ISO-15166-2-2000.pdf

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1、INTERNATIONAL STANDARD ISO 15166-2 First edition 2000-12-01 Reference number ISO 15166-2:2000(E) ISO 2000 Adhesives Methods of preparing bulk specimens Part 2: Elevated-temperature-curing one-part systems Adhsifs Mthodes de prparation dprouvettes massiques Partie 2: Systmes monocomposants durcissant

2、 temprature leve Copyright International Organization for Standardization Provided by IHS under license with ISO Licensee=Aramco HQ/9980755100 Not for Resale, 04/23/2007 09:01:01 MDTNo reproduction or networking permitted without license from IHS -,-,- ISO 15166-2:2000(E) ii ISO 2000 All rights rese

3、rved PDF disclaimer This PDF file may contain embedded typefaces. In accordance with Adobes licensing policy, this file may be printed or viewed but shall not be edited unless the typefaces which are embedded are licensed to and installed on the computer performing the editing. In downloading this f

4、ile, parties accept therein the responsibility of not infringing Adobes licensing policy. The ISO Central Secretariat accepts no liability in this area. Adobe is a trademark of Adobe Systems Incorporated. Details of the software products used to create this PDF file can be found in the General Info

5、relative to the file; the PDF-creation parameters were optimized for printing. Every care has been taken to ensure that the file is suitable for use by ISO member bodies. In the unlikely event that a problem relating to it is found, please inform the Central Secretariat at the address given below. I

6、SO 2000 All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, elec- tronic or mechanical, including photocopying and microfilm, without permission in writing from either ISO at the address below or ISOs mem- ber body i

7、n the country of the requester. ISO copyright office Case postale 56 CH-1211 Geneva 20 Tel. + 41 22 749 01 11 Fax + 41 22 749 09 47 E-mail copyrightiso.ch Web www.iso.ch Printed in Switzerland Copyright International Organization for Standardization Provided by IHS under license with ISO Licensee=Ar

8、amco HQ/9980755100 Not for Resale, 04/23/2007 09:01:01 MDTNo reproduction or networking permitted without license from IHS -,-,- ISO 15166-2:2000(E) ISO 2000 All rights reserved iii ContentsPage 1Scope .1 2Normative references .1 3Mould description .1 4Dispensing the adhesive 2 5Moulding .4 6Curing

9、.4 7Specimen preparation report 4 Copyright International Organization for Standardization Provided by IHS under license with ISO Licensee=Aramco HQ/9980755100 Not for Resale, 04/23/2007 09:01:01 MDTNo reproduction or networking permitted without license from IHS -,-,- ISO 15166-2:2000(E) iv ISO 200

10、0 All rights reserved Foreword ISO (the International Organization for Standardization) is a worldwide federation of national standards bodies (ISO member bodies). The work of preparing International Standards is normally carried out through ISO technical com- mittees. Each member body interested in

11、 a subject for which a technical committee has been established has the right to be represented on that committee. International organizations, governmental and non-governmental, in liai- son with ISO, also take part in the work. ISO collaborates closely with the International Electrotechnical Commi

12、ssion (IEC) on all matters of electrotechnical standardization. International Standards are drafted in accordance with the rules given in the ISO/IEC Directives, Part 3. Draft International Standards adopted by the technical committees are circulated to the member bodies for voting. Publication as a

13、n International Standard requires approval by at least 75 % of the member bodies casting a vote. Attention is drawn to the possibility that some of the elements of this part of ISO 15166 may be the subject of patent rights. ISO shall not be held responsible for identifying any or all such patent rig

14、hts. International Standard ISO 15166-2 was prepared by Technical Committee ISO/TC 61,Plastics, Subcommittee SC 11,Products. ISO 15166 consists of the following parts, under the general titleAdhesives Methods of preparing bulk specimens: Part 1: Two-part systems Part 2: Elevated-temperature-curing o

15、ne-part systems Copyright International Organization for Standardization Provided by IHS under license with ISO Licensee=Aramco HQ/9980755100 Not for Resale, 04/23/2007 09:01:01 MDTNo reproduction or networking permitted without license from IHS -,-,- ISO 15166-2:2000(E) ISO 2000 All rights reserved

16、 v Introduction Accurate values for the mechanical properties of structural adhesives are needed in the design of bonded joints to enable calculations of the stress distribution in the loaded joint and to determine failure criteria for the adhesive material. The use of test methods that employ speci

17、mens in the form of a bonded joint for the measurement of these properties is not ideal. This is because the thickness dimension of the bond constitutes the gauge length of the spec- imen for the measurement of strain and, since the thickness is small (typically), strains cannot be routinely determi

18、ned with high accuracy. Furthermore, the failure of a joint specimen usually arises under a multiaxial stress state, the complexity of which depends upon many factors such as the geometry of the joint, the dimensions and properties of the adherends and the geometry of any fillets. The failure data d

19、erived from these specimens may be informative for design purposes but additional data are needed corresponding to deformation and failure under more simple stress states such as shear and uniaxial tension. The availability of bulk specimens with suitable dimensions will enable mechanical properties

20、 under different loading conditions and environments to be measured using methods developed and standardized for engineering plastics. These are both accurate and relatively inexpensive. Procedures are described that will enable specimens to be obtained that have structures and properties comparable

21、 with those for the adhesive in a bonded joint. Additional tests on joint specimens will be necessary to give information relating to the performance of the bond between the adhesive and the adherend. 1 mm Copyright International Organization for Standardization Provided by IHS under license with IS

22、O Licensee=Aramco HQ/9980755100 Not for Resale, 04/23/2007 09:01:01 MDTNo reproduction or networking permitted without license from IHS -,-,- Copyright International Organization for Standardization Provided by IHS under license with ISO Licensee=Aramco HQ/9980755100 Not for Resale, 04/23/2007 09:01

23、:01 MDTNo reproduction or networking permitted without license from IHS -,-,- INTERNATIONAL STANDARDISO 15166-2:2000(E) ISO 2000 All rights reserved 1 Adhesives Methods of preparing bulk specimens Part 2: Elevated-temperature-curing one-part systems 1Scope This part of ISO 15166 describes methods fo

24、r the preparation of bulk specimens of adhesives. The procedures described are suitable for elevated-temperature, one-part adhesives such as epoxies. They are not suitable for adhesives where the cure requires the evaporation of solvents or liberation of gas. 2Normative references The following norm

25、ative documents contain provisions which, through reference in this text, constitute provisions of this part of ISO 15166. For dated references, subsequent amendments to, or revisions of, any of these publications do not apply. However, parties to agreements based on this part of ISO 15166 are encou

26、raged to investigate the possibility of applying the most recent editions of the normative documents indicated below. For undated references, the latest edition of the normative document referred to applies. Members of ISO and IEC maintain registers of cur- rently valid International Standards. ISO

27、2818:1994,Plastics Preparation of test specimens by machining. ISO 3167:1),Plastics Multipurpose test specimens. 3Mould description 3.1General The mould shall consist of two plates separated by a frame. For non-free-flowing adhesives, a U-shaped or a closed frame shall be used (see Figure 1). 3.2Pla

28、tes The two plates shall be made of metal and be at leastthick. This is both to provide a heat sink while curing and to avoid significant bowing of the plates under the forces experienced during moulding. Copper and brass are suggested as a plate material as they are good thermal conductors. However

29、, when using cer- tain components which are aggressive to copper, alternative metallic materials shall be used. Make sure that the adhesive does not adhere to the metal plates after cure. NOTEThis can be achieved by applying on the plates a low-surface-energy material such as a polytetrafluoroethyle

30、ne (PTFE) film, or coating or spraying a release material on the surface of the plates (PTFE sprays need caution so as not to contaminate any other surfaces in the vicinity). 1)To be published. (Revision of ISO 3167:1993) 5 mm Copyright International Organization for Standardization Provided by IHS

31、under license with ISO Licensee=Aramco HQ/9980755100 Not for Resale, 04/23/2007 09:01:01 MDTNo reproduction or networking permitted without license from IHS -,-,- ISO 15166-2:2000(E) 2 ISO 2000 All rights reserved For preparing bulk specimens of adhesives that cure very rapidly at ambient temperatur

32、e and where the evolution of large quantities of heat on curing is likely to lead to different properties of the adhesive, the plates in the mould shall be constructed to allow cooling water to pass through them. 3.3Frame In the case of low-viscosity materials which would flow out of the open frame

33、within the time taken to close the mould, it is necessary to use a continuous frame to avoid leakage see Figure 1b). Make sure that the adhesive does not adhere to the frame after cure. NOTE 1This can be achieved by applying on the frame a low-surface-energy material such as a PTFE film, or coating

34、or spray- ing a release material on the surface of the frame. PTFE sprays need caution so as not to contaminate any other surfaces in the vicinity. Alternatively the frame could be constructed from a low-surface-energy plastic such as PTFE. The height of the frame determines the specimen thickness a

35、nd shall be uniform to within. NOTE 2A height oftois suitable for most tests. The dimensions of the mould shall be chosen to suit the type of test specimen required. When bulk specimens are to be prepared having the standard multipurpose test specimen geometry specified in ISO 3167, the minimum leng

36、th of the cast material shall be greater than. Mechanical test specimens shall be machined in accordance with ISO 2818, stamped or cut from the cast materials. Alternatively, pre-formed or shaped frames can be used to manufacture specimens of the desired geometry. 4Dispensing the adhesive 4.1Prepara

37、tion of the adhesive Precautions shall be taken to minimize the volume of any entrapped air in the adhesive since air bubbles present in the material will lead to voids in the final bulk specimen. Entrapped air can be removed from the material by stirring a)U-shaped frame for non-free-flowing adhesi

38、vesb)Continuous frame for free-flowing adhesive Figure 1 Examples of suitable moulds 0,5 % 2 mm3 mm 150 mm Copyright International Organization for Standardization Provided by IHS under license with ISO Licensee=Aramco HQ/9980755100 Not for Resale, 04/23/2007 09:01:01 MDTNo reproduction or networkin

39、g permitted without license from IHS -,-,- ISO 15166-2:2000(E) ISO 2000 All rights reserved 3 the adhesive under vacuum. When there is a risk of losing volatile substances in this process, the operation shall be carried out at sufficiently low temperatures to avoid the loss of these substances. NOTE

40、The adhesive manufacturer should be consulted on whether vacuum degassing is feasible. 4.2Dispensing 4.2.1Non-free-flowing adhesives These adhesives shall be dispensed from cartridges with a nozzle. A continuous, steady flow of adhesive is required while dispensing. The nozzle shall remain within th

41、e cast of adhesive at all times to prevent the introduction of air (see Figure 2). The nozzle shall be drawn slowly down the centre of the mould in a continuous action without lifting from the bottom of the mould or stopping the flow of adhesive (see Figure 2). NOTEIt is recommended that the nozzle

42、be kept at an angle of aboutto the plate (see Figure 2). The thickness of the dispensed adhesive shall be greater than the height of the frame. 4.2.2Free-flowing adhesives Where the adhesive is not supplied in a cartridge, the adhesive shall be degassed in a container with a lip to aid the pouring o

43、f the adhesive into the mould. Dispense the adhesive carefully into the centre of the mould so as to avoid introducing air by turbulent flow. Make sure that the volume of the adhesive is less than the volume of the mould cavity. Key 1Metal plate 2Adhesive cast 3Release agent 4Nozzle a Larger than th

44、e frame height b Direction of nozzle travel Figure 2 Casting of the adhesive 30 Copyright International Organization for Standardization Provided by IHS under license with ISO Licensee=Aramco HQ/9980755100 Not for Resale, 04/23/2007 09:01:01 MDTNo reproduction or networking permitted without license

45、 from IHS -,-,- ISO 15166-2:2000(E) 4 ISO 2000 All rights reserved If the free flowing adhesive is supplied in a cartridge, use the procedure described in 4.2.1 with a continuous frame and make sure that the volume of the adhesive is less than the volume of the mould cavity. 5Moulding Close the moul

46、d by placing the plate which constitutes the upper part of the mould over the bottom of the U-shaped frame, then slowly press down onto the adhesive using hand pressure to spread the adhesive in the mould until the plate rests on the frame. Apply sufficient clamping pressure between the upper and lo

47、wer plates of the mould to pre- vent any excessive leakage of the adhesive during the curing process. Place the mould in the curing oven such that it is inclined at an angle betweenandto the horizontal. 6Curing Cure the adhesive in accordance with the manufacturers instructions. When curing adhesive

48、s that undergo a rapid exothermic reaction, it is important to ensure that the temperature rise does not exceed the maximum cure temperature specified by the adhesive manufacturer. When the maximum tem- perature is exceeded, use the lower temperature of the cure temperature range specified by the manufacturer. It is unlikely that excessive temperatures will be experienced in mouldings with thicknesses. Where there is a ne

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