《JIS-C-5014-1994-R2004-ENG.pdf》由会员分享，可在线阅读，更多相关《JIS-C-5014-1994-R2004-ENG.pdf（42页珍藏版）》请在三一文库上搜索。
1、UDC 621.3.049.75-41 9 JIS JAPANESE INDUSTRIAL STANDARD Multilayer printed wiring boards Translated and Published by Japanese Standards Association Printed in Japan 22 s Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie
2、 Not for Resale, 03/13/2007 00:48:21 MDTNo reproduction or networking permitted without license from IHS -,-,- J I S CX50L4 94 4933608 0539489 800 In the event of any doubt arising, the original Standard in Japanese is to be final authority. Copyright Japanese Standards Association Provided by IHS u
3、nder license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/13/2007 00:48:21 MDTNo reproduction or networking permitted without license from IHS -,-,- J I S CM5034 74 W 4733608 0537470 522 W UDC 621.3.049.75-419 JAPANESE INDUSTRIAL STANDARD J I S Multilayer printed w
4、iring boards C 5014-1994 1. Scope used for electronic apparatus (hereafter referred to as “printed boards“). However, this Standard is not applicable to multilayer flexible printed wiring board, multilayer rigid to flexible printed wiring board and metal-cored printed wiring board. This Japanese Ind
5、ustrial Standard specifies multilayer printed wiring boards mainly c - Remarks: 1. The following Standards are cited in this Standard: JIS C 5001 General rules for electronic components JIS C 5012 Test methods for printed wiring boards JIS C 5603 Terms and definitions for printed circuits JIS C 6480
6、 General rules of copper-clad laminates for printed wiring boards 2. The International standards corresponding to this Standard are given below: IEC 326-3 (1991) Printed boards. Part 3: Design and use of printed boards IEC 326-6 (1980) Printed boards. Part 6: Specification for multilayer printed boa
7、rds 2. Definitions JIS C 5603, the following principal definitions apply: For the purpose of this Standard in addition to the definitions in JIS C 5001 and insertion mounting component holes provided on a printed board and electrically connected. Such a mounting method that terminals of a component
8、are inserted into foil crack vicinity of the through-hole plating. The crack of copper foil connected with a plated-through hole that appears in the Insulating board reference mark position of the board. The mark attached to a corner of printed board for determination of correct component positionin
9、g mark position relative to the reference mark on a printed board. The mark which is provided for determination of component ! Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/13/2007 00:48:21 MDTNo
10、 reproduction or networking permitted without license from IHS -,-,- J I S C*5014 94 D 4933608 0539493 469 D 2 C 5014-1994 3. Grade with in this Standard are given below. The grades which express the precision and quality of patterns on printed board dealt These grades are used in such a way that a
11、necessary grade is selected on each item to be specified. The provisions in which no classification by grade is specified shall apply to a l l the classes. Class I A class for which normal level is required. Class II A class for which a high level is required. Class III A class for which a specially
12、 high level is required. 4. Design standard and tolerance thereon 4.1 Grid dimensions 4.1.1 Basic grid standard, and the grid of inch system shall be used only when compatibility with the traditional product is necessary. As for grids of piinted boards, the grid of metric system shall be used as the
13、 For basic grid dimensions, the following dimensions shall be used: Basic grid dimension of metric system: 2.50 mm Basic grid dimension of inch system: 2.54 mm 4.1.2 Auxiliary grid following dimensions shall be used. If grid dimension smaller than that of basic grid of 4.1.1 is necessary, the Grid o
14、f metric system: unit of 0.5 mm (if further smaller unit is necessary, unit of 0.05 mm shall be employed) Grid of inch system: unit of 0.635 mm 4.2 Reference line provided. A reference line composed of at least two holes or a pattern shall be The reference line shall lie on the grid and should prefe
15、rably lie inside of the visible outline. 4.3 External dimensions 4.3.1 External dimensions printed board employing the copper clad laminate specified in JIS C 6480 should have the external dimension by which the board can be efficiently arranged in the panel dimensions given in Table 1. It is prefer
16、able that the dimension of each side in the outline of Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/13/2007 00:48:21 MDTNo reproduction or networking permitted without license from IHS -,-,- J I
17、 S Cr5014 94 W 4433608 0539492 3T5 W Dimensions of laminate 3 C 5014-1994 Number of divisions I I I Table 1. Panel dimensions Unit: mm 4 6 8 9 For a dimension exceeding 100,0.2 shall be added per a dimen- sional increase up to 50. 1OOOx 1000 I 500x500 I 333 x500 I 250 x500 I 333 x 333 For a dimensio
18、n exceeding 100, 0.1 shall be added per a dimen- sional increase up to 50 1OOOx 1200 1 500x 600 1 333 x 600 I 500x300 500 x 400 333 x 400 4.3.2 Tolerances on external dimensions specified in Table 2. The tolerances on external dimensions shall be as Table 2 is also applicable to the dimensions of sq
19、uare holes machined at the same time with the outline machining. Table 2. Tolerances on external dimensions Unit: mm External dimension Up to and including 100 Over 100 Class I I II -10.4 -10.2 4.4 Total board thickness III M. 1 For a dimension exceeding 100, 0.05 shall be added per a dimensional in
20、crease up to 50. 4.4.1 Total board thickness and tolerance solder resist and symbol mark shown in Fig. 1 and the tolerances thereon shall be as given in Table 3. The total board thickness (r) including the plating, t Copyright Japanese Standards Association Provided by IHS under license with JSALice
21、nsee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/13/2007 00:48:21 MDTNo reproduction or networking permitted without license from IHS -,-,- J I S C*5034 94 4933608 0539493 233 0.6 () 0.8 1 .o 1.2 4 C 5014-1994 110.2 k0.23 Fig. 1. Total board thickness Symbol mark M.19 f10 % Solder
22、 resist 39.15 f8 % Table 3. Total board thickness and tolerance Unit: mm thickness I l - 0.4 () M.25 2.0 or more t +13 % 1.6 Class II I III -0.05 - I +Oa1 -r- a.15 M.12 M.17 k0.13 Note () The nominal values are subjected to agreement between the parties concerned with delivery. 4.5 Hole 4.5.1 Distan
23、ce between hole and board edge of a hole and the edge of board as illustrated in Fig. 2, shall be not less than the board thickness (t) of the printed board. The minimum distance (d) between the inner wall Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Em
24、ployees/1111111001, User=Wing, Bernie Not for Resale, 03/13/2007 00:48:21 MDTNo reproduction or networking permitted without license from IHS -,-,- - J I S C*5034 94 m 4933608 0539494 178 m Lon tu din al dimension of printed board (0 1 1400 400 1 5 C 5014-1994 Class I II III 0.25 0.15 0.10 For a dim
25、ension exceeding 400, 0.05 shall be added per a dimensional increase up to 100. Fig, 2. Distance between hole and board edge d 2 t 4.5.2 Position of hole lines (including auxiliary grid). The allowable deviation ( El) of a hole from its position specified in the design by means of coordinates employ
26、ing the reference hole as the original point shown in Fig. 3 shall be as given in Table 4. However, via holes are out of subject. It is preferable that the center of a hole lies at the intersection of grid Fig. 3. Position of component hole finishing Reference y Visual outline of printed board Table
27、 4. Tolerances on position of component hole based on reference hole Unit: mm t Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/13/2007 00:48:21 MDTNo reproduction or networking permitted without l
28、icense from IHS -,-,- J I S C*50/4 94 4933608 0539495 004 With through- hole plating and excl. 2.0 0.6 or over to 2.0 or over Without through-hole plating 6 C 5014-1994 M.15 ko.10 m . 0 8 M.20 110.15 s.10 H. 15 m. 10 m . 0 5 4.5.3 Tolerance on diameter of component hole holes shall be as given in Ta
29、ble 5. However, these tolerances are not applicable to via holes. The tolerances on diameters of component Distance between hole centers (d) d , 1 Length of residual conductor 1 Number of conductors 23 C 5014-1994 Class I II III Not more than Not more than Not more than 30 % of spacing between betwe
30、en between conductors conductors conductors 0.3 mm max. 25 % of spacing 20 % of spacing 0.2 mm max. Not more than spacing between conductors Not more than three pieces between adjacent conductors and three pieces within 100 mm x 100 mm Not more than one piece between adjacent conductors and two piec
31、es within 100 mm x 100 mm Table 33. Residual conductor 5.6 Land The void area, remaining widths (m and n) and projection (w) due to partial lack of land as illustrated in Fig. 17, shall be as specified in Table 34. Fig. 17. Land (a) Remaining width of land (b) Remaining width at (c) Projection of la
32、nd boundary of land and conductor Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/13/2007 00:48:21 MDTNo reproduction or networking permitted without license from IHS -,-,- J I S C*5034 94 4933608
33、0539533 95T Item 24 C 5014-1994 I I Table 34. Void area, remaining width and projection of land Remaining width due to partial lack of land I Class m No shortage which reaches plated- Remaining width of through hole land including plating shall be not less than 0.05 mm Projection of land I w As spec
34、ified in width w of remaining conductor in Table 33 in 5.5.8 (2) II III Ratio of void area to land area I 30 % max. I 20 % max. I 10% max. As specified in width w of conductor void in Table 32 in 1 1 5.5.8 (1) 5.7 Plated-through hole 5.7.1 requirements when observed by eye directly or through a magn
35、ifier: Observation by eye or magnifier The plated-through hole shall satisfy the following (1) Plated-through holes shall be free from inclusion of any sort that could affect component insertion and solderability. The size of plating void in a plated-through hole shall not exceed 25 % of the hole ci
36、rcumference in the horizontal plane nor 25 % of the thickness of the board in the vertical plane. Total area of voids shall not exceed 10 % of the total inside wall area of plated-through holes. Holes with plating voids shall not exceed 5 % of the total number of plated-through holes. (2) There shal
37、l be no defect which impaires electrical continuity such as pinholes and plating voids at the boundary of the plated-through hole wall and the external-layer land, and at the connecting part of plated through hole and internal layer land. 5.7.2 Observation on microsection when observed as specified
38、in 6.2 (microsection) of JIS C 5012. The microsection shall satisfy the following requirements (1) The permissible value of resin smear in the vertical microsection see Fig. 18 (i) shall satisfy the values of the equation given bclow. The permissible value of that in the horizontal microsection shal
39、l be not more than 25 % of the hole circumference. Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/13/2007 00:48:21 MDTNo reproduction or networking permitted without license from IHS -,-,- J I S C
40、X50l14 94 = 4933608 05l195L4 896 25 C 5014-1994 1, + 1, t where, 1, + 1, : effective copper thickness of each side excluding the void part am) t : overall thickness of copper at the part where no void is in question Olm) (2) The permissible value of corner crack, barrel crack and foil crack in the v
41、ertical section see Figs. 18 (2) to ( 4 ) shall satisfy the values of the equation given below. 1, + 1, t where, I, + I , : effective copper thickness of each side excluding the void part um) t : overall thickness of copper at the part where no void is in question am) Fig. 18. Defects of through hol
42、e (1) Resin smear (Vertical microsection) material Resin smear (Ho ri zont al microsection) Land Plated-through hole Resin smear Hole Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/13/2007 00:48:2
43、1 MDTNo reproduction or networking permitted without license from IHS -,-,- J I S CX5014 94 = 4933608 0519515 722 26 C 5014-1994 Fig. 18. (continued) (2) Corner crack (Vertical microsection) I comer crack Base material (3) Barrel crack (Vertical microsection) Barrel crack Base material (4) Foil crac
44、k (Vertical microsection) 5.8 Footpint Pad shall be as given in Table 35 in relation with finished width (p). The defect shall be one per pad. The width (w) and length (I) of defects on a pad as illustrated in Fig. 19, Copyright Japanese Standards Association Provided by IHS under license with JSALi
45、censee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/13/2007 00:48:21 MDTNo reproduction or networking permitted without license from IHS -,-,- J I S C*5034 94 m 4933608 O539536 669 m I tem Void and Width w protrusion I ( 1 2 ) Length I 27 C 5014-1994 Width of pad 0.81 or more 0.41
46、to 0.80 0.40 0.30 0.20 To satisfy 0.06 max. 0.045 max. 0.040 max. the provision of 5.5.8 1 max. Fig. 19. Pad Pinhole (major axis I ) (a) Void and projection P 0.06 max. 0.045 max. 0.040 max. I I I I l 5.9 Printed contact 5.9.1 Printed contact electrically connccted printed contact electrically conne
47、cted shown in Fig. 20 shall be as specified in Table 36. The defects (see Fig. 21) at part and part of Fig. 20. Inspection (b) Pinhole . . . . . . . . . . . . . . . area of printed contact II)I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
48、. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/13/2007 00:48:21 MDTNo reproduction or networking permitted without license from IHS -,