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1、EIA S 4 O A A O O 91 3234600 0078293 2 O O 4 a O t v) I a w EIA ANSI/ EIA- 54 O AA O 0-19 9 1 APPROVED: October 11, 1991 S P ECI FI CATI ON Blank Detail Specification for Chip Carrier Sockets for Leadless Type A, B or D Chip Carriers for Use in Electronic Equipment EIA-540AAOO OCTOBER 1991 ELECTRONI
2、C IN DUSTRI ES ASSOCIATION ENGINEERING DEPARTMENT Copyright Electronic Components, Assemblies fill in test conditions and requirements as noted. Copyright Electronic Components, Assemblies 0 . 7 6 micron (30 p“) min. Gold over 1 . 2 7 microns (50 p“) min. to 3 . 8 1 microns (150 p“) max. Nickel. Cop
3、yright Electronic Components, Assemblies 0.76 micron (30 p“) min. Gold over 1.27 microns (50 p“) min. to 3.81 microns (150 p“) ma. Nickel. 90/10 tin lead 3 microns (118 p“) nominal over 1.27 microns (50 p“) to 3.81 microns (150 1.1 I) Copper or Nickel. 2.2.10 THICKNESS OF PRINTED WIRING BOARD (12) 2
4、.3 2.4 2.5 (13) 2.6 The nominal thickness of the Printed Wiring Board that the socket will be mounted on shall be designated by one digit as follows: O: not applicable (Surface Mount Patterns) 1: 1.57 mm (.062“) 2: 2.36 mm (.093“) 3: 3.18 mm (.125“) 4: 3.81 mm (.150“) 5: 4.57 mm (.180“) ORDERING INF
5、ORMATION A complete and interchangeable Chip Carrier Socket may be ordered using the EIA Part Number. CERTIFTED RECORDS OF RELEASED LOTS The requirements for certified records of released lots is not applicable. DIMENSIONS The configuration of the Chip Carrier Socket is optional within the limits of
6、 the specified dimensions. The general dimensions shall comply with Figure 2, the terminal dimensions with Figure 3, and the mounting dimensions with Figure 4. I N S U T O R MATERIAL Insulator material shall be thermoplastic and meet the flammability requirement of UL 94v-o. Copyright Electronic Com
7、ponents, Assemblies ty Temperature L i fe Thermo L Shock Gas Tight Solder Wicking PROCEDURE E I A - 364-52 364-56 Proc 3 364-56 Proc 4 364-31 Method - 364-17 Test Cond- M e thod - 364-32 Test Cond - - CycLes 364-36 Method 364-71 CLOSS REQUIREMENT 95% Coverage No Domage CUove Solder) No Damage (Vapor
8、 Phase) C - hours a t -*Cl c -C to - C l Meet Con tact Res i s t c n e Test No Damage Seconds in Wave) c- NOTES 2 2 2 2 NOTES 7 . This test procedure i s more severe than the specified procedure in the Sectional Spec1 Pication 2. For subsequent tests see TabLe I o f the Sectional Specification 3. Th
9、is TabLe i s provided t o complete the requirements as defined in the Sect i onoL Spec I f i cot i on Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/30/2007 00:04:03 MD
10、TNo reproduction or networking permitted without license from IHS -,-,- E I A 540AA00 91 3234600 0078333 4 EIA STANDARD AND SPEClFlCAllON NUMBERING Standard or Generic Specification Standard PrefUc for all Numbers Sectional Specification Designator Blank Detail Specification Designator TT STANDARD A
11、 document that establishes engineering and technical requirements for processes, procedures, practices and methods that have been decreed by authority or adopted by consensus. Standards may also be established for selection, application and design criteria for material. Standards and other documents
12、 not in the specification format use only the EIA basic numbering system as follows: EIA-123 Original Standard - EIA-123-1 Addendum to Original Standard EIA-123-A First Revision of original Standard incorporating all Addenda SPECIFICATION A document prepared specifically to facilitate procurement wh
13、ich clearly and accurately describes the essential technical requirements for purchased material. Procedures necessary to determine that the requirements for the purchased material covered by the specification have been met shall also be referenced or included. EIA Specifications use the following s
14、ystem: Detail Specification Designator EIA 123oooO EIA 123AOOO EIA 123AAOO EIA 123AAAA is a Generic Specification is a Sectional Specification is a Blank Detail Specification is a Detail Specification A - EIA 123OOAA is a Detail Specification for which no Sectional or. Blank Detail Specification was
15、 issued. NOTES: 1. Some older specifications may not have been converted to this numbering system. 2. See EP-11 “Guide for the Preparation of Specification Using IECQ-System Format,“ for more detail. Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/30/2007 00:04:03 MDTNo reproduction or networking permitted without license from IHS -,-,-