or use of this document, a potential change is made evident for safety, health or technical reasons, please fill in the appropriate information below and mail or FAX to: Electronic Industries
16、Alliance Technology Strategy & Standards Department Publications Office 2500 Wilson Blvd. Arlington, VA 22201 FAX: (703) 907-7501 Document No.Document Title: Submitters Name:Telephone No.: FAX No.: e-mail: Address: Urgency of Change: Immediate:At next revision: Problem Area: a. Clause Number and/or Drawing: b. Recommended Changes: c. Reason/Rationale for Recommendation: Additional Remarks: Signature:Date: FOR EIA USE ONLY Responsible Committee: Chairman: Date comments forwarded to Committee Chairman: