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1、J IS JAPANESE I NDUSTRIAL STANDARD Translated and Published by Japanese Standards Association Packaging of components for automatic handling- Part 3 : Packaging of surface mount components on continuous tapes ICs 31.190 Descriptors : electronic equipment and components, microassembling, semiconducto
2、r technology, electric terminals, printed-circuit bases, tape Reference number : JIS C 0806-3 : 1999 (E) 11 s Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/16/2007 00:16:48 MDTNo reproduction or
3、networking permitted without license from IHS -,-,- C 0806-3 : 1999 Foreword This translation has been made based on the original Japanese Industrial Standard established by the Minister of International Trade and Industry through deliberations at the Japanese Industrial Standards Committee in accor
4、dance with the Industrial Standardization Law. Consequently JIS C 0806 : 1995 is withdrawn and replaced with JIS C 0806-3 : 1999. Attention is drawn to the possibility that some parts of this Standard may conflict with a patent right, application for a patent after opening to the public, utility mod
5、el right or application for registration of utility model after opening to the public which have technical properties. The relevant Minister and the Japanese Industrial Standards Committee are not responsible for identifying the patent right, application for a patent after opening to the public, uti
6、lity model right or application for registration of utility model after opening to the public which have the said technical properties. Group of this Standard: The following Standards form the group. JIS C 0806 series JIS C 0806-1 JIS C 0806-2 JJS C 0806-3 JIS C 0806-4 JIS C 0806-5 JIS C 0806-6 Pack
7、aging of components for automatic handling Part 1 : Tape packaging of components with axial leads on continuous tapes Part 2 : Tape packaging of components with unidirectional leads on continuous tapes Part 3 : Packaging of surface mount components with continuous tapes Part 4 : Stick magazines for
8、electronic components encap- sulated in packages of forms E and G (planned) Part 5 : Matrix trays (planned) Part 6 : Bulk case packaging for surface mounting com- ponents (planned) Date of Establishment: 1999-02-20 Date of Public Notice in Official Gazette: 1999-02-22 Investigated by: Japanese Indus
9、trial Standards Committee Divisional Council on Electronics JIS C 0806-3 : 1999, First English edition published in 2002-04 Translated and published by: Japanese Standards Association 4-1-24, Akasaka, Minato-ku, Tokyo, 107-8440 JAPAN In the event of any doubts arising as to the contents, the origina
10、l TIS is to be the final authority. O JSA2002 All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from the publisher. Prin
11、ted in Japan Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/16/2007 00:16:48 MDTNo reproduction or networking permitted without license from IHS -,-,- C 0806-3 : 1999 Contents Page Introduction .
12、1 2 2.1 2.2 2.3 3 4 5 6 General Dimensions . Type I (Punched tape) Type II (Blister tape) Type III (Blister tape with dual sprocket holes for tape widths of 32 mm. 44 mm and 56 mm only) . Polarity . and orientation of components in the tape . Fixing of components and additional tape requirements . P
13、acking Marking . 1 1 2 2 4 7 10 11 13 16 Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/16/2007 00:16:48 MDTNo reproduction or networking permitted without license from IHS -,-,- JAPANESE INDUSTRI
14、AL STANDARD JIS C 0806-3 : i999 Packaging of components for automatic handling- Part 3 : Packaging of surface mount components on continuous tapes Introduction This Japanese Industrial Standard has been prepared based on IEC 60286-3 Packaging of components for automatic handling-Part 3 : Packaging o
15、f surface mount components on continuous tapes published in 1997 as the third edition with- out modification in the technical contents. In this Standard, the portions with dotted underlines or solid sidelines mean the matters not stated in the original International Standard. The IEC Standard number
16、 is based on the new numbering system of IEC Stan- dards put in force on January 1st 1997, and the Standard published before the said date is numbered by adding 60000 to the former number. This is only the change in the numbering system and the contents remain unchanged. 1 General 1.1 Scope This Sta
17、ndard is applicable to the tape packaging of electronic compo- nents without leads or with lead stumps which are intended to be connected to elec- component _._ _._._ placement _._. machines. It includes only those dimensions which are essen- tia1 for the taping of components intended for the above-
18、mentioned purposes. The components with stumped leads mean the generic name of surface mount components with lead as compared with the sur- face mount components without lead. The content of “INTRODUCTION” stated in the original Inter- national Standard IEC 60286-3 has been incorporated in the above
19、 scope. NOTE : The International Standard corresponding to this Standard is given below. IEC 60286-3 : 1997 Packaging of components for automatic handling- Part 3 : Packaging of surface mount components on continuous tapes tronic circuits. T ! ! ! ? . St_dard sP.e!ifes !kc Te(luirements. lo?. .%?e.E
20、laCka.!g. o!.automa!c Information 1 2 1.2 Normative references The following standards contain provisions which, through reference in this Standard, constitute provisions of this Standard. If the indication of the year of coming into effect or of edition is given to these referred standards, only th
21、e edition of indicated year constitutes the provision of this Stan- dard but the revision and amendment made thereafter are not applied. As for the normative references without the year of coming into effect or of edition, only the most recent edition (including the amendments) is applicable. Copyri
22、ght Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/16/2007 00:16:48 MDTNo reproduction or networking permitted without license from IHS -,-,- 2 C 0806-3 : 1999 J I S K 6999 : 1994 Plastics-Generic identific
23、ation and marking of plastic prod- ucts NOTE : IS0 11469 : 1993 Plastics-Generic identification and marking of plastic products is identical with the above standard. JIS X 0503 : 1994 Bar code symbols-CODE39-Basic specifications J I S X 9001 : 1976 Alphanumeric character sets for optical recognition
24、 IEC 60191-2 Mechanical standardization of semiconductor devices-Part 2 : Di- mensions 2 Dimensions 2.1 Bottom cover tape Direction of unreeling Fig. 1 Punched carrier tape 2.1.1 Tape width W Nominal: 8.0 mm or 12.0 mm Maximum: 8.3 mm or 12.3 mm Minimum: The sum of the minimum values of EI plus Ea;
25、the sum is 0.1 mm less than the nominal W dimension. NOTE : All dimensions are measured from the abscissa and ordinate centre lines of the sprocket holes. 2 . 1 . 2 Carrier tape thickness T Paper-based tape: Non-paper-based tape: T = 1.1 mm max. T = 1.1 mm max. NOTE : T-values up to 1.6 mm max. are
26、in existence in the market place, but in such cases no interchangeability can be guaranteed. 2.1.3 Pitch PO of the sprocket holes PO = 4.0 mm I 0.1 mm Pitch tolerance over any 10 pitches I 0.2 mm Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/11
27、11111001, User=Wing, Bernie Not for Resale, 03/16/2007 00:16:48 MDTNo reproduction or networking permitted without license from IHS -,-,- 3 C 0806-3 : 1999 2 . 1 . 4 Diameter DO of the sprocket holes DO = i.5$.I mm 2 . 1 . 5 Distances EI and E2 NOTE : See 2 . 1 . 1 for the relationship between the m
28、inimum dimensions for EI, E2 and W. 2 . 1 . 5 . 1 Distance between upper edge of tape and centre of sprocket hole Ei = 1.75 mm f 0.1 mm 2 . 1 . 5 . 2 Distance between lower edge of tape and centre of sprocket hole E2 = 6.25 mm min. for W = 8 mm E2 = 10.25 mm min. for W = 12 mm Information : Such cas
29、es that tape widths are 16 mm and 24 mm are included in the orinal International Standard IEC 60286-3. however v the tape widths of 16 mm and 24 mm are not specified in sub- clause 2 . 1 . 1 . Both the cases are deleted considering that they are erroneously entered. 2 . 1 . 6 Distance F (centre to c
30、entre) F = 3.5 mm f 0.05 mm for W= 8 aiaaaa F = 5.5 mm f 0.05 mm for W = 12 mm 2 . 1 . 7 Distance G (edge of tape to component window) G = 0.75 mm min. 2 . 1 . 8 Distance P2 (centre to centre) P2 = 2.0 mm k 0.05 mm 2 . 1 . 9 Component compartment (punched part) (dimensions AO, BO and 2) Component ti
31、lt Side or front sectional view Sketch A 20 ma. Typical cavity centre line Component planar rotation Top view Sketch B Typical component centre line dl the component can be removed from the cavity in a vertical direction without mechanical restriction after the top cover tape has been removed; the r
32、otation of the component is limited to a 10“ maximum tilt (see Fig. 2, sketch A) and a 20“ maximum planar rotation (see sketch B); NOTE : The component tilt shown in Fig. 2 sketch A is a design value. Information : the lateral movement of the component is restricted to 0.5 mm maximum (see Fig. 2, sk
33、etch Cl. NOTE : For components with either length or width dimensions less than 1.2 mm, market trends are towards a planar rotation limit of 10“ maximum and a lateral movement of 0.2 mm maximum. Preferred dimensions for components shall be taken from the relevant specifica- Dimensions AO I BO, unles
34、s otherwise specified in the component detail specifica- c) The above note is an additional item. d) tions. tion. 2.1.10 Pitch of the component compartments P l (centre to centre) The dis- tance between the centres of the component compartments shall be 4.0 mm or a multiple thereof. The tolerance sh
35、all be k 0.1 mm. 2.2 Type II (Blister tape) Carrier tape Direction of unreeling - Fig. 3 Blister carrier tape Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/16/2007 00:16:48 MDTNo reproduction or
36、networking permitted without license from IHS -,-,- 5 C 0806-3 : 1999 2.2.1 Tape width W Nominal: 8.0 mm; 12.0 mm; 16.0 mm and 24.0 mm Maximum: 8.3 mm; 12.3 mm; 16.3 mm and 24.3 mm Minimum: The sum of the minimum values of EI plus Ea; the sum is 0.1 mm less than the nominal W dimension. NOTE : All d
37、imensions are measured from the abscissa and ordinate centre lines of the sprocket holes. 2.2.2 Carrier tape thickness T T = 0.6 mm max. 2.2.3 Overall thickness T2 (including the cover tape) Tz = 3.5 mm max. for W = 8 mm T2 = 6.5 mm max. for W = 12 mm T2 = 9.5 mm max. for W = 16 mm T2 = 12.5 mm max.
38、 for W = 24 mm NOTE : Dimension T2 is limited by the bending radius requirements of 4.8 and by the feed path window of the tape transport mechanisms utilised. If T2 limits shown above are exceeded to accommodate all compo- nents, compartment pitch PI may be increased if necessary to achieve the mini
39、mum bending radius requirements of 4.8, and potential limits of tape transport mechanisms shall be recognised. 2.2.4 Pitch of the sprocket holes PO P0=4.0 mmf 0.05 mm (Pl = 2 mm) PO = 4.0 mm _+ 0.1 mm (Pl 2 4 mm) Pitch tolerance over any 10 pitches f 0.2 mm. 2.2.5 Diameter DO of the sprocket holes D
40、O = 1.5E.l mm 2.2.6 Distances EI and E2 2.2.6.1 Distance between upper edge of tape and centre of sprocket hole E1 = 1.75 mm f 0.1 mm 2.2.6.2 Distance between lower edge of tape and centre of sprocket hole E2 = 6.25 mm min. for W = 8 mm E2 = 10.25 mni min. for W = 12 mm E2 = 14.25 mm min. for W = 16
41、 mm E2 = 22.25 mm min. for W = 24 mm 2.2.7 Distance F (centre to centre) F=3.5 mmf 0.05 mm for W = 8 mm F = 5.5 mm k 0.05 mm for W = 12 mm Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/16/2007 00
42、:16:48 MDTNo reproduction or networking permitted without license from IHS -,-,- 6 C 0806-3 : 1999 F = 7.5 mm k 0.1 mm for W = 16 mm F = 11.5 mmf 0.1 mm for W = 2 4 mm 2.2.8 Distance G (flat part of the tape between the edge and the component com- partment) G = 0.75 mm min. 2.2.9 Dimension PZ (centr
43、e to centre) Pz = 2 . 0 mm k 0.05 mm for W = 8 mm and 12 mm Pz = 2.0 mm f 0.1 mm for W = 16 mm and 24 mm 2.2.10 Dimension KO The dimension KO shall be selected so that the orientation of the component cannot change in the package. 2.2.11 Component compartment (dimensions AO, BO and KO) The nominal d
44、imen- sions of the component compartment shall be derived from the relevant component specification. The tolerances on the nominal sizes of the compartment shall be se- lected so that the components cannot change their orientation within the tape and can easily be removed from the tape, with the fol
45、lowing characteristics: There shall be sufficient clearance surrounding the component so that: the component does not protrude above the top surface of the carrier tape; the component can be removed from the cavity in a vertical direction without mechanical restriction after the top cover tape has b
46、een removed; the rotation of the component is limited to a 10“ maximum tilt (see Fig. 6, sketch D), a 20“ maximum planar rotation for W = 8 mm and 12 mm and a 10“ maxi- mum planar rotation for W= 16 mm and 24 mm (see Fig. 6, sketch E); NOTE : The component tilt shown in Fig. 6 sketch D is a design v
47、alue. Information : The above note is an additional item. the lateral movement of the component is restricted to 0.5 mm maximum (see Fig. 6, sketch FI. NOTE : For components with either length or width dimensions less than 1.2 mm, market trends are towards a planar rotation limit of 10“ maximum and
48、lateral movements of 0.2 mm maximum. Preferred dimensions for components shall be taken from the relevant specifica- tions. Dimensions Ao I BO, unless otherwise specified in the component detail specifica- tion. For component sizes of 2.0 mm x 1.2 mm and larger, the cavity shall have a hole in the centre of the bottom so that the component can easily be removed, unless otherwise agreed between the supplier and the customer. The diameter DI of.this hole shall be 1.0 mm min. for tape width of 8 mm 1.5 mm min. for tape widths of 12 mm to 24 mm Inf