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1、RSP-6100S系列液态感光阻焊油墨RSP-6100S Liquid Photoimageable Solder Mask 一、 产品介绍Introduction of product 感光型RSP-6100S/HD-20绿油是一种两液型之碱溶性液态感光阻焊油墨，适应网印、帘涂；用于高精密度及多层印刷电路板防焊制作。具附着力强、密着性高、耐高温不变色、能做沉镍金或沉锡、沉银、喷纯锡、塞孔、绿油桥等工艺。此系列油墨属欧洲环保认证油墨。RSP-6100S /HD -20 is liquid photoimageable solder mask . It is two-component and
2、alkali soluble with good screen printing and curtain coating adaptability ; Its usually used in manufacturing High-precision and multi-layer printed circuit board . The post cured film provides excellent adhesion and adherence , resistance to heat and discoloration , available for processes of immer
3、sion Ni-Au , immersion tin or silver ; Lead Free HAL , hole plugging , green ink bridging , etc .This kind of serial ink has received UL certification .二、产品型号Type of product 型 号Type of ink 颜 色Color型 号Type of ink颜 色ColorRSP-6100S G-5特浅绿Extra light greenRSP-6100S Y-H浅 黄Light yellowRSP-6100S G-6浅 绿Ligh
4、t greenRSP-6100S Y-B中 黄Medium yellowRSP-6100S G-7中 绿Medium greenRSP-6100S Y-HR深 黄Deep yellowRSP-6100S G-8中 绿Medium greenRSP-6100S BL蓝 色BlueRSP-6100S G-9深 绿Deep greenRSP-6100S W白 色WhiteRSP-6100S G-10最深绿Extra deep greenRSP-6100S P紫 色PurpleRSP-6100S G-Y哑 绿Green and mattRSP-6100S BK黑 色BlackRSP-6100S R红
5、色RedRSP-6100S BK-Y哑 黑Black and matt 备注：详情请参考本公司色板卡。 Notes : please refer to color board in our company for details .二、 油墨特性Properties of ink1、特性 Properties项 目Items规格值Specification备 注Notes主剂BaseRSP-6100SRSP-6100S粘稠状Viscous硬化剂HardenerHD-20A/B/CHD-20A /B/C粘稠状Viscous混合比例Mixing ratio主剂：硬化剂 = 750：250Base/
6、hardener =750:250重量比Weight ratio混合粘度Viscosity after mixing17040PS17040psVT-04粘度计（25）VT -04 viscometer (25)不挥发成份Solid content75-78wt%75-78wt%主剂和硬化剂混合后Measured after mixing预烘范围Pre-baking limit75/60分钟75/60min最大极限Maximum boundary适当曝光能量Exposure energy300-500mj/cm2300-500mj /cm2油墨表面所接受的能量Energy accepted b
7、y surface of ink混合后保存期Pot life after mixing24小时24 hours25以下阴暗处保存Store below 25 in dark保存期限Shelf life制造后6个月6 months since the date of manufacture25以下阴暗处保存Store below 25 in dark2、预烤范围Pre-baking limit7530分钟30min40分钟40min50分钟50min60分钟60min显影Development 显影条件：1%Na2CO3,30,50-60秒，2.0kg/cm2,“”表示OK Requiremen
8、t for development : 1%Na2CO3 ，30，50-60sec，2.0kg/cm2, “” means ok. 3、设置试验（经7525分钟预烤后）Put to test (After 7525min pre-baking )时间Time12h24h36h48h显影Development 静置环境：25，60%RH, “”表示OKEnvironment for holding : 25 , 60%RH , “”means ok. 4、感光性Photosensitivity项目Items油墨厚度Thickness of ink曝光能量Exposure energy显影时间De
9、velopment time曝光格数Exposure grid number21階曝光试验21 steps exposure test15-25m300mj/cm2400mj/cm2500mj/cm250-60sec9-1010-1111-12四、硬化后之特性Properties after post cured项 目Items试验方法Test method结 果Results附着性AdhesionJISD0202 8.12 百格试验Laceration experiment , JISD0202 8.12100/100铅笔硬度Pencil hardnessJIS K5400 6.14 刮痕以
10、不露铜为准Standard of Cu not exposed by scratching JISK 5400 6.146H以上6H耐热性Resistance to molten solder焊锡炉试验，松香系列助焊剂 288、10秒3次28810sec3times , solder furnace test , rosin soldering flux OK耐酸性Acid resistance25，10 wt% H2SO4 浸泡30分钟 胶带剥离试验25, saturated for 30min in 10wt% H2SO4 ,peeling adhesive strip testOK耐碱性
11、Alkali resistance 25，10 wt% NaOH 浸泡30分钟 胶带剥离试验25,saturated for 30min in 10wt% NaOH ,peeling adhesive strip testOK耐化性Chemical resistance88/20min Paragon 之NIMUDEN SX（沉镍）88/20min Paragon 之ELGB 5H（沉金）88/20min Lea Ronal之Ranamax SMT(ENIG)OK绝缘性Insulation resistanceIPC梳型（B面板）25，65%RH，500V/MINIPC comb-type (
12、B side board) 25,65%RH ,500V /MIN5.01012可焊性SolderabilityIPC-SM-840BOK耐燃性Resistance to flameUL 94V-0OK 此资料为本公司试验结果，不作为保证之用。The values above are based on experiments in our lab , not for commitment . 适宜条件，需参照技术资料，待贵司实施确认后，再予以确定。Proper conditions must refer to technological data , it needs to be carrie
13、d out for any company in order to get useful data . 五、流程及参数Procedure and Parameter1、 开油Mixing and preparation将主剂、硬化剂按照3：1之比例充分混合后，搅拌1-2分钟、震荡10-15min，使油墨粘度稳定后再进行使用。Completely stir for 1-2min with 10-15min concussion after mixing base and hardener according to the ratio 3 to 1 , in order to get homoge
14、neous mixture , it can be put to use as the viscosity of ink stable .2、 基板前处理Pre-treatment of board机械磨刷和酸处理，让基板干净干燥（水膜15秒以上，磨痕在10-15mm）。Mechanical polish-brush and acid treatment make board clean and dry (water film for 15sec or more, grinding crack for 10-15mm).3、 网版印制Screen printing（1） 丝网：36T或43T之
15、尼龙丝网或多元脂网（采用斜网最佳）。（2） 刮刀：60-75度、弹性良好、边缘税利之刮刀。（3） 刮刀角度：60-75度（刮刀与板面夹角）。（4） 涂膜厚度：15-25m（最低处10m以上）。1) Screen : Nylon screen or poly-ester screen of 36T or 43T ( angle screen has the best adaptability)2) Blade : blade of 60-75 degree , with good elasticity and sharp edge .3) Angle of blade : 60-75 degre
16、e ( the angle between blade and board)4) Coating thickness : 15-25 (over 10 at the lowest location)4、 预烘烤 Pre-baking（1） 丝印后需静置15-20min以后再烤。（2） 第一面：755、烘烤15-20min，第二面：755、烘20-30min，两面同时烘烤：25-45min；1) Holding for 15-20min after screen printing , then prepare for pre-baking .2) Side A : 755, baking for
17、 15-20min , Side B : 755, baking for 20-30min , Side A and Side B baking at the same time : 25-45min; 备注：若为隧道式烤箱需根据设备性能调节温度和时间。Notes :Adjusting temperature and time is necessary according to equipments if tunnel drier is used .5、 曝光 Exposure曝光机能量300-600mj/cm2,灯源有效UV波长300-500nm，21级曝光尺9-12级（最好控制在11级）E
18、xposure meter energy 300-600mj /cm2 , effective UV wavelength from lamp : 300-500nm , 21grade exposure ruler limits 9-12 grade (11 grade is the best one). 6、 显影Development使用0.8-1.2%之无水碳酸钠溶液，压力1.5-2.5kg/cm2，温度28-32，时间50-60sec。Developer :0.8-1.2wt% Na2CO3 solution , spray pressure : 1.5-2.5 kg/cm2 , t
19、emperature :28-32 , time :50-60sec.7、 后烘烤 Post curing在热风循环烘箱1505条件下，烘烤60-70 min。Hot air convection oven recommendable : 1505 , baking time :60-70min 备注：若为塞孔板或厚铜板需分段烘烤。 Notes : Its necessary for tap hole or thick copper board to be baked in segment. 六、注意事项：Attention1. 本品请在无尘及温度10-25，相对湿度50-70%RH场所贮存和
20、操作，使用黄色灯光，避免在白色电灯或日光（无论直接或间接）下操作。Storage and operation environment request: operate in dust free workshop where the temperature is 10-25 and the humidity is 50-70% RH , if you use ink directly or indirectly under the white light or sunlight , it can cause ink to react , please work in yellow light o
21、r non-UV light .2. 本制品应尽可能原样使用，若有必要调粘度，则务必使用我司专用开油水，比例控制3-5%以内，若采用其它稀释剂请先做匹配实验。Ink must be used as its initial state ,if viscosity is not proper ,we will offer you special diluent to dilute the ink within the ratio of 3-5%, please do matching experiments ,if you adopt other diluent .3. 本制品混合以后，请在24小
22、时内使用，开油时，应先用人工搅拌1-2min，再用机搅拌。Please finish process in 24hours after mixing . Stir fully manually before 1-2min machine mixing.4. 基板的表面处理对阻焊油墨是否能够充分发挥其性能具有关键性影响。为确保印刷板表面在印制前彻底清洁及无氧化层，应分别或同时对之进行化学微蚀和机械磨刷处理，确实清除基板表面之氧化物及油、脂类或其它污染物质，再经充分水洗并完全烘干，避免手指接触且尽快施以防焊印刷以免造成油墨之附着力不良或绝缘、阻焊的性能下降。对于金板，前处理可采用软磨刷（1000目
23、以上的磨刷）和柠檬酸浸泡或喷淋的方式。并要特别注意前处理设备在水洗段以后的保养工作，以防止板面的二次污染。Surface treatment of board has critical influence to full optimal properties of solder mask .Do chemical soft-etching and mechanical brush treatment to printed board surface ,in order to ensure it absolutely clean and no oxide layer before printin
24、g , clean oxidation , oil , grease and other contamination on board ,then water rinse and bake it completely , meanwhile ,avoid finger contact and solder printing must be done as soon as possible lest reducing properties of adhesion ,insulation ,solder .As to aurum board ,adopt soft-brush (above 394
25、T ) and saturated in citrate acid or spraying for pre-treatment .Especially pay attention to maintenance for pre-treatment equipment after water rinsing section , for the sake of avoiding secondary contamination on board .5. 曝光能量会因基板及油墨厚度的不同而变更，请进行试验以确认侧蚀程度、表面光泽度及背面感光程度后再认定，曝光尺控制在9-12级残膜。Change expo
26、sure energy according to different board and thickness of ink ,identification rely on experiment of under cut extent ,surface glossiness and back surface sensitization degree ,exposure ruler limits 9-12 grade remnant film .6. 对显影液浓度及温度、喷嘴压力、时间等进行充分管理，管理不充分易造成油墨显影性的低下或侧蚀和起泡，另显影机喷嘴也须定期清洗，以保证设备使用时可达到正常
27、显影冲洗的效果。Completely manage concentration , temperature , spray pressure , time etc of developer , otherwise , developing property of ink gets worse or under cut and vacuole , developer nozzle must frequently rinse , ensure optimum developing effect while using equipments . 7. 涂覆后需在48小时内显影，若操作场所温湿度较大，
28、需在12小时内完成作业。Development complete in 48 hours after coating film , if there is ample humidity in workshop , it must be finished within 12 hours.8. 若不慎接触皮膜或眼睛，须立即以肥皂及大量清水冲洗，切勿使用任何溶剂清洗。Wash immediately with soap and plenty of running water if skin or eyes contact it carelessly , do not use any solvent
29、.9. 本制品属于可燃物，请勿于有烟火处放置和使用。This type of ink is flammable , avoid ignition sources when storage and operation.RSP-6100S感光防焊油墨常见问题及改正措施RSP-6100S Liquid Photoimageable Solder Mask FAQ and answers常见问题Frequet apparet questions现 象Phenomenon可能原因Possible reasons对 策Methods 一、油墨不均Ink inhomogeneous板面油墨无法均匀附着，成点
30、状条状或片状油墨白点（无法下墨）Ink can not adhere to board uniformly with spot , strip or slice ink white spot (no printing)1、混合时间不足2、油墨混合错误3、板面油渍或水渍残留（前处理不洁）4、油墨杂质（胶带油渍混入而破坏表面张力）5、刮刀片材质不良6、网版清洗不洁7、油墨混合后过期使用1.Mixing time is not enough.2.Mixing ink takes mistake.3.Grease or water remnant on board (not well pre- tre
31、atment ) 4.Ink impurity (bring in adhesion grease to destroy tension of surface )5.Bad blade material6.Screen cleaning not complete 7.Use time overpasses Pot life after mixing deadline 1、检查前处理线确认吹干烘干段之作业条件2、检查前处理各段是否合乎制程标准（水膜测试、粘尘测试）3、更新使用油墨并确认油墨混合参数4、清洗网版刮刀等使用工具1.Check pre-treatment line to make su
32、re work condition of dry and bake segment 2.Check pre-treatment each segment for measuring up to standard of procedure (water film test, adhesive dust test ) 3.Renew ink and ensure mixing parameter4.Clean screen, blade and other tools 二、显影不净Development Not clean 欲显影掉之区域（防焊爆光时底片黑色或棕色区域）之油墨无法完全清除The i
33、nk of area Inclining to develop can not fully clean (film black and brown area during exposure ) 1、预烤过度2、烤箱排风运风不良3、油墨过期4、油墨混合错误5、预烤后停滞时间太久、预烤不足6、环境不良（湿气太重；温度太高）7、作业区光线非防UV灯管8、曝光能量太高、曝光后停滞时间过长9、显影温度太低10、显影压力太小11、显影能力不足12、显影时间太短13、底片遮光率太低14、油墨不良感光度太高15、稀释剂含杂质过高16、板面有机污染1.Excessive pre-baking 2.Oven ha
34、s worse ventilation 3.Overpass ink shelf life 4.Ink mixing takes mistake 5.Hold for a long time after pre-baking ,not enough pre-baking 6.Bad environment(excessive humidity and temperature )7.Non UV protective lamp in workshop 8.Over much exposure energy,over long time holding after exposure 9.Devel
35、opment temperature is too low 10.Development pressure is too small 11.Development energy is not enough 12.Development time is too short 13.Film lightproof ratio is too low 14.Bad photosensitivity of ink is too high 15.Ample impurity exists in diluent 16.There is organic contaminant on board 1、混合前确认油
36、墨生产批号状况2、确认烘烤条件及烤箱分布升温曲线3、确认周边作业环境及设备4、确认曝光作业参数5、确认显影作业参数6、更换底片7、控制各工序之停滞时间8、修改油墨性质9、使用原厂稀释剂10、重新清洁板面1.Ensure ink production batch number state before mixing 2.Make sure baking condition and oven distributed temperature curve 3.Ensure work enviroment and equipment 4.Ensure exposure parameter 5.Ensur
37、e development parameter 6.Change film 7.Control holding time of each process 8.Change ink properties 9.Adopt diluent from initial factory 10.Clean board surface again 常见问题现 象可能原因对 策 三、喷锡后油墨剥离Ink peel After HAL 铜面区或线路区之防焊边在喷锡后防焊与铜面分离Solder separate from copper surface after HAL of solder side in copp
38、er district or circuit distric 1、油墨印刷过薄耐热性不足2、曝光能量不够3、前处理不良4、前处理后停滞过久而使作业板氧化5、烘烤不足6、多次喷锡或喷锡锡温过高7、浸泡松香水过久8、松香水攻击力过强9、显影过度10、油墨附着力不良1.Ink prints thinner so that resistance to heat isnt enough 2.Exposure energy is not enough 3.Bad pre-treatment 4.Hold for a long time after pre-treatment so as to oxidiz
39、e board 5.Not completely baking 6.Frequently HAL or ample high HAL temperature 7.Saturated in FLUX solution for a long time 8.FLUX attack severely 9.Excessive development 10.Bad ink adhesion 1、调整丝印各参数2、检查前处理线确认是否合乎制程标准品质3、降低前处理后作业板停滞时间4、确认曝光显影条件5、确认后烘烤条件6、确认喷锡参数及作业条件7、更换松香水8、修改油墨特性1.Adjust screen pa
40、rameter 2.Check pre-treatment line for measuring up to standard of procedure 3.Decrease holding time between pre-treatment and rear work 4.Ensure exposure and development condition 5.Ensure post cured condition 6.Ensure HAL parameter and work condition 7.Change FLUX solution 8.Revise ink properties
41、四、塞孔孔缘空泡 Hole vacuole after HAL via-hole Of taphole 喷锡后塞孔边缘起泡Printing ink ishole vacuole after HAL via-hole of taphole1、多次喷锡2、锡温过高3、后烘烤不足4、前处理不良（孔内水渍油渍残留）5、板面粗糙度不足（刷磨不良、蚀刻速度不足）6、塞孔过饱7、区段性升温低温段时间不足8、油墨膨胀系数过大油墨附着不良1.HAL many times 2.Tin temperature is too high 3.Post-cure is insufficient 4.Bad pre-tre
42、atment (water -damaged grease stains is remained in hole )5.Pan roughness is insufficient (bad brush and burnish , etching velocity is insufficient )6.Taphole is too full 7.Sectors temperature elevation, low temperatue section time is insufficient 8.Printing ink expansion coeffecient is oversized, p
43、rinting ink attach is not good 1、确认喷锡作业参数2、确认后烘烤作业参数3、检查前处理线确认是否合乎制程标准品质4、修改塞孔方法5、修改油墨性质1.Confirm parameter of HAL work 2.Confirm post cured work parameter 3.Inspect pre-treatment process ine to confirm whether it conforms with standard quality.4.Revise taphole methods5.Revise ink properties 五、大铜面空泡Big copper Surface vacuole 1、大铜面上油墨全覆盖区油墨与铜面分离On the big copper surface, printing ink and the copper surface is s