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1、 IEC 62137-1-5 Edition 1.0 2009-02 INTERNATIONAL STANDARD NORME INTERNATIONALE Surface mounting technology Environmental and endurance test methods for surface mount solder joints Part 1-5: Mechanical shear fatigue test Technologie du montage en surface Mthodes dessais denvironnement et dendurance d
2、es joints brases montes en surface Partie 1-5: Essai de fatigue par cisaillement mcanique IEC 62137-1-5:2009 Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=HP Monitoring/1111111164 Not for Resale, 04/07/2009 05:25:06 MDTNo reproduction or networkin
3、g permitted without license from IHS -,-,- THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2009 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photo
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18、06 MDTNo reproduction or networking permitted without license from IHS -,-,- IEC 62137-1-5 Edition 1.0 2009-02 INTERNATIONAL STANDARD NORME INTERNATIONALE Surface mounting technology Environmental and endurance test methods for surface mount solder joints Part 1-5: Mechanical shear fatigue test Tech
19、nologie du montage en surface Mthodes dessais denvironnement et dendurance des joints brases montes en surface Partie 1-5: Essai de fatigue par cisaillement mcanique INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE S ICS 31.190 PRICE CODE CODE PRIX ISBN 2-8318-102
20、8-5 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=HP Monitoring/1111111164 Not for Resale, 04/07/2009 05:25:06 MDTN
21、o reproduction or networking permitted without license from IHS -,-,- 2 62137-1-5 IEC:2009 CONTENTS FOREWORD.3 INTRODUCTION.5 1 Scope.6 2 Normative references .7 3 Terms and definitions .8 4 Test equipment and materials.8 4.1 Test equipment for mechanical shear fatigue testing .8 4.2 Test substrate
22、.8 4.3 Solder alloy.9 4.4 Solder paste9 4.5 Reflow soldering equipment 9 5 Mounting 9 6 Test conditions.10 6.1 Pre-treatment 10 6.2 Test procedures 10 6.3 Judging criteria10 7 Items to be included in the test report.11 8 Items to be given in the product specification .11 Annex A (normative) Mechanic
23、al shear fatigue test equipment.12 Annex B (normative) Mechanical shear fatigue test procedure .15 Annex C (informative) Evaluation of mechanical properties of a single solder joint by mechanical shear fatigue test .17 Bibliography21 Figure 1 Image drawing on evaluation area of joint strength.6 Figu
24、re 2 Schematic illustrations of thermomechanical and mechanical fatigue for solder joints 7 Figure 3 A typical temperature profile taken by reflow soldering equipment10 Figure A.1 Sample structures of shear fatigue jig.13 Figure B.1 Example of set-up for electrical resistance measuring.16 Figure C.1
25、 Schematic illustration of the single solder joint for mechanical fatigue testing 18 Figure C.2 Schematic illustration of fixing jig for soldering of the single solder joint .18 Figure C.3 Schematic illustration of the shear fatigue jig19 Figure C.4 Relationship between reaction forces and the numbe
26、r of cycles during a fatigue test20 Figure C.5 Relationship between the displacement range and fatigue life 20 Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=HP Monitoring/1111111164 Not for Resale, 04/07/2009 05:25:06 MDTNo reproduction or network
27、ing permitted without license from IHS -,-,- 62137-1-5 IEC:2009 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SURFACE MOUNTING TECHNOLOGY ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINTS Part 1-5: Mechanical shear fatigue test FOREWORD 1) The International Electrotechnical Co
28、mmission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end an
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37、ion. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such
38、patent rights. International Standard IEC 62137-1-5 has been prepared by IEC technical committee 91: Electronics assembly technology. The text of this standard is based on the following documents: FDIS Report on voting 91/826/FDIS 91/841/RVD Full information on the voting for the approval of this st
39、andard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=HP Monitoring/1111111164 Not for Resale, 0
40、4/07/2009 05:25:06 MDTNo reproduction or networking permitted without license from IHS -,-,- 4 62137-1-5 IEC:2009 A list of all parts of the IEC 62137 series, under the general title Surface mounting technology Environmental and endurance test methods for surface mount solder joints, can be found on
41、 the IEC website. The committee has decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, wi
42、thdrawn, replaced by a revised edition, or amended. Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=HP Monitoring/1111111164 Not for Resale, 04/07/2009 05:25:06 MDTNo reproduction or networking permitted without license from IHS -,-,- 62137-1-5 IEC:
43、2009 5 INTRODUCTION The mechanical properties of lead-free solder joints between leads and lands on a printed wiring board are not the same with tin-lead-containing solder joints, due to their solder compositions. Thus, it becomes important to test the mechanical properties of solder joints of diffe
44、rent alloys. Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=HP Monitoring/1111111164 Not for Resale, 04/07/2009 05:25:06 MDTNo reproduction or networking permitted without license from IHS -,-,- 6 62137-1-5 IEC:2009 SURFACE MOUNTING TECHNOLOGY ENVI
45、RONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINTS Part 1-5: Mechanical shear fatigue test 1 Scope The test method described in this part of IEC 62137 applies to area array packages, such as BGA. This test method is designed to evaluate the fatigue life of the solder joints between
46、 component leads and lands on a substrate as shown in Figure 1. A temperature cyclic approach is generally used to evaluate the reliability of solder joints. Another method is to mechanically cycle the solder joints to shorten the testing time rather than to produce the strains by changing temperatu
47、res. The methodology is the imposition of shear deformation on the solder joints by mechanical displacement instead of relative displacement generated by CTE (coefficient of thermal expansion) mismatch, as shown in Figure 2. In place of the temperature cycle test, the mechanical shear fatigue predic
48、ts the reliability of the solder joints under repeated temperature change conditions by mechanically cycling the solder joints. In this test method, the evaluation requires first to mount the surface mount component on the substrate by reflow soldering, then cyclic mechanical shear deformation is applied to the solder joints until fracture of the solder joints occurs. The properties of the solder joints