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1、 INTERNATIONAL STANDARD IEC 62258-1 First edition 2005-08 Semiconductor die products Part 1: Requirements for procurement and use Reference number IEC 62258-1:2005(E) Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=IHS Employees/1111111001, User=Win
2、g, Bernie Not for Resale, 03/10/2007 01:05:16 MSTNo reproduction or networking permitted without license from IHS -,-,- Publication numbering As from 1 January 1997 all IEC publications are issued with a designation in the 60000 series. For example, IEC 34-1 is now referred to as IEC 60034-1. Consol
3、idated editions The IEC is now publishing consolidated versions of its publications. For example, edition numbers 1.0, 1.1 and 1.2 refer, respectively, to the base publication, the base publication incorporating amendment 1 and the base publication incorporating amendments 1 and 2. Further informati
4、on on IEC publications The technical content of IEC publications is kept under constant review by the IEC, thus ensuring that the content reflects current technology. Information relating to this publication, including its validity, is available in the IEC Catalogue of publications (see below) in ad
5、dition to new editions, amendments and corrigenda. Information on the subjects under consideration and work in progress undertaken by the technical committee which has prepared this publication, as well as the list of publications issued, is also available from the following: IEC Web Site (www.iec.c
6、h) Catalogue of IEC publications The on-line catalogue on the IEC web site (www.iec.ch/searchpub) enables you to search by a variety of criteria including text searches, technical committees and date of publication. On-line information is also available on recently issued publications, withdrawn and
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8、ns regarding this publication or need further assistance, please contact the Customer Service Centre: Email: custserviec.ch Tel: +41 22 919 02 11 Fax: +41 22 919 03 00 Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=IHS Employees/1111111001, User=Wi
9、ng, Bernie Not for Resale, 03/10/2007 01:05:16 MSTNo reproduction or networking permitted without license from IHS -,-,- INTERNATIONAL STANDARD IEC 62258-1 First edition 2005-08 Semiconductor die products Part 1: Requirements for procurement and use IEC 2005 Copyright - all rights reserved No part o
10、f this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from the publisher. International Electrotechnical Commission, 3, rue de Varemb, PO Box 131, CH-1211 Geneva 20, Switzerland Tele
11、phone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmailiec.ch Web: www.iec.ch W For price, see current catalogue PRICE CODE Commission Electrotechnique Internationale International Electrotechnical Commission Copyright International Electrotechnical Commission Provided by IHS under license
12、with IECLicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/10/2007 01:05:16 MSTNo reproduction or networking permitted without license from IHS -,-,- 2 62258-1 IEC:2005(E) CONTENTS FOREWORD.5 INTRODUCTION.7 1 Scope.8 2 Normative references8 3 Terms and definitions9 3.1 Basic def
13、initions 9 3.2 General terminology.9 3.3 Semiconductor manufacturing and interconnection terminology11 4 General requirements .12 4.1 General .12 4.2 Identity 13 4.3 Source.13 4.4 Function 13 4.5 Electrical and physical characteristics 13 4.6 Geometry.13 4.7 Connectivity.13 4.8 Documentation 13 4.9
14、Test and quality .13 4.10 Handling13 4.11 Assembly.13 4.12 Thermal data .13 4.13 Models 14 5 Data exchange14 6 Requirements for bare die with and without connection structures .14 6.1 Form of supply.14 6.2 Die name.14 6.3 Die version 14 6.4 Manufacturer .14 6.5 Type number .14 6.6 Function 14 6.7 In
15、formation source.14 6.8 Data version 14 6.9 Units of measurement14 6.10 Geometric view14 6.11 Die size .15 6.12 Die thickness.15 6.13 Geometric origin 15 6.14 Dimension tolerances 15 6.15 Pad count 15 6.16 Pad information .15 6.17 Signal type.15 6.18 Technology15 6.19 Semiconductor material .15 6.20
16、 Substrate material .15 6.21 Substrate connection .16 Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/10/2007 01:05:16 MSTNo reproduction or networking permitted without license from IHS
17、 -,-,- 62258-1 IEC:2005(E) 3 6.22 Passivation material.16 6.23 Pad metallization .16 6.24 Backside finish 16 6.25 Wafer size .16 6.26 Wafer thickness.16 6.27 Wafer map.16 6.28 Power dissipation.16 6.29 Operating temperature.16 6.30 Packing .16 6.31 Supplier.16 6.32 Bump material .16 6.33 Bump size17
18、 6.34 Bump height tolerance .17 6.35 Connection material.17 6.36 Die picture.17 6.37 Die fiducials.17 7 Minimally packaged devices17 7.1 General .17 7.2 Terminal position .17 7.3 Terminal size.17 7.4 Number of terminals 18 7.5 Package size .18 7.6 Seated height 18 7.7 Encapsulation material.18 7.8 T
19、erminal material.18 7.9 Package style code18 8 Test, quality and reliability.18 8.1 General .18 8.2 Outgoing quality level.18 8.3 Electrical parameters specified 18 8.4 Compliance to standards .18 8.5 Additional device screening19 8.6 Reliability.19 8.7 Product status .19 9 Requirements for handling
20、 and shipping19 9.1 General .19 9.2 Specific requirements for bare die or wafers - Die version 20 9.3 Specific requirements for wafers - Product grading.20 9.4 Special item requirements20 10 Requirements for storage21 10.1 General .21 10.2 Storage duration and conditions.21 10.3 Long-term storage .2
21、1 11 Information related to assembly 21 11.1 General .21 11.2 Attach methods and materials21 11.3 Bonding method and materials.22 Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/10/2007
22、01:05:16 MSTNo reproduction or networking permitted without license from IHS -,-,- 4 62258-1 IEC:2005(E) Annex A (informative) Terminology.23 A.1 Assembly terminology.23 A.2 Test terminology.23 A.3 Semiconductor terminology.25 A.4 Semiconductor assembly technology.27 A.5 Design and simulation termin
23、ology28 A.6 Packing and delivery terminology 31 A.7 Handling terminology 32 Annex B (informative) Acronyms.33 B.1 Organizations and standards.33 B.2 General terminology33 B.3 Manufacturing and test terminology.34 B.4 Semiconductors35 B.5 Design, simulation and data exchange 35 B.6 Electronic technol
24、ogy36 B.7 Packaging.37 Bibliography38 Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/10/2007 01:05:16 MSTNo reproduction or networking permitted without license from IHS -,-,- 62258-1 I
25、EC:2005(E) 5 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DIE PRODUCTS Part 1: Requirements for procurement and use FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC Na
26、tional Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Pub
27、licly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non- gove
28、rnmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC
29、on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accept
30、ed by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote internationa
31、l uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latt
32、er. 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with an IEC Publication. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its di
33、rectors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses aris
34、ing out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is
35、drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 62258-1 has been prepared by IEC technical committee 47: Semiconductor devices.
36、The text of this standard is based on the following documents: FDIS Report on voting 47/1820/FDIS 47/1832/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the I
37、SO/IEC Directives, Part 2. Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/10/2007 01:05:16 MSTNo reproduction or networking permitted without license from IHS -,-,- 6 62258-1 IEC:2005(E
38、) IEC 62258, as currently conceived, consists of the following parts, under the general title Semiconductor die products: Part 1: Requirements for procurement and use Part 2: Exchange data formats 1 Part 3: Recommendations for good practice in handling, packing and storage (Technical Report) 1 Part
39、4: Questionnaire for die users and suppliers (Technical Report) 2 Part 5: Requirements for information concerning electrical simulation 2 Part 6: Requirements for information concerning thermal simulation 2 Further parts may be added as required. A bilingual version of this publication may be issued
40、 at a later date. The committee has decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed; wi
41、thdrawn; replaced by a revised edition, or amended. _ 1 To be published. 2 In preparation. Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/10/2007 01:05:16 MSTNo reproduction or networki
42、ng permitted without license from IHS -,-,- 62258-1 IEC:2005(E) 7 INTRODUCTION This International Standard is based on the work carried out in the ESPRIT 4th Framework project GOOD-DIE which resulted in the publication of the ES59008 series of European specifications. Organizations that helped prepa
43、re this standard include the ESPRIT GOOD-DIE project, The Die Products Consortium, JEITA, JEDEC and ZVEI. Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/10/2007 01:05:16 MSTNo reproduct
44、ion or networking permitted without license from IHS -,-,- 8 62258-1 IEC:2005(E) SEMICONDUCTOR DIE PRODUCTS Part 1: Requirements for procurement and use 1 Scope This part of IEC 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including wafers, sin
45、gulated bare die, die and wafers with attached connection structures, minimally or partially encapsulated die and wafers. This standard defines the minimum requirements for the data which are needed to describe such die products and is intended as an aid in the design of and procurement of assemblie
46、s incorporating die products. It covers the requirements for data, including product identity, product data, die mechanical information, test, quality, assembly and reliability information, handling, shipping and storage information. This standard covers the specific requirements for data needed to
47、describe the geometrical properties of die, their physical properties and the means of connection necessary for their use in the development and manufacture of products. It also contains, in Annexes A and B, terminology and a list of common acronyms, respectively. 2 Normative references The followin
48、g referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60191-4:1999, Mechanical standardization of semiconductor devices Part 4: Coding system and classification into fo