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1、1,2,Overview Presentation Hipims+ by Hauzer,Why High Power sputter technology Hipims vs. Hipims+ Coatings: TiAlN, Cr2N Machine integration in Flexicoat,3,Plasma technology with high % of the material to be deposited is ionized. Gaining control over stress - Control microstructure/texture To create d
2、efect free coatings with good adhesion. To make coatings for tool and tribo applications which outperform arc deposited coatings To reduce thermal load of substrate To increase deposition rate of sputtering process,Why High power pulse sputtering?,4,Capacitor discharge Peak pulse powers from kW to M
3、W Low frequency (duty cycle) Pulse energy and voltage can be defined Pulse shape is determined by system configuration Cabling Pressure Sputtering atmosphere Magnetron design,Concept behind HIPIMS Technology,5,HIPIMS Plasma composition in ArN2,Sum of Ar+Ar+Ti+Ti+N+N+=100%,Ratio of N+ to N2+ is signi
4、ficantly higher in a HIPIMS discharge than in (pulsed) DC discharge. More reactive N species.,6,HIPIMS TiAlN Experiment,Experiment overview Sample: polished M2 HSS Target: 50/50 at% AlTi Dep. Temp.: 450-520oC Film thickness: 2-3m Full load in chamber, Three fold rotation,7,2D1H95 HIPIMS -95V bias,2D
5、1H75 HIPIMS -75V bias,A70 Arc -70V bias,Results - Roughness,AFM 30 x30m,Significant improvement in surface roughness, ,8,Results - Roughness,Roughness data,9,Ion energy, ,2D1H75V HIPIMS -75V,2D1H95 HIPIMS -95V,Results - Morphology,AFM 2x2m,Increase in ion energy (higher bias) with constant ion flux
6、leads to densification of coating Columns coalesce to reduce number of boundaries Resputtering of film evident at growing surface,10,Results Hardness and E modulus,Hardness increases with increasing bias or addition of HIPIMS Cathodes.,No definite trend for E modulus possible differences due to chan
7、ges in Microstructure.,11,Results Scratch test,Ti etched,Critical loads for HIPIMS etched samples close to those for arc etched Samples.,No apparent difference In adhesion with respect to etching material.,12,Conclusions HIPIMS TiAlN,It is possible to create AlTiN coatings by HIPIMS deposition with
8、material properties similar to those deposited by cathodic arc similar hardness and E modulus. HIPIMS deposited coatings show some promising benefits as compared to arc deposited coatings lower roughness HIPIMS etching produces comparable adhesion values as compared to metal ion etching from an arc
9、source for both Ti and AlTi targets. HIPIMS technology is industrially feasible.,13,Modulated Pulse Power - MPP High power pulse magnetron sputtering technique Heart of technology is Multi-step DC pulse Voltage rise time control is key to enabling a long, stable, and high power pulse discharge Pulse
10、s widths of 200 sec up to 1.5 msec HIPIMS+ by Hauzer provides: Control of the gas to metal ion ratio Increased deposition rate (higher than HIPIMS) Improved target utilization Smooth, very good adhering hard coatings for tool and tribo applications.,Hipims+ Technology Integrated MPP Technology,14,HI
11、PIMS vs. HIPIMS+,15,Integrated MPP Technology - Modulated Pulse Power Multi-step voltage pulse First step ignition of low power discharge Second step low power discharge Third step transient stage from low power discharge to high power discharge Fourth step high power discharge,HIPIMS+ Technology,16
12、,Hipims+ Pulse,17,Hipims+ Pulsing possibilities,18,Provide an additional constant voltage power supply, which can supply the required peak current at the required constant voltage. (Arc handling) Simple Solution: use capacitor as additional CV-power supply. Hauzer Patent: electronic switching for a
13、fast interruption of the arc current, capable to handle the current of the capacitor discharge circuit.,Without capacitor,Hipims+ Bias issues,19,Flexicoat 1000,Table dia = 650mm Coating zone height = 650mm Full load Coating temperature = 520C Target composition 50/50 at% Ti+ etching CARC cathodes Ar
14、+ etching plasma source,HIPIMS+ TiAlN,20,Ti+ ion etching (arc) + DC sputter Ti+ ion etching (arc) + Arc Ti+ ion etching (arc) + HIPIMS+ Ar+ etching + HIPIMS+,HIPIMS+ TiAlN experiment overview,21,HIPIMS+ Scratch summary,Arc etch + UBM,Arc etch + HIPIMS+,Arc etch + Arc,Ar etch + HIPIMS+,80N,100N,100N,
15、100N,HVPL (20mN) 3415 S = 4.08 m Ra = 0.050 m,HVPL (20mN) 3311 S = 3.52 m Ra = 0.143 m,HVPL (20mN) 3150 S = 2.75 m Ra = 0.143 m,HVPL (20mN) 2874 S = 4.00 m Ra = 0.101 m,22,TiAlN,Deposition rate normalized to one bank (4xCARC) of arc sources Average power for UBM and Hipims+ = 10kW,23,TiAlN HIPIMS+ c
16、onclusions,Dense coatings with dense microstructure similar to arc coatings can be produced with HIPIMS+ technology. Adhesion is comparable to arc coatings (Argon etching and HIPIMS+ for coating). Ra value 2 to 3 times better than Arc (smooth coating) Comparable deposition rate to arc (14 kW). Coati
17、ng has been found to outperform OEM benchmark for stainless milling by 30%.,24,HIPIMS+ Cr2N,Harder and more wear resistant than CrN Has better oil wettability than CrN lower friction Tool Moulding dies Forming tools Low temperature coatings 250C Temperature sensitive steels Plastics Aim of Hipims+ c
18、oatings Lower temperature deposition less thermal loading More control over stress and microstructure No post treatment needed as compared to arc coatings,25,HIPIMS+ Cr2N Microstructure,26,Hardness vs Peak Power Density,27,Cr2N Comparison of Hipims+ and closed field UBM sputtering,Thermal loading wi
19、th Hipims+ technology is lower than for DC can have higher deposition rate with Hipims+ Target utilization is poor for high UBM coil currents Full face erosion with HIPIMS+ deposition,Tsubstrate =250C,28,Conclusions Cr2N HIPIMS+,Relatively low loss of deposition rate as peak power density increases.
20、 Low temperature coating can be deposited. Eliminate post treatment after coating. Suspect that increase in metal ion/neutral ratio is responsible for refinement of microstructure at constant bias voltage It is possible to tailor film stress.,29,Industrial requirements,30,Conclusions,HIPIMS+ technol
21、ogy is available and has been integrated into Hauzer Flexicoat 1000 and Flexicoat 850. Hauzer is currently developing HIPIMS+ technology as an industrial solution for producing superior hard coatings. As a result of the increased ionization in the HIPIMS+ process, the process window is wide for depo
22、sition of hard coatings, such as TiAlN and CrN. Even at low deposition temperatures, industrially viable coatings can be produced. HIPIMS+ technology can be used for commercial applications, such as Cr2N. For such an application, it has been found that that the coating time for such a coating can be reduced by 33% due to reduced thermal loading. HIPIMS+ deposited TiAlN has outperformed a major OEM benchmark for stainless steel milling. HIPIMS+ technology is commercialy available for the Flexicoat 850, 1000 and 1200 machines.,31,Hauzer Techno Coating (HQ Venlo NL),Thank you for your attention,