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1、JAPANESE INDUSTRIAL STANDARD General rules for printed wiring boards k 4.7.1 Minimum spacing between conductors The minimum spacing between conductors shown i n Fig. 7 shall be as given i n Table 6, i n both of internal layer and external layer. .- Note () The minimum spacing between conductors shal
2、l be assigned according t o the working voltage, working environment, and existence or nonexistence of coating. Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/15/2007 21:18:03 MDTNo reproduction o
3、r networking permitted without license from IHS -,-,- - J I S C*5030 94 m 4933608 0538507 7b9 m 7 C 5010-1994 4.7.2 Tolerance on spacing between conductors The tolerance on spacing between conductors shall be specified i n the detail specification. 4.7.3 Spacing between through-hole w a l l and cond
4、uctor The spacing between through-hole w a l l ( g i n Fig. 8) shall be not less than 0.20 mm and subjected t o agreement between the parties concerend with delivery. Fig. 8. Sectional view of multilayer printed board (An example is shown.) va : Conductor layer 1 : Plating layer t : thickness of pri
5、nted board after plating of through hole (mm) d z : diameter of through hole after plating (mm) d : land diameter (mm) f : spacing between conductor layers (mm) g : spacing between conductor and through-hole w a l l (mm) z u 1 : external-layer land width (mm) W2: internal-layer land width (mm) 4.7.4
6、 Spacing between conductor layers The spacing between conductor layers (7) shown i n Fig. 9 shall be specified. If the conductor is roughed as illustrated in Fig. 9 (i) and ( 2 ) , this means the spacing at a portion where the spacing becomes the minimum. Necessary spacing shall be specified i n the
7、 detail specification. Fig. 9. Spacing between conductor layers Conductor Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/15/2007 21:18:03 MDTNo reproduction or networking permitted without license
8、 from IHS -,-,- - - JIS C*5010 94 4933b08 0518508 bT5 = 8 C 5010-1994 4.7.5 Distance between conductor and board edge The distance between conductor and board edge shall be at least 0.3 mm. 4.8 Land 4.8.1 Standard size of land land for component hole ( dl i n Fig. 10) complies with Table 7. It is pr
9、eferable that the standard size of Fig. 10. Land d, : land diameter (mm) * 4 : hole diameter (mm) : minimum conductor width of land mm Table 7. Standard land size Unit : mm Standard land size 0.8, 1.0, 1.3, 1.5, 1.8, 2.0, 2.5, 3.0, 3.5 4.8.2 Minimum conductor width of land The minimum conductor widt
10、h of land (win Fig. 10) due t o misalignment of land and hole shall be specified i n the detail specification. 4.8.3 Misalignment of conductor layers The misalignment of conductor layers ( h ) illustrated i n Fig. 11 shall be specified i n the detail specification. Fig. 11. Misalignment of conductor
11、 layers 4.9 Printed contacts 4.9.1 The tolerances on the distance between centers of adjacent printed contacts Tolerance on distance between centers of printed contacts ( i l ) and on the distance between centers of printed contacts at both ends ( J ) illustrated i n Fig. 12, shall be specified i n
12、the detail specification. Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/15/2007 21:18:03 MDTNo reproduction or networking permitted without license from IHS -,-,- - _ - J I S C*5010 7Y m Y733608
13、0518507 531 m 9 C 5010-1994 Fig. 12. Distance between centers of printed contacts 4.9.2 alignment of centers of front and rear printed contacts ( k ) illustrated i n Fig. 13 shall be specified i n the detail specification. Misalignment of centers of front and rear printed contacts The mis- Fig. 13.
14、Misalignment of centers of front and rear printed contacts (sectional view) Printed contact / Base material w 4.9.3 contact (zu) illustrated i n Fig. 14 shall be specified i n the detail specification. Terminal width of printed contact The terminal width of printed Fig. 14. Terminal width of printed
15、 contact 4.10 Footprint 4.10.1 i n Fig. 15, the tolerance on distance between adjacent pad centers (mi) and that on distance between centers of pads located i n parallel at both ends (M) shall be specified i n the detail specification. Tolerance on distance between pad centers In the footprint shown
16、 Fig. 15. Footprint Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/15/2007 21:18:03 MDTNo reproduction or networking permitted without license from IHS -,-,- - - - J I S Cr5010 94 M 4933608 051851
17、0 253 M 10 C 5010-1994 4.10.2 Pad width of footprint The tolerance on pad width (zu) illustrated i n Fig. 16 shall be specified i n the detail specification. Fig. 16. Pad width of footprint It-? 4.10.3 Positional tolerance of component location mark and footprint The tolerance on distance between co
18、mponent location mark and the furthest footprint (n) illustrated i n Fig. 17 shall be specified i n the detail specification. Fig. 17. Positional tolerance of component location mark and footprint . 7 .I. Component location mark I Footprint Y Reference mark I Printed board 5. Quality and characteris
19、tics 5.1 Conductor surface Conductor surface shall be free from blister, crumple, crack, raise or peeling of conductor, and a metallic piece separating from the conductor edge, and also free from scratch and dent detrimental t o practical service. There shall be neither deterioration i n color, dirt
20、 nor adhesion of foreign matters detrimental t o practical service on conductor surfaces or i n plated-through holes. If plating or coating is carried out, there shall be no exposure of base copper detrimental t o practical service. 5.2 Copper f o i l removed surface blisters or splits. The surface
21、shall be smooth and free from 5.3 Between conductors Neither dust, scratch nor uneven thickness detrimental t o practical service shall lie across the conductors. Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not f
22、or Resale, 03/15/2007 21:18:03 MDTNo reproduction or networking permitted without license from IHS -,-,- - J I S Cr5010 94 4933608 05185LL L T W 11 C 5010-1994 5.4 Defects i n laminate 5.4.1 Measling and crazing crazing which spread over conductors or through holes. Laminates shall be free from meas
23、ling and 5.4.2 Delamination, blister and lamination void There shall be no delamination, blister or lamination void i n a laminate. 5.4.3 Inclusion of foreign matter foreign matter positioned within 0.25 mm from the conductor. Laminates shall be free from any The.width of foreign matter existing bet
24、ween conductors shall not exceed 50 % of the clearance between the conductors. There shall be not more than three foreign matters with a diameter and a length 1 mm or more per one board. 5.5 Defects of solder resist (1) The solder resist shall be free from smear, peeling, pinholes and mixing of fore
25、ign matters detrimental t o practical service. There shall be no mixing of air bubbles spread over the conductors. (2) The exposure of conductive parts shall be as illustrated i n Fig. 1 . Fig. 18. Exposure of conductive part (Good) Conductor - (Bad) ponductor / ,Solder resist ,Solder resist (Good)
26、(Bad) Solder resist Solder resist Conductor (Good) (Bad) (3) The minimum finished land width ( f i ) effective for soldering resulted from misalignment of solder resist, symbol mark, etc. on the land of a printed board used for insertion mounting illustrated i n Fig. 19, shall be specified i n the d
27、etail specification. Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/15/2007 21:18:03 MDTNo reproduction or networking permitted without license from IHS -,-,- - _ - - - - J I S C*5OLO 94 M 4933608
28、 0518512 O26 M 12 C 5010-1994 Fig. 19. Overlap and blur on land I- (4) The overlap and blur “lateral direction ( q ) , longitudinal direction (SI* of solder resist, symbol mark, etc. on the footprint of a printed board used for surface mounting illustrated i n Fig. 20, shall be specified i n the det
29、ail specification. Fig. 20. Overlap and blur on footprint 5.6 Symbol mark In a symbol mark, letters, symbols, etc. shall be readable. 5.7 along the edges of periphery and holes machined after shall have a magnitude not detrimental t o practical service. defects shall be specified i n the detail spec
30、ification. Machining of periphery and hole The crack and delamination produced The permissible amount of such 5.8 Conductor pattern 5.8.1 Electrical perfectibility The conductor pattern shall be free from breaking and short circuit. 5.8.2 Conductor void The width (zu), length ( I) and number of void
31、s as illustrated i n Fig. 21 shall be specified i n the detail specification. t Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/15/2007 21:18:03 MDTNo reproduction or networking permitted without l
32、icense from IHS -,-,- , - - -_-_ J I S C*5030 94 = 4933b08 0538533 Tb2 13 C 5010-1994 Fig. 21. Conductor void 5.8.3 Residual conductor i n spacing between conductors The width (zu), length ( I ) and number of residual conductors i n spacing between conductors (e.g. projection, residual copper, etc.)
33、 illustrated i n Fig. 22, shall be specified i n the detail specification. Fig. 22. Residual conductor 5.9 Plated-through hole 5.9.1 eye or magnifier, there shall be no defects which w i l l impair the connect- ing property such as pinholes and plating voids on the cross section of plated-through ho
34、le, boundary of plated-through hole and external-layer land and joint of plated-through hole and internal-layer land. Observation by eye or magnifier When the specimen is observed by The hole shall show no trouble i n inserting the component and shall not impair solderability. 5.9.2 Observation on m
35、icrosection The microsection shall satisfy the following requirements when observed as specified i n 6.2 (microsection) of JIS C 5012. (1) The permissible value of resin smear i n the vertical microsection see Fig. 23 (i) shall satisfy the values of the equation given below. The permissible value of
36、 that i n the horizontal microsection shall be not more than 25 % of the hole circumference. where, I , , & : effective copper thickness of each side excluding the void part p m) t : overall thickness of copper at the part where void is i n question (pm) Copyright Japanese Standards Association Prov
37、ided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/15/2007 21:18:03 MDTNo reproduction or networking permitted without license from IHS -,-,- -_ J I S CS5010 94 4933608 0518514 T 9 W 14 C 5010-1994 (2) The permissible value of corner. crack, bar
38、rel crack and f o i l crack i n the vertical section see Fig. 23 (2) to (411 shall satisfy the values of the equation given below. where, ,I, : effective copper thickness of each side excluding the void part (um t : overall thickness of copper at the part where void is i n question (um) Fig. 23. Def
39、ects of through hole (1) Resin smear (Vertical microsection) (Horizontal microsection) Base material /!Resin smear (2) Corner crack (3) Barrel crack (Vertical microsection) (Vertical microsection) ie ma Corner crack L Barrel crack (4) Foil crack (Vertical microsection) Base material Ise material Cop
40、yright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/15/2007 21:18:03 MDTNo reproduction or networking permitted without license from IHS -,-,- - _ - J I S C*5010 94 W 4933608 0518515 835 15 C 5010-1994 5.
41、10 - Land The void area, remaining widths ( u ) , ( U ) and projection ( w ) due t o partial lack of land as illustrated i n Fig. 24, shall be specified i n the detk.1 specification. (1) Remaining width of land . . . F. . . . . . Fig. 24. Land (2) Remaining width at boundary (3) of land and conducto
42、r The w . . . . . . . . . . . Projection of land . I= . . . . w . . . . . 3th (20) and length ( I ) of defect on a pad as 5.11 Footprint pa illustrated i n Fig. 25 relative t o the finished width ( x , ) shall be specified i n the detail specification. The defect shall be one per one pad, and there
43、shall be no defect which impairs connecting ability with component terminat ion. Fig. 25. Footprint pad (1) Void and projection (2) Pinhole 5.12 Printed contact The defects (see Fig. 27) of printed contacts which are connected electrically illustrated i n Fig. 26 shall be specified for the portion 0
44、 and portion 0 separately. practically detrimental t o connection with the connector. Provided, there shall be no defect Fig. 26. Inspection area of printed contact Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not
45、 for Resale, 03/15/2007 21:18:03 MDTNo reproduction or networking permitted without license from IHS -,-,- - _ J I S C*5OLO 94 4933608 05L851b 771 16 C 5010-1994 Fig. 27. Defect of printed contact (1) Void and projection (2) Pinhole . . . . . . . . . . . . . . . 5.13 Plating 5.13.1 Copper plated-thr
46、ough hole The minimum thickness of copper plating on w a l l of plated-through hole shall be specified i n the detail specifica- tion. if necessary, the average thickness of plating shall also be specified. 5.13.2 Plating on printed contact The minimum thickness of gold plating and that of nickel pl
47、ating shall be specified i n the detail specification. 5.13.3 Solder plating After the fusing, the conductor surface excluding the etched end face shall be covered with solder. The thickness of solder plating before fusing shall be specified i n the detail specification. 5.13.4 Solder levelling (sol
48、der coating) The necessary portion of the conductor surface shall be covered with solder. Unless otherwise SDecified. H63A or H60A specified i n JIS Z 3282 shall be used as the solder. 5.14 Characteristics The characteristics are specified i n Tables 8 t o 11. specification. Necessary characteristic values shall be specified in the detail Copyright Japanese Standards Associatio