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1、 WORLDWIDE ENGINEERING STANDARDS General Specification Electrical/Electronic GMW3103 General Specification for Electrical/Electronic Components and Subsystems, Electromagnetic Compatibility Global EMC Component/Subsystem Validation Acceptance Process Copyright 2006 General Motors Corporation All Rig
2、hts Reserved July 2006 Originating Department: North American Engineering Standards Page 1 of 23 1 Introduction Note: In the event of a conflict between the text of this specification and the documents cited herein, the text of this specification takes precedence. Note: Nothing in the specification
3、supersedes applicable laws and regulations unless a specific exemption has been obtained. 1.1 Scope. This document applies to the Electro- magnetic Compatibility (EMC) design, development and validation of electrical/electronic components and subsystems for passenger vehicles, light duty trucks and
4、medium duty trucks. This document is one out of a series of three global EMC documents that specify EMC test and validation requirements. The complete series consists of the following documents: GMW3091, GMW3097 and GMW3103 (All three documents of equal revision carry the same release date). Note: E
5、arlier versions of GMW12003, GMW12004, and GMW3106, have been integrated into GMW3103 for ease of use. 1.2 Mission/Theme. This document specifies the Global Electromagnetic Compatibility Component/Subsystem Validation Acceptance Process to ensure components and subsystems are properly designed, deve
6、loped and validated prior to vehicle validation. 1.3 Classification. Not applicable. 2 References Note: Only the latest approved standards are applicable unless otherwise specified. 2.1 External Standards/Specifications. SAE J1850 2.2 GM Standards/Specifications. GMW3059 GMW3097 GMW3089 GMW3122 GMW3
7、091 2.3 Additional References. Production Part Approval Process (PPAP), Copyright 1993, 1995, Chrysler Corporation, Ford Motor Corporation, General Motors Corporation, ISO Guide 25 and Automotive EMC Lab Recognition Program. 3 Requirements 3.1 Requirements. The Global EMC Component/Subsystem Validat
8、ion Acceptance Process defined within this document shall be followed for all EMC component/subsystem design, development and validation. The Appendix B: EMC Lessons Learned should be reviewed and considered prior to the first electrical design and layout of the product. The Appendix A: Component EM
9、C Test Plan shall be completed by the supplier and submitted in an electronic format to vehicle manufacturer for approval 60 days prior to the start of EMC testing. An editable version of all Appendices can be obtained on request from the applicable vehicle manufacturer EMC department. 3.2 Process.
10、3.2.1 Design, Build, and Validate Design Iteration. The objectives of the Design, Build and Validate Design Iteration phase shown in Figure 1, include component/subsystem design, development and validation. Design validation shall occur during this phase to confirm all Electromagnetic Compatibility
11、technical requirements contained in the Component/Subsystem Technical Specification are met. An EMC Detailed Design Review, shown in Figure 1, should be conducted for all new components and subsystems and applications, and for revisions to existing components and subsystems that could affect Electro
12、magnetic Compatibility compliance. This process does not apply to carryover components or subsystems. The term carryover means that the product qualified for a prior program and is exactly the same product being used for the future program. Modifications, -,-,- GMW3103 GM WORLDWIDE ENGINEERING STAND
13、ARDS Copyright 2006 General Motors Corporation All Rights Reserved Page 2 of 23 July 2006 alterations, internal part swaps, hardware and software changes are not considered carryover and must be validated according to the requirements. Detailed Design Review(s) shall be scheduled and led by the supp
14、lier, and attended by the EMC Design Review Team if the supplier desires EMC design guidance. The vehicle manufacturer Responsible Engineer must be consulted on scheduling and informed of all design review results and supplier action plans. The vehicle manufacturer Responsible Engineers acceptance o
15、f review results and supplier action plans does not relieve the supplier of the obligation to meet contracted performance requirements. The objectives of the Detailed Design Review should be to: Review component/subsystem schematic design and circuit board layout Examine any prior relevant analysis,
16、 calculations and test results Evaluate potential changes to the component/subsystem design Propose solutions to problems and appropriate revalidation Verify that the proposed design and circuit board layout satisfies component/subsystem EMC technical and validation requirements The vehicle manufact
17、urer Responsible Engineer may also schedule a design review on his/her own initiative, or upon the advice of a vehicle manufacturer EMC engineer. The vehicle manufacturer Responsible Engineer may make any appropriate arrangement for leadership of such a review or delegate the actual review activity
18、to other team members. Supplier Deliverables: Documentation required to be delivered, as one package, to vehicle manufacturer EMC design review team at least 10 working days ahead of the scheduled meeting: PCB Layout Components list Hardware Schematic drawing Component placement drawing Functional d
19、escription Interface description EMC math simulation results (if available) EMC test reports (if available) EMC Component Test Plan (Appendix A of GMW3103), in electronic editable format Note: Actual hardware samples or physical mock- up for visual examination is desirable but not required. Electron
20、ic documents must be in an editable format compatible with Microsoft Office. Design Analysis end of EMC, continue to Production Part Approval Process a must. Should: Denotes preferences when specifying alternatives or desired conformance with objectives, standards, etc. Via: A plated thru-hole on a
21、printed circuit board to route a signal between layers. 6.2 Acronyms, Abbreviations, and Symbols. A/D Analog to Digital AC Alternating Current BCI Bulk Current Injection CAN Controller Area Network CE Conducted Transient Emissions CI Conducted Transient Immunity CTS Component Technical Specification
22、 DBCI Differential Bulk Current Injection DC Direct Current DUT Device Under Test DV Design Validation DWCAN Dual Wire CAN EICD Electrical Interface Control Document EMC Electromagnetic Compatibility EMI Electromagnetic Interference ESD Electrostatic Discharge ESR Effective Series Resistance FET Fie
23、ld-Effect Transistor FOT Fiber Optic Transmitter GM General Motors HS High Speed I/O Input/Output IC Integrated Circuit IEC International Electrotechnical Commission ISO International Organization for Standardization ITDC International Technical Development Center LISN Line Impedance Stabilization N
24、etwork LC Inductive/Capacitive LED Light-Emitting Diode LF Low Frequency LS Low Speed MOST A Specific Communication Protocol MOV Metal Oxide Varistor NA North America OTP One Time Programmable PCB Printed Circuit Board PLL Phase Locked Loop -,-,- GM WORLDWIDE ENGINEERING STANDARDS GMW3103 Copyright
25、2006 General Motors Corporation All Rights Reserved June 2006 Page 5 of 23 PV Production Validation PWM Pulse Width Modulated R/C Resistance/Capacitance RAM Random Access Memory RE Radiated Emissions RF Radio Frequency RI Radiated Immunity SAE J1850 Communication Protocol (Class 2) SMD Surface Mount
26、ed Device SOR Statement of Requirements SSLT Subsystem Leadership Team SSTS Subsystem Technical Specification SWCAN Single Wire CAN uP Microprocessor VTS Vehicle Technical Specification XTAL Crystal 7 Additional Paragraphs 7.1 All materials supplied to this specification must comply with the require
27、ments of GMW3001, Rules and Regulations for Materials Specifications. 7.2 All materials supplied to this specification must comply with the requirements of GMW3059, Restricted and Reportable Substances for Parts. 8 Coding System This specification shall be referenced in other documents, drawings, VT
28、S, CTS, etc. as follows: GMW3103 9 Release and Revisions 9.1 Release. The general specification originated in January 2000. It has been approved by the GM EMC Global Sub-System Leadership Team (GSSLT) in September 2005. It was first published in June 2000. 9.2 Revisions. Rev Approval Date Descriptio
29、n (Organization) E JAN 2004 Publication Feb 2004. Editorial revision, also called “Revision 4” F APR 2006 Publication June 2006 Minor technical changes (addition of GM Approval Number requirement, addition of EMC Design Requirements Checklist in Table A2.2, PWM slew rate recommendations, motor CE tr
30、ansient suppression). Coordinated release with GMW3091 and GMW3097. Also called “Revision 5”. -,-,- GMW3103 GM WORLDWIDE ENGINEERING STANDARDS Copyright 2006 General Motors Corporation All Rights Reserved Page 6 of 23 June 2006 Appendix A A1 Global EMC Component Test Plan A1.1 Introduction. The Comp
31、onent EMC Test Plan shall be completed by the supplier and submitted to the vehicle manufacturers EMC Design Review Team member(s) for approval at least 60 days prior to the start of Component EMC testing. This EMC Test Plan requires an approval number to be supplied by GM EMC personnel prior to the
32、 start of any testing. Any/all data submitted without this approval number will not be considered for validation (DV or PV) approval. All sections shall be included as stated in the outline, only additions of new sections are allowed. If a section is not applicable, this shall be stated in the docum
33、ent after the relevant section description. Completing the Component EMC Test Plan requires collaborations between the suppliers Design Engineer along with the suppliers EMC Applications and Test Engineers. A1.2 Purpose. The purpose of the Component EMC Test Plan is to develop and document a compreh
34、ensive EMC test based on requirements to confirm EMC compliance. The Component EMC Test Plan also provides a mechanism for ongoing enhancements and improvements to the test methodology that improves vehicle level test correlation. The Component EMC Test Plan section documents the DUT operation and t
35、est procedures. It describes all relevant test set-ups and procedures to verify the electromagnetic robustness of the design. In some cases, it may make sense to select a specific sample for test that represents the entire DUT family. The Component EMC Test Plan should contain the justification and
36、rationale for doing this. In some cases simulation results may be used as a substitute for actual physical testing. This requires specific prior agreement by the vehicle manufacturers EMC engineer, and shall be documented in Table A2.1 Test Requirements. -,-,- GM WORLDWIDE ENGINEERING STANDARDS GMW3
37、103 Copyright 2006 General Motors Corporation All Rights Reserved June 2006 Page 7 of 23 Table A1: Component EMC Test Plan Device Under Test (no abbreviations): GM Approval Number: Release Date: Revision: DUT Part Number(s): DUT Manufacturer: Prepared by (Supplier): Approved by Vehicle Manufacturers
38、 Responsible Engineer: Approved by (Supplier): Approved by Vehicle Manufacturers/EMC: Revision History Date Description This Test Plan is approved with the following corrections and/or added conditions: Modifications to GMW3097 Date Description -,-,- GMW3103 GM WORLDWIDE ENGINEERING STANDARDS Copyri
39、ght 2006 General Motors Corporation All Rights Reserved Page 8 of 23 June 2006 Table A2.1: Test Requirements Device Category (per Table 2 of GMW3097) GMW 3097 Test Applies? Number of Samples (Note 1) DUT Setup Figure(s) DUT Test Mode No. Test Comment Paragraph Y/N DV PV Radiated Emission RE 3.3.1 AL
40、SE 3.3.2 CE, Artificial Network Radiated Immunity RI 3.4.1 Bulk Current Injection 3.4.2 Anechoic chamber 3.4.3 Reverb, mode tuning 3.4.4 Magnetic field Transients 3.5.1 Conducted Emissions 3.5.2 Power Lines 3.5.3 I/O Lines 3.5.4 Sensor Lines 3.5.5 (Optional) 85V I/O Electrostatic Discharge ESD 3.6.1
41、 Power-On Mode 3.6.2 Remote I/O 3.6.3 Handling Note 1: Minimum number of test samples is two. It takes two (2) samples to pass and one (1) to fail -,-,- GM WORLDWIDE ENGINEERING STANDARDS GMW3103 Copyright 2006 General Motors Corporation All Rights Reserved June 2006 Page 9 of 23 Table A2.2: EMC Des
42、ign Requirements Checklist GMW 3097 Compliance (Validate by Inspection) Comment Paragraph Y/N DVPV 3.7.1 Restriction of BM Motor Capacitance to Control Switching Transients 3.7.2 BM Glass Wipers and HVAC Blower Motor Capacitance 3.7.3 Package Protection - Short- Duration Motor Inductors 3.7.4 Packag
43、e Protection - Short- Duration Motor Transient Voltage Suppression 3.7.5 Package Protection Transient Voltage Suppression on AX Outputs Switching BM Motors 3.7.6 Communication Bus (Low-Speed GMLAN, High-Speed GMLAN, etc.) -,-,- GMW3103 GM WORLDWIDE ENGINEERING STANDARDS Copyright 2006 General Motors
44、 Corporation All Rights Reserved Page 10 of 23 June 2006 A3 Component EMC Test Plan A3.1 Product Family Description. Provide a brief DUT product family description, including any similarities and differences of planned hardware and software revisions. In some cases, it may make sense to select a spe
45、cific sample for test that represents the entire DUT family. Please state the justification and rationale for doing this. (to be filled by supplier, enlarge this area as necessary) A3.2 Product Functional Description. Provide a brief overview of the DUT functions, including system interfaces. Use wo
46、rding that describes the system to those not familiar with the product. Define all abbreviations. Provide a list of all used connector pins and their function. (to be filled by supplier, enlarge this area as necessary) A3.3 DUT Component/Subsystem Level Test Requirements. Determine the required test
47、s for the DUT (complete Table A3, then Table A2.1). For each applicable test, indicate the appropriate DUT test mode number listed in Table A3. Provide justification if all samples of the DUT are not subjected to the same test condition. Also, provide justification for any omissions in testing for a
48、ny of the DUT test modes listed. Additionally, complete Table A2.1 regarding specific design requirements. Note: Table 2 of GMW3097 shall be used to aid in the determination of applicable component and subsystem tests. A3.4 DUT Operating Modes/Functional Performance Level. All DUT hardware I/O shall be examined, list all DUT I/O in Table A3. Names may be used in the table to reference DUT test modes and functions as long as a subsequent descript