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1、J IS JAPANESE I N DUSTRIAL STANDARD Translated and Published by Japanese Standards Association Testing methods of surface mounting switches for use in electronic equipment ICs 31.220.20 Descriptors : switches, electronic equipment and components, performance testing Reference number : JIS C 5444 : 2
2、000 (E) 13 S PROTECTED BY COPYRIGHT Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/15/2007 20:54:07 MDTNo reproduction or networking permitted without license from IHS -,-,- c 5444 : 2000 Foreword
3、 This translation has been made based on the original Japanese Industrial Standard established by the Minister of International Trade and Industry through deliberations at the Japanese Industrial Standards Committee, as the result of proposal for establishment of Japanese Industrial Standard submitt
4、ed by the Electronic Industries Association of Japan (EIAJ)/the Japanese Standards Association (JSA) with the draft being attached, based on the provision of Article 12 Clause 1 of the Industrial Standardization Law. Attention is drawn to the possibility that some parts of this Standard may conflict
5、 with a patent right, application for a patent after opening to the public, utility model right or application for registration of utility model after opening to the public which have technical properties. The relevant Minister and the Japanese Industrial Standards Committee are not responsible for
6、identifying the patent right, application for a patent after opening to the public, utility model right or application for registration of utility model after opening to the public which have the said technical properties. For the testing methods of switches for use in electronic equipment, JIS C 54
7、41 : 1994 has been already established, but the testing methods peculiar to surface mounting switches are not specified, and such methods are not specified in JIS C 5443 : 1997 and the International Standard corresponding thereto IEC 61020-1. JIS C 5441 and JIS C 5443 which have been estab- lished a
8、nd published are in conformity with the respective International Standards. If the testing methods of surface mounting switches for use in electronic equipment are added to the above JISs, the said conformity is spoiled, therefore this Standard is established for the testing methods peculiar to surf
9、ace mounting switches in this occasion. Date of Establishment: 2000-09-20 Date of Public Notice in Official Gazette: 2000-09-20 Investigated by: Japanese Industrial Standards Committee Divisional Council on Electronics JIS C 5444 : 2000, First English edition published in 2002-07 Translated and publ
10、ished by: Japanese Standards Association 4-1-24, Akasaka, Minato-ku, Tokyo, 107-8440 JAPAN In the event of any doubts arising as to the contents, the original JIS is to be the final authority. O JSA 2002 All rights reserved. Unless otherwise specified, no part of this publication may be reproduced o
11、r utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from the publisher. Printed in Japan PROTECTED BY COPYRIGHT Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111
12、111001, User=Wing, Bernie Not for Resale, 03/15/2007 20:54:07 MDTNo reproduction or networking permitted without license from IHS -,-,- c 5444 : 2000 Contents Page Introduction . 1 2 3 4 4.1 4.2 5 5.1 5.2 5.3 5.4 5.5 5.6 5.7 5.8 5.9 Scope Normative references Definitions Standard conditions for test
13、ing Standard conditions Referee conditions . Solderability test . Purpose Tests . Specimen preparation . Initial measurements Accelerated aging . Method 1: Solder bath method at 235 “C Method 2: Solder iron method at 260 “C . Method 3: Re-flow bath method at 215 “C Recovery 5.10 Final measurements 5
14、.11 Information to be given in the detail specification . 6 6.1 6.2 6.3 6.4 6.5 6.6 Resistance to soldering heat test . Purpose Tests . Specimen preparation . Initial measurements Method 1: Solder bath method at 260 “C Method 2: Soldering iron method at 300 “C . 1 1 1 2 2 2 2 2 2 2 3 3 3 3 5 6 7 7 7
15、 7 7 7 8 8 8 8 PROTECTED BY COPYRIGHT Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/15/2007 20:54:07 MDTNo reproduction or networking permitted without license from IHS -,-,- 6.7 6.8 6.9 6.10 7 7
16、.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 7.9 7.10 8 8.1 8.2 8.3 8.4 8.5 8.6 8.7 8.8 8.9 8.10 9 9.1 9.2 c 5444 : 2000 (i;) 10 10 10 10 11 11 11 11 12 12 12 13 13 13 13 13 13 13 14 14 14 14 Method 3: Re-flow bath method at 235 “C 9 Recovery 9 Final measurements 9 Information to be given in the detail specificat
17、ion . 10 Testing method for resistance to flexure of printed board Purpose Testing printed circuit board Method for mounting the specimen to the circuit board Soldering method . Pre-conditioning . Initial measurements Test Recovery Final measurements Information to be given in the detail specificati
18、on . Method for adhesion test . Purpose Testing printed circuit board Mounting of specimen . Testing device . Pre-conditioning . Initial measurements Test Recovery Final measurements Information to be given in the detail Specification . Method for pull-off strength test Testing printed circuit board
19、 14 Purpose 14 14 PROTECTED BY COPYRIGHT Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/15/2007 20:54:07 MDTNo reproduction or networking permitted without license from IHS -,-,- c 5444 : 2000 9.3
20、 9.4 9.5 9.6 9.7 9.8 9.9 10 10.1 Mounting of specimen . 14 Pre-conditioning . 14 Initial measurements 14 Application of load . 15 Recovery 15 Final measurements 16 Information to be given in the detail specification . 16 Body strength test . 16 Purpose 16 10.2 Pre-conditioning . 16 10.3 Initial meas
21、urements 16 10.4 Test 16 10.5 Recovery 17 10.6 Final measurements 17 10.7 17 Information to be given in the detail specification . Related standards . 18 (iii) PROTECTED BY COPYRIGHT Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, Use
22、r=Wing, Bernie Not for Resale, 03/15/2007 20:54:07 MDTNo reproduction or networking permitted without license from IHS -,-,- JAPANESE INDUSTRIAL STANDARD JIS C 5444: 2000 Testing methods of surface mounting switches for use in electronic equipment Introduction This Japanese Industrial Standard speci
23、fies testing methods pecu- liar to surface mounting switches for use in electronic equipment based on relating Japanese Industrial Standards and other relating Standards. The IEC Standard number is based on the new numbering system of IEC Stan- dards put in force on January Ist, 1997, and the Standa
24、rd published before the said date is numbered by adding 60000 to the former number. This is only the change in the numbering system and the contents remain unchanged. 1 Scope This Japanese Industrial Standard specifies testing methods peculiar to surface mounting switches for use in electronic equip
25、ment (hereafter referred to as “switches ”) . Remarks : The peculiar test methods mean the following test methods: Soldering test method - Solderability test - Resistance to soldering heat test Mechanical strength test method - Test for resistance to flexure of printed board - Adhesion test - Pull-o
26、ff strength test - Body strength test 2 Normative references The following standards contain provisions which, through reference in this Standard, constitute provisions of this Standard. If the indication of the year of coming into effect is given to these referred standards, only the edi- tion of i
27、ndicated year constitutes the provision of this Standard but the revision and amendment made thereafter are not applied. The normative references without the indication of the year of coming into effect apply limiting only to the most recent edition (including amendments). JIS C O021 : 1995 JIS C 00
28、22 : 1987 JIS C 0050 : 1996 JIS C 0051 : 1994 JIS C 0054 : 1994 Basic enuironmental testing procedures Part 2 : Tests, Test B : Dry heat Basic enuironmental testing procedures Part 2 : Tests, Test Ca : Damp heat, steady state Basic environmental testing procedures Part 2 : Tests. Test T : Soldering
29、Basic enuironmental testing procedures Part 2 : Tests Test U : Robustness of terminations and integral mounting devices Environmental testing Part 2 : Tests-Test Td : Solderability, resistance to dissolution of metallization and to soldering heut of Surface Mounting Devices (SMD) PROTECTED BY COPYRI
30、GHT Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/15/2007 20:54:07 MDTNo reproduction or networking permitted without license from IHS -,-,- 2 c 5444 : 2000 Temperature 15 “C to 35 “C JIS C 5441:
31、 JIS C 5443 : JIS C 6484 : Relative humidity Air pressure 25 % to 85 % 86 kPa to 106 kPa JIS K 8101 JIS K 8839 JIS Z 3282 Temperature Relative humidity 3 Definitions Air pressure 1994 Testing methods of switches for use in electronic equipment 1997 Generic specification of switches for use in electr
32、onic equipment 1997 Copper-clad laminates for printed wiring boards-Glass fab- ric buse, epoxy resin Ethanol (99.5) 2- Prop an o1 Soft solders-Chemical compositions and forms For the purposes of this Standard in addition to the definitions speci- fied in JIS C 5443 and JIS C 5441, the following prin
33、cipal definitions apply. a) surface mounting switch shape and functions suitable for surface mounting on a printed circuit board. solder levelling An action to distribute again or partially remove the molten solder on or from a printed circuit board by applying enough heat and mechani- cal force. A
34、small sized switch which has terminals, frame b) 4 Standard conditions for testing 4.1 conditions stated in Table 1 based on 3.1 of JIS C 5441. Standard conditions The tests and measurements shall be made under the Table 1 Standard conditions 4.2 on 3.2 of JIS C 5441. Referee conditions The referee
35、conditions shall be as given in Table 2 based I 2 0 C 2 2 C I 60%to70% 1 86kPato106kPa I 5 Solderability test 5 . 1 nations. Purpose The purpose of this test is to evaluate solderability of switch termi- 5.2 a) to c) stated below as specified in the detail specification. a) Tests The test shall be c
36、arried out in accordance with either of the methods Method 1: Solder bath method at 235 “C The test method shall be as specified in 8.8.6 of JI$ C 5441. This method may be used to determine de-wetting of solder by changing the temperature of solder and the duration of dipping. PROTECTED BY COPYRIGHT
37、 Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/15/2007 20:54:07 MDTNo reproduction or networking permitted without license from IHS -,-,- 3 c 5444 : 2000 b) Method 2: Soldering iron method at 260
38、 “C This method applies to switches for which a) method 1 (solder bath at 235 OC) and c) method 3 (re-flow bath at 215 OC) are impracticable or which are soldered by means of a soldering iron. c) Method 3 : Re-flow bath method at 215 “C This method applies to switches which are subjected to re-flow
39、soldering. 5 . 3 Specimen preparation The surface to be tested shall be in the “as received” condition and shall not be touched by the fingers or otherwise contaminated. The specimen shall not be cleaned prior to the test. If required by the detail specifica- tion, the specimen may be degreased by i
40、mmersion in a neutral organic solvent at room temperature. 5 . 4 items stated below, as specified in the detail specification. a) b) c) Initial measurements The initial measurements shall be carried out on the Appearance (see 5 . 1 of JI$ C 5441) Functional operation (see 6 of JIS C 5441) Contact re
41、sistance (see 7 . 1 of JIS C 5441) d) Insulation resistance (see 7.2 of JIS C 5441) e) f, Dielectric withstand voltage (see 7 . 3 of JIS C 5441) Operating force (see 8 . 4 of JIS C 5441) 5 . 5 Accelerated aging If accelerated aging is specified in the detail specifica- tion, the switch to be tested
42、(hereafter “specimen”) shall be subjected to the acceler- ated aging by one of the procedures stated in a) to c) and then, carry out d) below. Aging 1 (steam aging) shall be as stated in 8 . 8 . 5 1) of JIS C 5441. The 1 h steam aging is carried out. The procedure Aging 2 (damp heat aging) The aging
43、 is carried out by exposing the speci- men to atmospheric conditions of a temperature 40 “C f 2 “C and a relative hu- midity of 90 % to 95 % for 10 days based on JIS C 0022. Aging 3 (dry heat aging) The aging is carried out by exposing the specimen to atmospheric condition of a temperature 155 “C k
44、2 “C for 16 h based on JIS c 0021. Recovery after aging At the end of aging, the specimen is exposed to the standard atmospheric conditions for testing for not less than 2 h and not more than 24 h. Method 1 : Solder bath method at 235 “C The test procedures shall be as given in 8 . 8 . 6 of JIS C 54
45、41. 5 . 6 . 1 Solder The solder shall be that specified in annex B of JI$ C 0050, i.e. H60A, H60S and H63 Specified in JIS Z 3282 or the solder of constituents specified in I31 of the said annex. PROTECTED BY COPYRIGHT Copyright Japanese Standards Association Provided by IHS under license with JSALi
46、censee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/15/2007 20:54:07 MDTNo reproduction or networking permitted without license from IHS -,-,- 4 c 5444 : 2000 5.6.2 Solder bath The solder bath shall be that specified in 4.6.1 of JIS C 0050, with a depth not less than 40 mm and a vo
47、lume not less than 300 ml. The bath is filled with the solder specified in 5.6.1 and kept at the specified temperature 235 O C + 5 “C. 5.6.3 Flux The flux shall be that specified in 4.6.2 of JI$ C 0050, consisting of 25 % by mass ratio of rosin and 75 % by mass ratio of 2-propanol specified in JIS K
48、 8839 or of ethanol specified in JIS K 8101. Activators other than rosin shall not be added. 5.6.4 Procedures a) Immersion into flux Hold the specimen by a holder as illustrated in Fig. 1 and immerse it into the flux at room temperature. Immerse the part of termi- nal to be tested only according to the shape of the specimen. If there is excess flux, drain it or remove it by other means. If doubt arises on the decision, make the duration of draining 60 s & 5 s. Holder Specimen % Solder bath - , Driving motor