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1、J I S ZX3853 92 m 4933608 0532332 T59 m , a e JAPANESE INDUSTRIAL STANDARD Standard qualif ication procedure for micro soldering technique JIS Z 3851-1992 Translated and Published by Japanese Standards Association UDC 621.791.35 Printed in Japan 9s Copyright Japanese Standards Association Provided b
2、y IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/14/2007 22:39:51 MDTNo reproduction or networking permitted without license from IHS -,-,- J I S Zt385L 92 W 4933608 05l121L3 995 W e In the event of any doubt arising, the original Standard in Japane
3、se is to be final authority. e Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/14/2007 22:39:51 MDTNo reproduction or networking permitted without license from IHS -,-,- J I S Z*3851 92- 4933608 05
4、12114 821 JAPANESE INDUSTRIAL STANDARD Standard qualification procedure for micro soldering technique UDC 621.791.35 J I S Z 3851-1992 1. Scope its acceptance criteria in the micro soldering technique qualification for the electrical appliances, the electronic equipment, the communication equipment,
5、 assembly of their components, or the like where tin-lead soldering is employed, with the exception of the micro soldering by means of the automatic soldering machine. This Japanese Industrial Standard specifies the testing method and Remarks: The standards cited in this Standard are shown in Attach
6、ed Table 1. 2. Definitions For the purpose of this Standard, the following definitions shall apply. (3) (4) (7) (8) 3. micro soldering micro electronic part (whose size is below several millimeters) to general printed circuit boards, terminals, wires or the like. preflux Coating forming agent to pre
7、vent oxidization of copper surfaces of printed circuit boards where soldering may be achieved as it is without removal of the coating. overhang cuit pattern, or the condition where solder hangs down over the undesired part on the side of terminals and the like. protrusion shape on the surface of the
8、 part jointed by soldering. pinhole which is through to the inner cavities. pit - soldering. bridge ductive passage. through hole through - connec ti on. Generic terms of the technology to achieve soldering of a The condition where solder hangs down over the section of a cir- Generic terms of protru
9、sions of a lump, a horn or an icicle A small hole in the surface of the part jointed by soldering, A small hole or a deep cavity on the surface of the part jointed by Solder bonded over the conductors to constitute an electrically con- A hole provided on the printed circuit board to make Types of te
10、sts The classifications of tests and types of tests shall conform to Table 1, and the symbols to be used shall also conform to the Table 1. Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/14/2007 2
11、2:39:51 MDTNo reproduction or networking permitted without license from IHS -,-,- J I S ZX385L 92 m V933b08 05L2LL5 7b8 m 2 Z 3851-1992 Table 1. Classification and kinds of tests Classification of tests Micro soldering of printed circuit board Micro soldering of terminal Micro soldering of printed c
12、ircuit board for surface mounting Kinds of tests _ _ _ _ _ Micro soldering test of printed circuit board Micro soldering test of turret terminal Micro soldering test of hook terminal Micro soldering test of forked terminal Micro soldering test of cup terminal Micro soldering test of perforated termi
13、nal Micro soldering test of printed circuit board for surface mounting Symbol PS BT-S (l) BT-W (I) CT Test specimen Plated through hole type or non-plated through hole type both sides copper laminated plate fitted with electronic parts. Turret terminal fitted with wire. Hook terminal fitted with wir
14、e. Forked terminal fitted with wire. Cup terminal fitted with wire. Perforated terminal fitted with wire. SM 4. 4. One side copper laminated plate fitted with electronic parts. I Note (I) -S means one wire to be fitted. -W means two wires to be fitted. Test specimens Materials to be used for the tes
15、t specimens 4.1.1 for test specimens such as printed circuit boards, electronic parts, terminals, wires, etc. are as shown in Table 2. Components to be used for the test specimens Components to be used Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employ
16、ees/1111111001, User=Wing, Bernie Not for Resale, 03/14/2007 22:39:51 MDTNo reproduction or networking permitted without license from IHS -,-,- N a, J I S ZX385L 72 = 4733bO8 0512LLb bT4 3 Z 3851-1992 rl I A Cu t - w u k n 0 U rn .C 0 3 a E a (o rl c .- rl - cb O d (o u s c .- z !E 2 o a rn al a a k
17、 U m * m O U CG 3 5 .- h c E O o e 180 winding I I I I I I I I I I I l I 180winding l .16 stranded wire; a a e a Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/14/2007 22:39:51 MDTNo reproduction
18、or networking permitted without license from IHS -,-,- J I S Z*3851 72 4933608 0532124 770 1 11 Z 3851-1992 Fig. 10. Soldering l I I -1 Hook terminal (single) of hook terminal Hook terminal (double) Fig. 11. Soldering of forked terminal Forked terminal (single) Forked terminal (double) L1910.203 str
19、anded wire; 180 winding Fig. 12. Cup terminal I I l I I l I I I I I I I I I L1910.203 stranded wire; 180 winding Soldering of cup terminal 11910.203 stranded wire Fig. 13. Perforated terminal Soldering of perforated terminal L1910.16 stranded wire Copyright Japanese Standards Association Provided by
20、 IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/14/2007 22:39:51 MDTNo reproduction or networking permitted without license from IHS -,-,- J I S Z*3851 72 D 4733608 0512125 b07 D 12 Z 3851-1992 Fig. 14. Components mounting figure of printed circuit
21、board for surface mounting Ri i #1 iiiiinirnnninaiiiii 11.111111111111111111111 R g ml Rio ml SOP Remarks: Symbols in the figure show the symbols of the compo- nents in Table 2. a a 5. Testing method and acceptance criteria 5.1 Testing method the soldering connecting part shall be visually examined
22、for the defects by using a microscope or a magnifying glass of about 10 times magnification. The testing method shall be the appearance test, and 5.2 Acceptance criteria The acceptance criteria shall be as follows. (1) Items regarding the printed circuit board and the parts fitting (a) (b) (c) The p
23、olarity error of the fitting polarity parts shall not be found. Remarkable inclinations or out of position of the fitting parts shall not be found. Remarkable damages of the fitting parts shall not be found. shall not be found. (d) Breakage or separation of the pattern on the printed circuit board a
24、 (e) (f) (g) Burning or scorching of the printed circuit board shall not be found. Remarkable damages of the printed circuit board shall not be found. Disturbances of the twisting or damages where the base material is ex- posed shall not be found on the element wire wound around the ter- minal. (2)
25、Items regarding the connecting part (a) (b) The bridge which may cause the electrical contact between the solder- ing connecting parts shall not be found. Cracks, separations or disconnections in the soldering connecting part shall not be found. Copyright Japanese Standards Association Provided by I
26、HS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/14/2007 22:39:51 MDTNo reproduction or networking permitted without license from IHS -,-,- J I S ZU3851 92 m 4933608 051212b 543 m 13 Z 3851-1992 (c) (d) (e) Overheating connected parts shall not be foun
27、d. No parts connected at low temperature shall be found. The solder at the connected parts shall be sufficient in quantity so as to cover the whole surface of the elements in the connecting area. In any case, the quantity shall not be such that the outer shapes of the leads and the wires can not be
28、identified as the wire line. circuit board shall not be found. No scratches, protrusions, pinholes, blow holes, pits, scattered solder, flux residues or other foreign matters shall be found at the soldering connected parts. Overhangs exceeding the edge of the circuit part of the printed (0 Copyright
29、 Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/14/2007 22:39:51 MDTNo reproduction or networking permitted without license from IHS -,-,- JIS Z*3851 92 4933608 0512127 48T 14. 2 3851-1992 Attached Table 1.
30、 Cited Standard JIS C 0050-Basic environmental testing procedures part 2: tests, test T: JIS C 0053- Basic environmental testing procedures test Ta: soldering JIS C 5130-General rules of fixed ceramic capacitors for use in electronic JIS C 5143- Fixed tantalum electrolytic chip capacitors with solid
31、 electrolyte JIS C 5222-Fixed metal film chip resistors rectangular type for used in soldering solderability testing by the wetting balance method equipment for use in electronic equipment electronic equipment (form 72 and 73, characteristic F, G and H, grade C) ment epoxy resin fiber fabric base, e
32、poxy resin base, epoxy resin phenolic resin JIS C 6406-Fixed carbon composition resistors for use in electronic equip- JIS C 6482-Coppr-clad laminates for printed wiring boards - paper base, JIS C 6483- Copper-clad laminates for printed wiring boards - synthetic JIS C 6484-Copper-clad laminates for
33、printed wiring boards - glass fabric JIS C 6485-Copper-clad laminates for printed wiring boards - paper base, JIS C 9211- Electric soldering irons JIS H 3130-Copper beryllium alloy, phosphor bronze and nickel silver- JIS H 3250-Copper and copper alloy-rods and bars JIS K 1107-High purity nitrogen JI
34、S K 8101-Ethanol (99.5) (ethyl alcohol (99.5) JIS K 8839- 2-propanol JIS 2 0701- Silicagel desiccants for packaging JIS 2 3282- Soft solder JIS 2 3283- Resin flux cored solders sheets, plates and strips for springs Copyright Japanese Standards Association Provided by IHS under license with JSALicens
35、ee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/14/2007 22:39:51 MDTNo reproduction or networking permitted without license from IHS -,-,- a a a J I S Z+3853r 92 m 4933608 05l12128 3Lb Z 3851-1992 Edition 1 Japanese Text Established by Minister of International Trade and Industry D
36、ate of Establishment: 1992-10-01 Date of Public Notice in Official Gazette: 1992-10-26 Investigated by: Japanese Industrial Standards Committee Divisional Council on Welding This English translation is published by: Japanese Standards Association 1-24, Akasaka 4, Minato-ku, Tokyo 107 Japan O JSA, 1993 Printed in Tokyo by Hohbunsha Co., Ltd. Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/14/2007 22:39:51 MDTNo reproduction or networking permitted without license from IHS -,-,-