ECA-EIA-540HA00-2000.pdf

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1、EIA SPECIFICATION Blank Detail Specification for Burn-in Sockets Used with Ball Grid Array Devices for Use in Electronic Equipment EIA-540HA00 MAY 2000 ELECTRONIC COMPONENTS, ASSEMBLIES 15 G peak Visual examination18 100 mAContinuity46 AP420 mV 100 mA LLCR23 EIA TESTREQUIREMENTS TEST PHASE TITLEEIA

2、364 No. SEVERITY OR CONDITION OF TEST MEASUREMENTS TO BE PERFORMED EIA 364 No. PERFORMANCE LEVEL 1 BP120 mV 100 mA LLCR23 BP2Thermal Shock 32Test condition III 10 cycles 30 minutes at each temperature: -65C to +125C Visual examination 18 BP320 mV 100 mA LLCR23 Copyright Electronic Components, Assemb

3、lies & Materials Association Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/29/2007 21:57:55 MDTNo reproduction or networking permitted without license from IHS -,-,- EIA-540HA00 Page 12 TABLE 7 TEST REQUIREMENTS AND PROCEDURES (Continu

4、ed) EIA TESTREQUIREMENTS TEST PHASE TITLEEIA 364 No. SEVERITY OR CONDITION OF TEST MEASUREMENTS TO BE PERFORMED EIA 364 No. PERFORMANCE LEVEL 1 CP1400 V acDielectric withstanding voltage (DWV) 20. CP2100 V dcInsulation resistance21 CP3Thermal shock32Test condition III 10 cycles 30 minutes at each te

5、mperature: -65C to +125C Visual examination18 CP4400 V acDWV20 CP5100 V dcInsulation resistance21 EIA TESTREQUIREMENTS TEST PHASE TITLEEIA 364 No. SEVERITY OR CONDITION OF TEST MEASUREMENTS TO BE PERFORMED EIA 364 No. PERFORMANCE LEVEL 1 DP120 mV 100 mA LLCR23 DP2Mechanical95000 cyclesVisual examina

6、tion18 20 mV 100 mA LLCR23 DP3Temperature life 17Test condition 3 Method A: 85 C 2 C, 300 hours Visual examination18 20 mV 100 mA LLCR23 DP4Solder ball deformation DP5Capacitance30 DP620 mV 100 mA LLCR23 Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under licens

7、e with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/29/2007 21:57:55 MDTNo reproduction or networking permitted without license from IHS -,-,- EIA-540HA00 Page 13 TABLE 7 TEST REQUIREMENTS AND PROCEDURES (Concluded) EIA TESTREQUIREMENTS TEST PHASE TITLEEIA 364 No. SEVE

8、RITY OR CONDITION OF TEST MEASUREMENTS TO BE PERFORMED EIA 364 No. PERFORMANCE LEVEL 1 EP1Contact retention 29Apply force axially to unseat contact at a rate of 0.45 kg (1.0 lb) per second. Hold at 340 g-f (0.750 lb) for 5 seconds Visual examination EIA TESTREQUIREMENTS TEST PHASE TITLEEIA 364 No. S

9、EVERITY OR CONDITION OF TEST MEASUREMENTS TO BE PERFORMED EIA 364 No. PERFORMANCE LEVEL 1 FP1Solderability528 hours steam aging Flux: RMA Solder: 63/37 Solder temp: 245 C 5 C Post clean with isopropyl alcohol 10 loose piece contacts Visual examination18 FP2Resistance to solder heat 56Procedure 3 Wav

10、e solder Test condition: C Flux: RMA Solder temp.: 260 C 5 C Procedure 4 (vapor phase) Visual examination23 Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/29/2007 21:57

11、:55 MDTNo reproduction or networking permitted without license from IHS -,-,- EIA-540HA00 Page 14 EIA TESTREQUIREMENTS TEST PHASE TITLEEIA 364 No. SEVERITY OR CONDITION OF TEST MEASUREMENTS TO BE PERFORMED EIA 364 No. PERFORMANCE LEVEL 1 GP120 mV 100 mA LLCR23 GP2Steady state humidity 31ATest method

12、 III, test cond. B, omit sub- cycles 7a & 7b. 10 cycles, 30 minutes at each temperature: 25 C to 65 C Visual examination18 GP320 mV 100 mA LLCR23 GP4400 V acDielectric withstanding voltage (DWV) 20 GP5100 V dcInsulation resistance21 Copyright Electronic Components, Assemblies & Materials Association

13、 Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/29/2007 21:57:55 MDTNo reproduction or networking permitted without license from IHS -,-,- EIA Document Improvement Proposal If in the review or use of this document, a potential change is

14、 made evident for safety, health or technical reasons, please fill in the appropriate information below and mail or FAX to: Electronic Industries Alliance Engineering Department Publications Office 2500 Wilson Blvd. Arlington, VA 22201 FAX: (703) 907-7501 Document No.Document Title: Submitters Name:

15、Telephone No.: FAX No.: e-mail: Address: Urgency of Change: Immediate:At next revision: Problem Area: a. Clause Number and/or Drawing: b. Recommended Changes: c. Reason/Rationale for Recommendation: Additional Remarks: Signature:Date: FOR EIA USE ONLY Responsible Committee: Chairman: Date comments f

16、orwarded to Committee Chairman: Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/29/2007 21:57:55 MDTNo reproduction or networking permitted without license from IHS -,-,

17、- Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/29/2007 21:57:55 MDTNo reproduction or networking permitted without license from IHS -,-,- Copyright Electronic Compone

18、nts, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/29/2007 21:57:55 MDTNo reproduction or networking permitted without license from IHS -,-,- Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/29/2007 21:57:55 MDTNo reproduction or networking permitted without license from IHS -,-,-

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