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1、BROAD TECHOLOGY INC.,BROAD TECHOLOGY INC.,印制电路板（PCB）制作流程,),深圳市博敏电子有限公司,一、多层板内层制作流程,二、多层板外层制作流程,三、外形制作和成品检查流程,BROAD TECHOLOGY INC.,BROAD TECHOLOGY INC.,附件：典型多层板制作流程,1.内层开料,2. 内层线路压膜,BROAD TECHOLOGY INC.,BROAD TECHOLOGY INC.,4.内层线路显影,3.内层线路曝光,BROAD TECHOLOGY INC.,BROAD TECHOLOGY INC.,5.内层线路蚀刻,6.内层线路去膜
2、,BROAD TECHOLOGY INC.,BROAD TECHOLOGY INC.,7.叠板,8.层压,BROAD TECHOLOGY INC.,BROAD TECHOLOGY INC.,9.钻孔,10.孔金属化,BROAD TECHOLOGY INC.,BROAD TECHOLOGY INC.,11.外层线路压膜,12.外层线路曝光,BROAD TECHOLOGY INC.,BROAD TECHOLOGY INC.,13.外层线路显影,14.图形电镀铜/锡,BROAD TECHOLOGY INC.,BROAD TECHOLOGY INC.,15.外层去膜,16. 外层蚀刻铜,BROAD T
3、ECHOLOGY INC.,BROAD TECHOLOGY INC.,17. 退锡,18. 阻焊印制,BROAD TECHOLOGY INC.,BROAD TECHOLOGY INC.,19. 浸金或热风整平,BROAD TECHOLOGY INC.,BROAD TECHOLOGY INC.,四、PCB各制程物料消耗,1、下料裁板,物料消耗：,2、拼板废弃的覆铜板,1、成品加工板料消耗,BROAD TECHOLOGY INC.,BROAD TECHOLOGY INC.,2、内层图形转移,物料消耗：,1、干膜或湿膜（光致油墨）,BROAD TECHOLOGY INC.,BROAD TECHOLO
4、GY INC.,3、曝光,物料消耗：,曝光后,1、菲林,2、UV灯管,BROAD TECHOLOGY INC.,BROAD TECHOLOGY INC.,4、内层显影,物料消耗：,1、显影液（碳酸钾等）,BROAD TECHOLOGY INC.,BROAD TECHOLOGY INC.,5、内层蚀刻,物料消耗：,1、蚀刻液,2、蚀刻含铜废液,BROAD TECHOLOGY INC.,BROAD TECHOLOGY INC.,6、去膜,物料消耗：,1、NaOH,BROAD TECHOLOGY INC.,BROAD TECHOLOGY INC.,7、黑化/棕化处理,物料消耗：,1、,BROAD T
5、ECHOLOGY INC.,BROAD TECHOLOGY INC.,8、叠板和层压,物料消耗：,1、半固化片（PP料）,2、层压垫纸（垫膜）,3、边/废料（PP料和垫膜等）,BROAD TECHOLOGY INC.,BROAD TECHOLOGY INC.,10、钻孔,物料消耗：,1、钻咀,2、铝板,3、垫板,BROAD TECHOLOGY INC.,BROAD TECHOLOGY INC.,11、孔金属化与全板镀铜,物料消耗：,1、凹蚀（除胶渣）液,2、整孔剂,3、中和剂、预浸剂,4、活化剂、加速剂,5、沉铜液,6、镀铜液,7、废槽液的回收,BROAD TECHOLOGY INC.,BRO
6、AD TECHOLOGY INC.,12、外层图形转移,物料消耗：,1、干膜或湿膜（光致油墨）,2、网版,3、胶带及校正纸张,BROAD TECHOLOGY INC.,BROAD TECHOLOGY INC.,物料消耗：,13、外层曝光,曝光后,1、黄/黑菲林,2、UV灯管,BROAD TECHOLOGY INC.,BROAD TECHOLOGY INC.,14、外层显影,物料消耗：,1、显影液（碳酸钾等）,BROAD TECHOLOGY INC.,BROAD TECHOLOGY INC.,物料消耗：,15、图形电镀铜/锡,1、除油剂,2、粗化液,3、镀铜液,4、镀锡液,5、铜球和锡条,6、添
7、加剂,BROAD TECHOLOGY INC.,BROAD TECHOLOGY INC.,物料消耗：,16、去膜,1、NaOH,BROAD TECHOLOGY INC.,BROAD TECHOLOGY INC.,物料消耗：,17、外层蚀刻铜,1、蚀刻液,2、蚀刻含铜废液,BROAD TECHOLOGY INC.,BROAD TECHOLOGY INC.,物料消耗：,18、退锡,1、退锡液,BROAD TECHOLOGY INC.,BROAD TECHOLOGY INC.,物料消耗：,19、阻焊印制,1、阻焊绿油,2、网版,3、胶带及校正纸张,BROAD TECHOLOGY INC.,BROAD
8、 TECHOLOGY INC.,物料消耗：,20、阻焊曝光,1、菲林,2、UV灯管,BROAD TECHOLOGY INC.,BROAD TECHOLOGY INC.,物料消耗：,21、阻焊显影,1、显影液（碳酸钾等）,BROAD TECHOLOGY INC.,BROAD TECHOLOGY INC.,物料消耗：,22、字符的印制,1、字符油墨,2、网版,BROAD TECHOLOGY INC.,BROAD TECHOLOGY INC.,物料消耗：,23、表面涂覆（OSP）,1、除油剂,2、粗化液,3、OSP溶液,BROAD TECHOLOGY INC.,BROAD TECHOLOGY INC.,制作：博敏R&D,END,BROAD TECHOLOGY INC.,BROAD TECHOLOGY INC.,